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    • 12. 发明授权
    • Synchronous pulse plasma etching equipment and method of fabricating a semiconductor device
    • 同步脉冲等离子体蚀刻设备及制造半导体器件的方法
    • US08460508B2
    • 2013-06-11
    • US12591602
    • 2009-11-24
    • Ken TokashikiHong ChoJeong-Dong Choe
    • Ken TokashikiHong ChoJeong-Dong Choe
    • H01L21/3065H01L21/302C23C16/00C23C16/50C23C16/52
    • H01J37/32165H01J37/32082H01J37/32174
    • Synchronous pulse plasma etching equipment includes a first electrode and one or more second electrodes configured to generate plasma in a plasma etching chamber. A first radio frequency power output unit is configured to apply a first radio frequency power having a first frequency and a first duty ratio to the first electrode, and to output a control signal including information about a phase of the first radio frequency power. At least one second radio frequency power output unit is configured to apply a second radio frequency power having a second frequency and a second duty ratio to a corresponding second electrode among the second electrodes. The second radio frequency power output unit is configured to control the second radio frequency power to be synchronized with the first radio frequency power or to have a phase difference from the first radio frequency power in response to the control signal.
    • 同步脉冲等离子体蚀刻设备包括第一电极和被配置为在等离子体蚀刻室中产生等离子体的一个或多个第二电极。 第一射频功率输出单元被配置为向第一电极施加具有第一频率和第一占空比的第一射频功率,并且输出包括关于第一射频功率的相位的信息的控制信号。 至少一个第二射频功率输出单元被配置为将具有第二频率和第二占空比的第二射频功率应用于第二电极中的对应的第二电极。 第二射频功率输出单元被配置为响应于控制信号控制与第一射频功率同步的第二射频功率或者与第一射频功率相位差。