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11. 发明申请

US20070229809A1 Computer-Implemented Methods and Systems for Determining a Configuration for a Light Scattering Inspection System 有权
标题翻译：用于确定光散射检查系统的配置的计算机实现的方法和系统
公开(公告)号：US20070229809A1
公开(公告)日：2007-10-04
申请号：US11278624
申请日：2006-04-04
申请人： Alexander Belyaev , Daniel Kavaldjiev , Amith Murali , Aleksey Petrenko , Mike Kirk , David Shortt , Brian Haas , Kurt Haller
发明人： Alexander Belyaev , Daniel Kavaldjiev , Amith Murali , Aleksey Petrenko , Mike Kirk , David Shortt , Brian Haas , Kurt Haller
IPC分类号： G01N21/88
CPC分类号： G01N21/9501
摘要： Computer-implemented methods and systems for determining a configuration for a light scattering inspection system are provided. One computer-implemented method includes determining a three-dimensional map of signal-to-noise ratio values for data that would be acquired for a specimen and a potential defect on the specimen by the light scattering inspection system across a scattering hemisphere of the inspection system. The method also includes determining one or more portions of the scattering hemisphere in which the signal-to-noise ratio values are higher than in other portions of the scattering hemisphere based on the three-dimensional map. In addition, the method includes determining a configuration for a detection subsystem of the inspection system based on the one or more portions of the scattering hemisphere.
摘要翻译：提供了用于确定光散射检查系统的配置的计算机实现的方法和系统。一种计算机实现的方法包括：通过在检查系统的散射半球上的光散射检查系统来确定用于样本获取的数据和样本上的潜在缺陷的信噪比值的三维图。该方法还包括基于三维图确定散射半球的一个或多个部分，其中信噪比值高于散射半球的其它部分。此外，该方法包括基于散射半球的一个或多个部分来确定检查系统的检测子系统的配置。

12. 发明授权

US08060962B2 Taping knife with hammer 失效
标题翻译：带锤子的编带刀
公开(公告)号：US08060962B2
公开(公告)日：2011-11-22
申请号：US12554907
申请日：2009-09-05
申请人： David Shortt
发明人： David Shortt
IPC分类号： B25D1/00 , B44D3/16
CPC分类号： B25F1/006 , E04F21/161
摘要： A taping tool apparatus having an elongated hammer portion that has a central axis and a striker portion, the striker portion having a striking plane perpendicular to the hammer portion central axis; a blade affixed to the hammer portion so that no part of the blade crosses the striker portion striking plane; and a handle affixed to the elongated hammer portion perpendicular to the central axis, whereby a user applying mud to fill indents in drywall with the taping tool can rotate the apparatus a quarter turn to hammer down any raised nails encountered without the blade striking the drywall.
摘要翻译：一种具有中心轴和撞针部的细长锤部分的攻丝工具装置，所述撞针部具有垂直于所述锤部中心轴线的冲击平面; 固定到锤部分上的刀片，使得刀片的任何部分都不穿过撞针部分打击平面; 以及固定到垂直于中心轴线的细长锤部分的手柄，由此使用泥浆以用胶带工具填充干墙中的凹痕的使用者可以使装置旋转四分之一圈，以锤击在没有叶片撞击干墙的情况下遇到的任何凸起的指甲。

13. 发明申请

US20070132987A1 Systems and methods for inspecting a wafer with increased sensitivity 有权
标题翻译：增加灵敏度检查晶圆的系统和方法
公开(公告)号：US20070132987A1
公开(公告)日：2007-06-14
申请号：US11302936
申请日：2005-12-14
申请人： Kurt Haller , David Shortt , Christian Wolters
发明人： Kurt Haller , David Shortt , Christian Wolters
IPC分类号： G01N21/88
CPC分类号： G01N21/9501
摘要： Systems and methods for inspecting a wafer with increased sensitivity are provided. One system includes an inspection subsystem configured to direct light to a spot on the wafer and to generate output signals responsive to light scattered from the spot on the wafer. The system also includes a gas flow subsystem configured to replace a gas located proximate to the spot on the wafer with a medium that scatters less of the light than the gas thereby increasing the sensitivity of the system. In addition, the system includes a processor configured to detect defects on the wafer using the output signals.
摘要翻译：提供了用于检查具有增加的灵敏度的晶片的系统和方法。一个系统包括检查子系统，该检查子系统被配置为将光引导到晶片上的一个点上，并产生响应于从晶片上的点散射的光的输出信号。该系统还包括气流子系统，该气流子系统被配置成用与气体相比散射的光更少的介质来替代位于晶片上的点附近的气体，从而增加了系统的灵敏度。另外，该系统包括配置成使用输出信号来检测晶片上的缺陷的处理器。

