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    • 14. 发明授权
    • Nonvolatile semiconductor device and method of fabricating the same
    • 非易失性半导体器件及其制造方法
    • US07514739B2
    • 2009-04-07
    • US11687942
    • 2007-03-19
    • Young-Sam ParkSeung-Beom YoonJeong-Uk HanSung-Taeg KangSeung-Jin Yang
    • Young-Sam ParkSeung-Beom YoonJeong-Uk HanSung-Taeg KangSeung-Jin Yang
    • H01L29/76H01L29/788
    • H01L29/7854H01L21/28273H01L29/42324H01L29/66553H01L29/66795H01L29/7851H01L29/7853H01L29/7881
    • A stack-type nonvolatile semiconductor device comprises a memory device formed on a substrate including a semiconductor body elongated in one direction, having a cross section perpendicular to a main surface, having a predetermined curvature, a channel region on the semiconductor body along the circumference, a tunneling insulating layer on the channel region, a floating gate on the tunneling insulating layer, insulated from the channel region, a high dielectric constant material layer on the floating gate, a metallic control gate on the high dielectric constant material layer, insulated from the floating gate, and source and drain regions adjacent to the metallic control gate on the semiconductor body, an inter-insulating layer on the memory device, and a conductive layer on the inter-insulating layer, and a memory device formed on the conductive layer including, a semiconductor body elongated in one direction having a cross section perpendicular to a main surface, having a predetermined curvature, a channel region along the circumference of the semiconductor body, a tunneling insulating layer on the channel region, a floating gate on the tunneling insulating layer, electrically insulated from the channel region, a high dielectric constant material layer on the floating gate, a metallic control gate on the high dielectric constant material layer, insulated from the floating gate, and source and drain regions adjacent to the metallic control gate.
    • 堆叠型非易失性半导体器件包括:形成在基板上的存储器件,该存储器件包括在一个方向上延伸的半导体本体,具有垂直于主表面的横截面,具有预定曲率,半导体本体上沿着圆周的沟道区域, 沟道区域上的隧道绝缘层,与沟道区绝缘的隧道绝缘层上的浮动栅极,浮置栅极上的高介电常数材料层,高介电常数材料层上的金属控制栅极,绝缘层 浮置栅极,与半导体主体上的金属控制栅极相邻的源极和漏极区域,存储器件上的绝缘层和绝缘层上的导电层,以及形成在导电层上的存储器件,包括 具有垂直于主表面的横截面在一个方向上延伸的半导体本体,具有预制件 沿着半导体本体的圆周的通道区域,沟道区域上的隧道绝缘层,隧道绝缘层上的浮动栅极,与沟道区电绝缘,浮置栅极上的高介电常数材料层, 在高介电常数材料层上的金属控制栅极,与浮动栅极绝缘,以及与金属控制栅极相邻的源极和漏极区域。
    • 15. 发明申请
    • NONVOLATILE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    • 非挥发性半导体器件及其制造方法
    • US20070164344A1
    • 2007-07-19
    • US11687942
    • 2007-03-19
    • Young-Sam ParkSeung-Beom YoonJeong-Uk HanSung-Taeg KangSeung-Jin Yang
    • Young-Sam ParkSeung-Beom YoonJeong-Uk HanSung-Taeg KangSeung-Jin Yang
    • H01L29/76
    • H01L29/7854H01L21/28273H01L29/42324H01L29/66553H01L29/66795H01L29/7851H01L29/7853H01L29/7881
    • A stack-type nonvolatile semiconductor device comprises a memory device formed on a substrate including a semiconductor body elongated in one direction, having a cross section perpendicular to a main surface, having a predetermined curvature, a channel region on the semiconductor body along the circumference, a tunneling insulating layer on the channel region, a floating gate on the tunneling insulating layer, insulated from the channel region, a high dielectric constant material layer on the floating gate, a metallic control gate on the high dielectric constant material layer, insulated from the floating gate, and source and drain regions adjacent to the metallic control gate on the semiconductor body, an inter-insulating layer on the memory device, and a conductive layer on the inter-insulating layer, and a memory device formed on the conductive layer including, a semiconductor body elongated in one direction having a cross section perpendicular to a main surface, having a predetermined curvature, a channel region along the circumference of the semiconductor body, a tunneling insulating layer on the channel region, a floating gate on the tunneling insulating layer, electrically insulated from the channel region, a high dielectric constant material layer on the floating gate, a metallic control gate on the high dielectric constant material layer, insulated from the floating gate, and source and drain regions adjacent to the metallic control gate.
