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1. 发明申请

US20050089594A1 Molding appartus with a molding flowability sensor for packaging semiconductor device 有权
标题翻译：具有用于包装半导体器件的成型流动性传感器的成型配件
公开(公告)号：US20050089594A1
公开(公告)日：2005-04-28
申请号：US10901039
申请日：2004-07-29
申请人： Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
发明人： Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
IPC分类号： B29C45/14 , B29C45/76
CPC分类号： B29C45/7646 , B29C45/14639 , B29C2945/76056 , B29C2945/76063 , B29C2945/7626
摘要： A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a molding flowability sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates a mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the molding flowability sensor for measuring the molding flowability of the instant molding flow at the mold-cavity surface of the mold cavity is provided at the mold-cavity surface of the mold cavity.
摘要翻译：成型装置主要包括模具支架，模具追踪器，加热器和成型流动性传感器。模具追逐包括模腔和通孔，其中所述通孔穿过模腔的模腔表面。模具追逐由模具夹持器容纳，并且设置有用于加热模具追加的加热器。并且用于测量模腔的模腔表面处的即时成型流的成型流动性的成型流动性传感器设置在模腔的模腔表面。

2. 发明授权

US07144239B2 Molding apparatus with a molding flowability sensor for packaging semiconductor device 有权
标题翻译：具有用于封装半导体器件的成型流动性传感器的成型装置
公开(公告)号：US07144239B2
公开(公告)日：2006-12-05
申请号：US10901039
申请日：2004-07-29
申请人： Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
发明人： Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
IPC分类号： B29C45/77
CPC分类号： B29C45/7646 , B29C45/14639 , B29C2945/76056 , B29C2945/76063 , B29C2945/7626
摘要： A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a molding flowability sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates a mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the molding flowability sensor for measuring the molding flowability of the instant molding flow at the mold-cavity surface of the mold cavity is provided at the mold-cavity surface of the mold cavity.
摘要翻译：成型装置主要包括模具支架，模具追踪器，加热器和成型流动性传感器。模具追逐包括模腔和通孔，其中所述通孔穿过模腔的模腔表面。模具追逐由模具夹持器容纳，并且设置有用于加热模具追加的加热器。并且用于测量模腔的模腔表面处的即时成型流的成型流动性的成型流动性传感器设置在模腔的模腔表面。

3. 发明申请

US20050089593A1 Molding apparatus with a pressure sensor for packaging semiconductor device 审中-公开
标题翻译：具有用于封装半导体器件的压力传感器的成型装置
公开(公告)号：US20050089593A1
公开(公告)日：2005-04-28
申请号：US10876609
申请日：2004-06-28
申请人： Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
发明人： Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
IPC分类号： B29C45/14 , B29C45/40 , B29C45/76 , B29C45/77 , B29C70/72
CPC分类号： B29C45/401 , B29C45/14639 , B29C45/7646 , B29C45/77 , B29C2945/76006 , B29C2945/76244 , B29C2945/7626
摘要： A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a pressure sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates the mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the pressure sensor for measuring the viscosity of the instant molding flow at the mold-cavity surface of the mold cavity is provided in the via of the mold chase.
摘要翻译：成型装置主要包括模具支架，模具追加器，加热器和压力传感器。模具包括模具腔和通孔，其中通孔穿过模腔的模腔表面。模具追逐由模具夹持器容纳，并且设置有用于加热模具追加的加热器。并且用于测量在模腔的模腔表面处的即时成型流的粘度的压力传感器设置在模具追踪的通孔中。