14. 发明申请

US20110056027A1 TAPING KNIFE WITH HAMMER 失效
标题翻译：用锤子切割刀
公开(公告)号：US20110056027A1
公开(公告)日：2011-03-10
申请号：US12554907
申请日：2009-09-05
申请人： David Shortt
发明人： David Shortt
IPC分类号： B25F1/00
CPC分类号： B25F1/006 , E04F21/161
摘要： A taping tool apparatus having an elongated hammer portion that has a central axis and a striker portion, the striker portion having a striking plane perpendicular to the hammer portion central axis; a blade affixed to the hammer portion so that no part of the blade crosses the striker portion striking plane; and a handle affixed to the elongated hammer portion perpendicular to the central axis, whereby a user applying mud to fill indents in drywall with the taping tool can rotate the apparatus a quarter turn to hammer down any raised nails encountered without the blade striking the drywall.
摘要翻译：一种具有中心轴和撞针部的细长锤部分的攻丝工具装置，所述撞针部具有垂直于所述锤部中心轴线的冲击平面; 固定到锤部分上的刀片，使得刀片的任何部分都不穿过撞针部分打击平面; 以及固定到垂直于中心轴线的细长锤部分的手柄，由此使用泥浆以用胶带工具填充干墙中的凹痕的使用者可以使装置旋转四分之一圈，以锤击在没有叶片撞击干墙的情况下遇到的任何凸起的指甲。

15. 发明申请

US20050018183A1 Method and apparatus for determining surface layer thickness using continuous multi-wavelength surface scanning 有权
标题翻译：使用连续多波长表面扫描确定表面层厚度的方法和装置
公开(公告)号：US20050018183A1
公开(公告)日：2005-01-27
申请号：US10754679
申请日：2004-01-09
申请人： David Shortt
发明人： David Shortt
IPC分类号： G01B11/06 , G01B11/30 , G01N21/956 , H01L21/66 , G01N21/00
CPC分类号： G01B11/0633
摘要： An inspection tool includes an illumination element for directing light beams onto a workpiece at differing wavelengths or at differing angles of incidence or combinations thereof. Such beams producing reflected light and scattered light optical signals. A scanning element and optical detector elements are provided. The optical detector elements receive reflected light signals and scattered light signals. Circuitry for receiving the reflected light signals and scattered light signals are used to determine thickness values for partially transmissive layers formed on the workpiece and correct for the effects of the thickness of the partially transmissive layer so that said signals can be used to identify and characterize defects of the workpiece. Moreover, the invention includes descriptions of methods for accomplishing such inspections.
摘要翻译：检查工具包括用于将光束引导到不同波长或不同入射角或其组合的工件上的照明元件。这种光束产生反射光和散射光信号。提供扫描元件和光学检测器元件。光检测器元件接收反射光信号和散射光信号。用于接收反射光信号和散射光信号的电路用于确定在工件上形成的部分透射层的厚度值，并且校正部分透射层的厚度的影响，使得所述信号可用于识别和表征缺陷的工件。此外，本发明包括对完成这种检查的方法的描述。

16. 发明申请

US20090009754A1 SYSTEMS AND METHODS FOR INSPECTING A WAFER WITH INCREASED SENSITIVITY 有权
标题翻译：用于检测具有增强灵敏度的波形的系统和方法
公开(公告)号：US20090009754A1
公开(公告)日：2009-01-08
申请号：US12097172
申请日：2006-12-14
申请人： Kurt L. Haller , David Shortt , Christian Wolters
发明人： Kurt L. Haller , David Shortt , Christian Wolters
IPC分类号： G01N21/88
CPC分类号： G01N21/9501
摘要： One system includes an inspection subsystem configured to direct light to a spot on the wafer and to generate output signals responsive to light scattered from the spot on the wafer. The system also includes a gas flow subsystem configured to replace a gas located proximate to the spot on the wafer with a medium that scatters less of the light than the gas thereby increasing the sensitivity of the system. In addition, the system includes a processor configured to detect defects on the wafer using the output signals.
摘要翻译：一个系统包括检查子系统，该检查子系统被配置为将光引导到晶片上的一个点上，并产生响应于从晶片上的点散射的光的输出信号。该系统还包括气流子系统，该气流子系统被配置成用与气体相比散射的光更少的介质来替代位于晶片上的点附近的气体，从而增加了系统的灵敏度。另外，该系统包括配置成使用输出信号来检测晶片上的缺陷的处理器。