    • 堆叠型非易失性半导体器件包括:形成在基板上的存储器件,该存储器件包括在一个方向上延伸的半导体本体,具有垂直于主表面的横截面,具有预定曲率,半导体本体上沿着圆周的沟道区域, 沟道区域上的隧道绝缘层,与沟道区绝缘的隧道绝缘层上的浮动栅极,浮置栅极上的高介电常数材料层,高介电常数材料层上的金属控制栅极,绝缘层 浮置栅极,与半导体主体上的金属控制栅极相邻的源极和漏极区域,存储器件上的绝缘层和绝缘层上的导电层,以及形成在导电层上的存储器件,包括 具有垂直于主表面的横截面在一个方向上延伸的半导体本体,具有预制件 沿着半导体本体的圆周的通道区域,沟道区域上的隧道绝缘层,隧道绝缘层上的浮动栅极,与沟道区电绝缘,浮置栅极上的高介电常数材料层, 在高介电常数材料层上的金属控制栅极,与浮动栅极绝缘,以及与金属控制栅极相邻的源极和漏极区域。
    • 18. 发明申请
    • Flash memory device and method of fabricating the same
    • 闪存装置及其制造方法
    • US20080268592A1
    • 2008-10-30
    • US12004698
    • 2007-12-21
    • Weon-Ho ParkJeong-Uk HanYong-Tae Kim
    • Weon-Ho ParkJeong-Uk HanYong-Tae Kim
    • H01L21/8242
    • H01L27/115H01L27/11521H01L29/40114H01L29/66825H01L29/7881
    • Provided are a flash memory device and a method of fabricating the same. The method includes forming a first dielectric layer on an active region of a semiconductor substrate. A first conductive layer is formed on the semiconductor substrate having the first dielectric layer. A mask pattern is formed on the first conductive layer. Using the mask pattern as an etch mask, the first conductive layer is etched to form a first conductive pattern narrowing from its upper surface toward its middle portion. A second dielectric layer is formed on the semiconductor substrate having the first conductive pattern. A second conductive pattern crossing the active region adjacent to the first conductive pattern and partially covering the first conductive pattern is formed on the semiconductor substrate having the second dielectric layer.
    • 提供一种闪速存储器件及其制造方法。 该方法包括在半导体衬底的有源区上形成第一电介质层。 在具有第一介电层的半导体衬底上形成第一导电层。 在第一导电层上形成掩模图案。 使用掩模图案作为蚀刻掩模,蚀刻第一导电层以形成从其上表面向其中间部分变窄的第一导电图案。 在具有第一导电图案的半导体衬底上形成第二电介质层。 在具有第二介电层的半导体衬底上形成与第一导电图案相邻的有源区域交叉并部分覆盖第一导电图案的第二导电图案。
    • 19. 发明申请
    • Nonvolatile memory devices, methods of operating the same and methods of forming the same
    • 非易失存储器件,其操作方法及其形成方法
    • US20080111181A1
    • 2008-05-15
    • US11982036
    • 2007-11-01
    • Weon-Ho ParkJeong-Uk HanYong-Tae Kim
    • Weon-Ho ParkJeong-Uk HanYong-Tae Kim
    • H01L29/788H01L21/336
    • H01L29/7883G11C16/0441H01L29/40114H01L29/42328H01L29/66825
    • A nonvolatile memory (NVM) device includes a floating gate on a semiconductor substrate and a gate insulating layer between the semiconductor substrate and the floating gate. A tunnel insulating layer is disposed between the semiconductor substrate and the floating gate. The tunnel insulating layer is thinner than the gate insulating layer. A first inter-gate insulating layer is disposed on the floating gate, and a sensing gate is disposed on the first inter-gate insulating layer. The sensing gate covers a first portion of the floating gate. A control gate is disposed to cover a top surface and a sidewall of a second portion of the floating gate. A second inter-gate insulating layer is disposed between the control gate and the sensing gate and between the control gate and the floating gate. Operation methods and fabrication methods of the NVM device are also provided.
    • 非易失性存储器(NVM)器件包括半导体衬底上的浮置栅极和半导体衬底与浮置栅极之间的栅极绝缘层。 隧道绝缘层设置在半导体衬底和浮动栅极之间。 隧道绝缘层比栅极绝缘层薄。 第一栅极间绝缘层设置在浮置栅极上,感测栅极设置在第一栅极间绝缘层上。 感测门覆盖浮动栅极的第一部分。 控制门设置成覆盖浮动栅极的第二部分的顶表面和侧壁。 第二栅极间绝缘层设置在控制栅极和感测栅极之间以及控制栅极和浮动栅极之间。 还提供了NVM设备的操作方法和制造方法。