4. 发明申请

US20080014297A1 System for supplying molding compounds 审中-公开
标题翻译：用于提供成型化合物的系统
公开(公告)号：US20080014297A1
公开(公告)日：2008-01-17
申请号：US11645696
申请日：2006-12-27
申请人： Yun-Lung Chang , Yu-Chang Tsai , Ming-Wei Sun
发明人： Yun-Lung Chang , Yu-Chang Tsai , Ming-Wei Sun
IPC分类号： B29C71/00
CPC分类号： B29C31/06
摘要： A system for supplying molding compounds comprising: a barrel, having a plurality of storage holes for storing a plurality of molding compounds; a first push rod below the barrel pushing the plurality of molding compounds within the storage holes; a holder above the barrel holding the molding compounds pushed by the first push rod; a carrier having a plurality of placing holes for the holder putting the plurality of molding compounds, wherein the holder moves to a predetermined position after putting the molding compounds; and a second push rod below the predetermined position pushing the molding compounds located in the placing holes, and then the holder holding the molding compounds and transporting to a mold.
摘要翻译：一种用于提供成型化合物的系统，包括：桶，具有用于储存多个模塑料的多个储存孔; 在所述桶下方的第一推杆将所述多个模制化合物推向所述存储孔内; 在所述桶上方的保持由所述第一推杆推动的模制化合物的保持器; 具有多个用于保持器的放置多个成型化合物的放置孔的载体，其中保持器在放置模塑料之后移动到预定位置; 以及在预定位置下方的第二推杆推动位于放置孔中的模塑料，然后将保持模塑料的支架运送到模具。

5. 发明申请

US20080088028A1 Substrate and manufacturing method of package structure 有权
标题翻译：包装结构的基板和制造方法
公开(公告)号：US20080088028A1
公开(公告)日：2008-04-17
申请号：US11790030
申请日：2007-04-23
申请人： Yun-Lung Chang , Ming-Wei Sun
发明人： Yun-Lung Chang , Ming-Wei Sun
IPC分类号： H01L23/488 , H01L21/58
CPC分类号： H05K3/0052 , H01L23/3121 , H01L23/562 , H01L24/81 , H01L24/85 , H01L24/97 , H01L2224/16 , H01L2224/81801 , H01L2224/85 , H01L2924/00014 , H01L2924/01033 , H05K3/242 , H05K3/28 , H05K2201/09036 , H05K2201/0909 , H05K2201/0989 , H05K2203/175 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A substrate board and a manufacturing method of a package structure are provided. The substrate board includes a first surface, a die-attaching area, a cutting area, a plurality of first pads and a first solder mask. The die-attaching area for attaching a die is located on the first surface. The first pads are disposed on the first surface. The first solder mask is partially disposed on the first surface to expose part of the cutting area and the first pads. The first solder mask is divided into a first inner solder mask and a first outer solder mask via the cutting area. The die-attaching area and the first pads are located in the first inner solder mask. Wherein, part of the first mask is located on the cutting area for connecting the first inner solder mask and the first outer solder mask.
摘要翻译：提供了一种基板和一种封装结构的制造方法。基板包括第一表面，管芯附着区域，切割区域，多个第一焊盘和第一焊接掩模。用于附接模具的模具附接区域位于第一表面上。第一焊盘设置在第一表面上。第一焊接掩模部分地设置在第一表面上以暴露部分切割区域和第一焊盘。第一焊接掩模经由切割区域分成第一内部焊料掩模和第一外部焊料掩模。管芯附着区域和第一焊盘位于第一内部焊接掩模中。其中，第一掩模的一部分位于用于连接第一内部焊料掩模和第一外部焊料掩模的切割区域上。

6. 发明授权

US08049337B2 Substrate and manufacturing method of package structure 有权
标题翻译：包装结构的基板和制造方法
公开(公告)号：US08049337B2
公开(公告)日：2011-11-01
申请号：US11790030
申请日：2007-04-23
申请人： Yun-Lung Chang , Ming-Wei Sun
发明人： Yun-Lung Chang , Ming-Wei Sun
IPC分类号： H01L23/48
CPC分类号： H05K3/0052 , H01L23/3121 , H01L23/562 , H01L24/81 , H01L24/85 , H01L24/97 , H01L2224/16 , H01L2224/81801 , H01L2224/85 , H01L2924/00014 , H01L2924/01033 , H05K3/242 , H05K3/28 , H05K2201/09036 , H05K2201/0909 , H05K2201/0989 , H05K2203/175 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A substrate board and a manufacturing method of a package structure are provided. The substrate board includes a first surface, a die-attaching area, a cutting area, a plurality of first pads and a first solder mask. The die-attaching area for attaching a die is located on the first surface. The first pads are disposed on the first surface. The first solder mask is partially disposed on the first surface to expose part of the cutting area and the first pads. The first solder mask is divided into a first inner area and a first outer area via the cutting area. The die-attaching area and the first pads are located in the first inner area. Wherein, part of the first mask is located on the cutting area for connecting the first inner area and the first outer area.
摘要翻译：提供了一种基板和一种封装结构的制造方法。基板包括第一表面，管芯附着区域，切割区域，多个第一焊盘和第一焊接掩模。用于附接模具的模具附接区域位于第一表面上。第一焊盘设置在第一表面上。第一焊接掩模部分地设置在第一表面上以暴露部分切割区域和第一焊盘。第一焊接掩模经由切割区域分成第一内部区域和第一外部区域。管芯附着区域和第一焊盘位于第一内部区域中。其中，第一掩模的一部分位于用于连接第一内部区域和第一外部区域的切割区域上。

