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11. 发明授权

US08340420B2 Method for recognizing objects in images 有权
标题翻译：识别图像中物体的方法
公开(公告)号：US08340420B2
公开(公告)日：2012-12-25
申请号：US12573556
申请日：2009-10-05
申请人： Gregory C. Smith , Shana S. Smith
发明人： Gregory C. Smith , Shana S. Smith
IPC分类号： G06K9/00 , G06K9/34
CPC分类号： G06K9/4647 , G06K9/00818
摘要： A method for recognizing objects in images is disclosed. The method of the present invention comprises the following steps. First, acquire a digital image. Then, select one or more objects from the image according to a certain characteristic. Next, generate an x-axis histogram and/or a y-axis histogram from the segmented image. Then, find the zeroes and maxima for the x-axis histogram and/or the y-axis histogram and use the polynomial regression analysis to determine the shape, shape and location of each of the objects in the segmented image according to the zeroes and maxima. If the two curves linking two zeroes and one maximum in the x-axis histogram and the y-axis histogram are two sloped line, the corresponding object may be determined to be a triangle. If each of the four curves linking two zeroes and two maxima is a line, the corresponding object may be determined to be a rectangle.
摘要翻译：公开了一种用于识别图像中的对象的方法。本发明的方法包括以下步骤。首先，获取数字图像。然后，根据某一特性从图像中选择一个或多个对象。接下来，从分割图像生成x轴直方图和/或y轴直方图。然后，找到x轴直方图和/或y轴直方图的零点和最大值，并使用多项式回归分析根据零点和最大值确定分割图像中每个对象的形状，形状和位置。如果在x轴直方图和y轴直方图中连接两个零和一个最大值的两条曲线是两条倾斜线，则可以将相应的对象确定为三角形。如果链接两个零和两个最大值的四个曲线中的每一个是一行，则相应的对象可以被确定为矩形。

12. 发明授权

US07855139B2 Systems and methods for controlling the effective dielectric constant of materials used in a semiconductor device 失效
标题翻译：用于控制在半导体器件中使用的材料的有效介电常数的系统和方法
公开(公告)号：US07855139B2
公开(公告)日：2010-12-21
申请号：US11754845
申请日：2007-05-29
申请人： Gregory C. Smith
发明人： Gregory C. Smith
IPC分类号： H01L21/4763
CPC分类号： H01L21/7682 , H01L21/76834
摘要： Systems and methods for controlling the effective dielectric constant of materials used in a semiconductor device are shown and described. In one embodiment, a method comprises providing a semiconductor substrate with a plurality of pillars formed thereon, depositing a first layer of dielectric material over a plurality of pillars, removing a portion of the first layer deposited over the plurality of pillars, and depositing a second layer of dielectric material over the plurality of pillars, where the second layer leaves a plurality of voids between the plurality of pillars.
摘要翻译：显示和描述了用于控制半导体器件中使用的材料的有效介电常数的系统和方法。在一个实施例中，一种方法包括提供半导体衬底，其上形成有多个柱，在多个柱上沉积介电材料的第一层，去除沉积在多个柱上的第一层的一部分，以及沉积第二层电介质材料层在多个柱上，其中第二层在多个柱之间留下多个空隙。

13. 发明授权

US6127730A Composite metal films for severe topology interconnects 失效
标题翻译：用于严重拓扑互连的复合金属薄膜
公开(公告)号：US6127730A
公开(公告)日：2000-10-03
申请号：US26918
申请日：1993-03-05
申请人： Gregory C. Smith
发明人： Gregory C. Smith
IPC分类号： H01L21/768 , H01L23/522 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/76879 , H01L23/5226 , H01L2924/0002
摘要： A process for forming a smooth conformal refractory metal film on an insulating layer having a via formed therein. This process provides extremely good planarity and step coverage when used to form contacts in semiconductor circuits and, in addition, offers improved wafer alignment capability as well as enhanced reliability which result from the smooth surface morphology. The process includes forming contact openings through an insulating layer to a semiconductor substrate; depositing a first blanket layer of titanium using deposition conditions that provide a conformal film that exhibits good step coverage at the contact opening; and forming a second blanket layer of titanium using deposition conditions that provide reduced surface asperity height. The process is ideally suited to forming an electrical interconnection system for semiconductor integrated circuit devices such as static or dynamic random access memories and is particularly useful in VLSI devices that incorporate multiple levels of interconnect.
摘要翻译：在其中形成有通孔的绝缘层上形成平滑的保形难熔金属膜的方法。当用于在半导体电路中形成接触时，该工艺提供了非常好的平面度和阶梯覆盖，并且还提供了改进的晶片对准能力以及由光滑的表面形态产生的增强的可靠性。该工艺包括通过绝缘层形成接触开口到半导体衬底; 使用提供在接触开口处表现出良好的阶梯覆盖的保形膜的沉积条件沉积钛的第一覆盖层; 以及使用提供降低的表面粗糙度高度的沉积条件形成第二层钛层。该方法非常适用于形成诸如静态或动态随机存取存储器的半导体集成电路器件的电互连系统，并且在并入多级互连的VLSI器件中特别有用。