17. 发明申请

US20070081154A1 System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surface 有权
标题翻译：用于进行自适应傅立叶滤波以检测检查表面的密集逻辑区域中的缺陷的系统和方法
公开(公告)号：US20070081154A1
公开(公告)日：2007-04-12
申请号：US11314779
申请日：2005-12-20
申请人： Evan Mapoles , Grace Chen , Christopher Bevis , David Shortt
发明人： Evan Mapoles , Grace Chen , Christopher Bevis , David Shortt
IPC分类号： G01N21/88
CPC分类号： G01N21/95607 , G01N21/47 , G01N21/95623 , G01N2021/8822
摘要： A dark field surface inspection tool and system are disclosed herein. The tool includes an illumination source capable of scanning a light beam onto an inspection surface. Light scattered by each inspection point is captured as image data by a photo detector array arranged at a fourier plane. The images captured are adaptively filtered to remove a portion of the bright pixels from the images to generate filtered images. The filtered images are then analyzed to detect defects in the inspection surface. Methods of the invention include using die-to-die comparison to identify bright portions of scattering patterns and generate unique image filters associated with those patterns. The associated images are then filtered to generate filtered images which are then used to detect defects. Also, data models of light scattering behavior can be used to generate filters.
摘要翻译：本文公开了一种暗场表面检查工具和系统。该工具包括能够将光束扫描到检查表面上的照明源。由每个检查点散射的光通过布置在傅立叶平面上的光检测器阵列捕获为图像数据。捕获的图像被自适应地滤波以从图像中去除一部分亮像素以产生滤波图像。然后分析滤波图像以检测检查表面中的缺陷。本发明的方法包括使用管芯到管芯的比较来识别散射图案的亮部分并且生成与这些图案相关联的独特的图像滤波器。然后将相关联的图像过滤以产生滤波图像，然后将其用于检测缺陷。此外，可以使用光散射行为的数据模型来生成滤波器。

18. 发明申请

US20060232770A1 Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool 有权
公开(公告)号：US20060232770A1
公开(公告)日：2006-10-19
申请号：US11366108
申请日：2006-03-01
申请人： Paul Sullivan , George Kren , Rodney Smedt , Hans Hansen , David Shortt , Daniel Kavaldjiev , Christopher Bevis
发明人： Paul Sullivan , George Kren , Rodney Smedt , Hans Hansen , David Shortt , Daniel Kavaldjiev , Christopher Bevis
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01R31/2656 , G01R31/2831
摘要： A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.

19. 发明申请

US20060082767A1 Darkfield inspection system having a programmable light selection array 有权
公开(公告)号：US20060082767A1
公开(公告)日：2006-04-20
申请号：US11297028
申请日：2005-12-07
申请人： Christopher Bevis , Paul Sullivan , David Shortt , George Kren
发明人： Christopher Bevis , Paul Sullivan , David Shortt , George Kren
IPC分类号： G01N21/88
CPC分类号： G01N21/4738 , G01N21/8806 , G01N2021/8822
摘要： An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes the ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects onto a photosensor which detects the defect signal. Processing circuitry receives the defect signal and conducts surface analysis of the workpiece that can include the characterizing of defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.

20. 发明申请

US20050018179A1 Darkfield inspection system having a programmable light selection array 有权
标题翻译：具有可编程光选择阵列的暗场检查系统
公开(公告)号：US20050018179A1
公开(公告)日：2005-01-27
申请号：US10714257
申请日：2003-11-14
申请人： Christopher Bevis , Paul Sullivan , David Shortt , George Kren
发明人： Christopher Bevis , Paul Sullivan , David Shortt , George Kren
IPC分类号： G01N21/47 , G01N21/88 , G01N21/00
CPC分类号： G01N21/4738 , G01N21/8806 , G01N2021/8822
摘要： An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes the ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects onto a photosensor which detects the defect signal. Processing circuitry receives the defect signal and conducts surface analysis of the workpiece that can include the characterizing of defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.
摘要翻译：检查工具实施例包括用于将光束引导到工件上以产生散射光的照明源，其包括工件的普通散射图案以及从工件的缺陷散射的光。该实施例包括可编程光选择阵列，其接收从工件散射的光并选择性地将从缺陷散射的光引导到检测缺陷信号的光电传感器上。处理电路接收缺陷信号并进行可能包括工件缺陷表征的工件的表面分析。可编程光选择阵列可以包括但不限于反射器阵列和滤波器阵列。本发明还包括相关的表面检查方法。

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