7. 发明授权

US07604469B2 Degating device 有权
标题翻译：脱钙装置
公开(公告)号：US07604469B2
公开(公告)日：2009-10-20
申请号：US11651004
申请日：2007-01-09
申请人： Yun-Lung Chang , Chin-Sung Lee , Chia-Ming Chang , Yu-Chang Tsai
发明人： Yun-Lung Chang , Chin-Sung Lee , Chia-Ming Chang , Yu-Chang Tsai
IPC分类号： H01L21/56 , B29C45/14
CPC分类号： B29C45/73 , B29C45/14655 , B29C2045/7387
摘要： A degating device applied to remove a cull between two chip carriers comprises a lower mold, an upper mold, a blowing-opening, and a cooling pipe. The lower mold is used to load chip carriers and has a plunger set for propping and degating the cull. The upper mold is fit in with the lower mold tightly. The airflow blown out from the blowing-opening blows to lower the temperature around the chip carriers. The cooling pipe is disposed according to the position of the blowing-opening to cool down the temperature around the blowing-opening. The two chip carriers are disposed on the lower mold and fixed between the upper mold and the lower mold while the upper mold combines with the lower mold. By changing the position of the plunger set relative to the upper mold and the lower mold, the cull can be stripped from the chip carriers.
摘要翻译：用于去除两个芯片载体之间的剔除器的脱胶装置包括下模具，上模具，吹制开口和冷却管。下模用于装载芯片载体，并具有用于支撑和脱模剔除的柱塞。上模与下模紧密配合。从吹风吹出的气流吹动以降低芯片载体周围的温度。冷却管根据吹风口的位置设置，以冷却吹气口周围的温度。两个芯片载体设置在下模具上并固定在上模具和下模具之间，而上模具与下模具组合。通过改变柱塞组件相对于上模具和下模具的位置，可以将芯片从芯片载体剥离。

8. 发明申请

US20080044511A1 Degating device 有权
标题翻译：脱钙装置
公开(公告)号：US20080044511A1
公开(公告)日：2008-02-21
申请号：US11651004
申请日：2007-01-09
申请人： Yun-Lung Chang , Chin-Sung Lee , Chia-Ming Chang , Yu-Chang Tsai
发明人： Yun-Lung Chang , Chin-Sung Lee , Chia-Ming Chang , Yu-Chang Tsai
IPC分类号： B29C45/72
CPC分类号： B29C45/73 , B29C45/14655 , B29C2045/7387
摘要： A degating device applied to remove a cull between two chip carriers comprises a lower mold, an upper mold, a blowing-opening, and a cooling pipe. The lower mold is used to load chip carriers and has a plunger set for propping and degating the cull. The upper mold is fit in with the lower mold tightly. The airflow blown out from the blowing-opening blows to lower the temperature around the chip carriers. The cooling pipe is disposed according to the position of the blowing-opening to cool down the temperature around the blowing-opening. The two chip carriers are disposed on the lower mold and fixed between the upper mold and the lower mold while the upper mold combines with the lower mold. By changing the position of the plunger set relative to the upper mold and the lower mold, the cull can be stripped from the chip carriers.
摘要翻译：用于去除两个芯片载体之间的剔除器的脱胶装置包括下模具，上模具，吹制开口和冷却管。下模用于装载芯片载体，并具有用于支撑和脱模剔除的柱塞。上模与下模紧密配合。从吹风吹出的气流吹动以降低芯片载体周围的温度。冷却管根据吹风口的位置设置，以冷却吹气口周围的温度。两个芯片载体设置在下模具上并固定在上模具和下模具之间，而上模具与下模具组合。通过改变柱塞组件相对于上模具和下模具的位置，可以将芯片从芯片载体剥离。

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