14. 发明授权

US5714804A Semiconductor contact structure in integrated semiconductor devices 失效
标题翻译：集成半导体器件中的半导体接触结构
公开(公告)号：US5714804A
公开(公告)日：1998-02-03
申请号：US749083
申请日：1996-11-14
申请人： Robert O. Miller , Gregory C. Smith
发明人： Robert O. Miller , Gregory C. Smith
IPC分类号： H01L21/28 , H01L21/768 , H01L23/522 , H01L23/532 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/76843 , H01L21/76849 , H01L21/76852 , H01L21/76865 , H01L21/76877 , H01L21/76879 , H01L23/5226 , H01L23/53223 , H01L2924/0002
摘要： An electrical connection structure is provided for protecting a barrier metal layer within a contact opening during the formation of an aluminum interconnection layer overlying a tungsten plugged connection structure. The deposited tungsten plug overlying the barrier metal layer is etched back sufficiently to create a slight recess at the opening. A thin layer of tungsten is then selectively deposited for filling the recess. This layer acts as an etch stop during aluminum interconnection layer formation and protects the underlying barrier metal layer.
摘要翻译：提供一种电连接结构，用于在覆盖钨插入式连接结构的铝互连层的形成期间保护接触开口内的阻挡金属层。覆盖阻挡金属层的沉积钨丝塞被充分回蚀，以在开口处产生轻微的凹陷。然后选择性地沉积薄层的钨以填充凹部。在铝互连层形成期间，该层用作蚀刻停止层并保护下面的阻挡金属层。

15. 发明授权

US4666211A Multi-level transport truck apparatus 失效
标题翻译：多层运输卡车装置
公开(公告)号：US4666211A
公开(公告)日：1987-05-19
申请号：US722444
申请日：1985-04-12
申请人： Gavin C. Smith , Gregory C. Smith , Flynn K. Smith
发明人： Gavin C. Smith , Gregory C. Smith , Flynn K. Smith
IPC分类号： B60P1/28
CPC分类号： B60P1/28
摘要： A multi-level transport truck apparatus, particularly suitable for use with trucks that release contents through rearward tilting of the container portion, having a main container portion divided into at least upper and lower container portions by plate members insertable within u-shaped channels within the main container and defining seperate container spaces. There is further provided rear door members corresponding to each of the container spaces for selectively dumping the contents of each of the spaces depending if the doors are secured or unsecured. Further, there are identification tags on each door member indicating the contents of each container space, with each tag removeable as the contents of the space is changed.
摘要翻译：一种多级运输卡车装置，特别适用于通过容器部分的向后倾斜释放内容物的卡车，其具有通过可插入在U形通道内的板状构件至少分成上部和下部容器部分的主容器部分主容器和定义单独的容器空间。进一步提供对应于每个容器空间的后门构件，用于选择性地倾倒每个空间的内容物，这取决于门是固定的还是不安全的。此外，每个门构件上存在指示每个容器空间的内容的识别标签，每个标签可随着空间的内容而被移除。

16. 发明授权

US08305218B2 System and program product for automatic RFID attenuation and recovery 有权
标题翻译：用于自动RFID衰减和恢复的系统和程序产品
公开(公告)号：US08305218B2
公开(公告)日：2012-11-06
申请号：US12190753
申请日：2008-08-13
申请人： Christian L. Hunt , Vincent M. Padua , Robin A. Radez , William A. Reichert, III , Gregory C. Smith , Oriana J. Williams
发明人： Christian L. Hunt , Vincent M. Padua , Robin A. Radez , William A. Reichert, III , Gregory C. Smith , Oriana J. Williams
IPC分类号： G08B13/14
CPC分类号： G06K7/0008 , G06K7/10356
摘要： The invention provides a system and program product for attenuating a radio frequency identification (RFID) reader. In one embodiment, the system includes optimizing a coverage area of an RFID reader.
摘要翻译：本发明提供一种用于衰减射频识别（RFID）读取器的系统和程序产品。在一个实施例中，该系统包括优化RFID读取器的覆盖区域。

17. 发明授权

US07439864B2 Method for automatic RFID attenuation and recovery 失效
标题翻译：自动RFID衰减和恢复方法
公开(公告)号：US07439864B2
公开(公告)日：2008-10-21
申请号：US11358276
申请日：2006-02-21
申请人： Christian L. Hunt , Vincent M. Padua , Robin A. Radez , William A. Reichert, III , Gregory C. Smith , Oriana J. Williams
发明人： Christian L. Hunt , Vincent M. Padua , Robin A. Radez , William A. Reichert, III , Gregory C. Smith , Oriana J. Williams
IPC分类号： G08B13/14
CPC分类号： G06K7/0008 , G06K7/10356
摘要： The invention provides a method for attenuating a radio frequency identification (RFID) reader. In one embodiment, the method includes optimizing a coverage area of an RFID reader.
摘要翻译：本发明提供了一种用于衰减射频识别（RFID）读取器的方法。在一个实施例中，该方法包括优化RFID读取器的覆盖区域。

18. 发明授权

US5703728A Support post architecture for micromechanical devices 失效
标题翻译：支持微机械设备的后架构
公开(公告)号：US5703728A
公开(公告)日：1997-12-30
申请号：US333195
申请日：1994-11-02
申请人： Gregory C. Smith , Robert M. Boysel
发明人： Gregory C. Smith , Robert M. Boysel
IPC分类号： B81B3/00 , B81C1/00 , G02B26/08 , G06K15/12 , H04N5/74 , H04N9/31 , G02B7/182 , G02B5/08 , G02B26/00
CPC分类号： G06K15/1252 , G02B26/0841 , Y10S359/904
摘要： A support pillar 426 for use with a micromechanical device, particularly a digital micromirror device, comprising a pillar material 422 supported by a substrate 400 and covered with a metal layer 406. The support pillar 426 is fabricated by depositing a layer of pillar material on a substrate 400, patterning the pillar layer to define a support pillar 426, and depositing a metal layer 406 over the support pillar 426 enclosing the support pillar. A planar surface even with the top of the pillar may be created by applying a spacer layer 432 over the pillars 426. After applying the spacer layer 432, the spacer layer 432 is etched to expose the tops of the pillars.
摘要翻译：用于微机械装置，特别是数字微镜装置的支撑柱426，其包括由衬底400支撑并被金属层406覆盖的支柱材料422.支撑柱426通过将柱材料层沉积在衬底400，图案化柱层以限定支撑柱426，以及在包围支撑柱的支撑柱426上沉积金属层406。可以通过在柱426上施加间隔层432来产生甚至具有柱顶部的平面。在施加间隔层432之后，间隔层432被蚀刻以暴露柱的顶部。

19. 发明授权

US5631782A Support post architecture for micromechanical devices 失效
标题翻译：支持微机械设备的后架构
公开(公告)号：US5631782A
公开(公告)日：1997-05-20
申请号：US474867
申请日：1995-06-07
申请人： Gregory C. Smith , Robert M. Boysel
发明人： Gregory C. Smith , Robert M. Boysel
IPC分类号： B81B3/00 , B81C1/00 , G02B26/08 , G06K15/12 , H04N5/74 , H04N9/31 , G02B7/182 , G02B26/00
CPC分类号： G06K15/1252 , G02B26/0841 , Y10S359/904
摘要： Support pillar 426 for use with a micromechanical device, particularly a digital micromirror device, comprising a pillar material 422 supported by a substrate 400 and covered with a metal layer 406. The support pillar 426 is fabricated by depositing a layer of pillar material on a substrate 400, patterning the pillar layer to define a support pillar 426, and depositing a metal layer 406 over the support pillar 426 enclosing the support pillar. A planar surface even with the top of the pillar may be created by applying a spacer layer 432 over the pillars 426. After applying the spacer layer 432, the spacer layer 432 is etched to expose the tops of the pillars.
摘要翻译：支撑柱426，用于微机械装置，特别是数字微镜装置，其包括由衬底400支撑并被金属层406覆盖的支柱材料422.支撑柱426通过在衬底上沉积柱状材料制成 400，图案化柱层以限定支撑柱426，以及在包围支撑柱的支撑柱426上沉积金属层406。可以通过在柱426上施加间隔层432来产生甚至具有柱顶部的平面。在施加间隔层432之后，间隔层432被蚀刻以暴露柱的顶部。

20. 发明授权

US5622900A Wafer-like processing after sawing DMDs 失效
标题翻译：锯切DMD后的晶圆状加工
公开(公告)号：US5622900A
公开(公告)日：1997-04-22
申请号：US374384
申请日：1995-01-12
申请人： Gregory C. Smith
发明人： Gregory C. Smith
IPC分类号： G02B26/08 , H01L21/301 , H01L21/302
CPC分类号： G02B26/08 , G02B26/0841 , Y10T156/1082
摘要： A method of fabricating debris intolerant devices 30, and especially micro-mechanical devices such as DMDs, that allows wafers 22 to be sawn prior to completing all fabrication steps. Some devices are too fragile to allow cleaning operations to be performed after fabrication of the device. A solution is to saw and clean the wafers prior to completing the fabrication steps that make the device fragile. To prevent having to process the chips 30 individually, a substrate wafer 28 is attached to the backside of the dicing tape 24. This substrate wafer holds the sawn chips 30 in alignment allowing the remaining fabrication steps to be performed in wafer form.
摘要翻译：制造碎片不耐受装置30，特别是诸如DMD的微机械装置的方法，其允许在完成所有制造步骤之前锯切晶片22。一些设备太脆弱，不允许在制造设备之后进行清洁操作。解决方案是在完成使器件易碎的制造步骤之前锯切和清洁晶片。为了防止必须单独处理芯片30，将衬底晶片28附接到切割带24的背面。该衬底晶片将锯切芯片30保持对准，从而可以以晶片形式执行剩余的制造步骤。

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