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11. 发明申请

US20100258925A1 SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20100258925A1
公开(公告)日：2010-10-14
申请号：US12823411
申请日：2010-06-25
申请人： Oseob Jeon , Yoonhwa Choi , Boon Huan Gooi , Maria Cristina B. Estacio , David Chong , Tan Teik Keng , Shibaek Nam , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Lay Yeap Lim , Byoung-Ok Lee
发明人： Oseob Jeon , Yoonhwa Choi , Boon Huan Gooi , Maria Cristina B. Estacio , David Chong , Tan Teik Keng , Shibaek Nam , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Lay Yeap Lim , Byoung-Ok Lee
IPC分类号： H01L23/28 , H01L21/56
CPC分类号： H01L24/29 , H01L21/561 , H01L23/3121 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32057 , H01L2224/32225 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/4943 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/85013 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19043 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2924/0105 , H01L2924/01082 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/37099
摘要： Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
摘要翻译：公开了半导体管芯封装。示例性半导体管芯封装包括预成型衬底。预成型基板可以具有附接到其上的半导体管芯，并且封装材料可以设置在半导体管芯上方。

12. 发明授权

US07256479B2 Method to manufacture a universal footprint for a package with exposed chip 失效
标题翻译：制造具有裸露芯片的封装的通用尺寸的方法
公开(公告)号：US07256479B2
公开(公告)日：2007-08-14
申请号：US11035918
申请日：2005-01-13
申请人： Jonathan A. Noquil , Connie Tangpuz , Romel Manatad , Stephen Martin , Rajeev Joshi , Venkat Iyer
发明人： Jonathan A. Noquil , Connie Tangpuz , Romel Manatad , Stephen Martin , Rajeev Joshi , Venkat Iyer
IPC分类号： H01L23/495
CPC分类号： H01L23/36 , H01L23/488 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K3/341 , H05K2201/09681 , H05K2201/10166 , H05K2201/10477 , H05K2201/10689 , H05K2201/10969 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor die package is disclosed. It may include a semiconductor die having a first surface and a second surface, and a leadframe structure. A molding material may be formed around at least a portion of the die and at least a portion of the leadframe structure. A solderable layer may be on the exterior surface of the molding material and the first surface of the semiconductor die.
摘要翻译：公开了一种半导体管芯封装。它可以包括具有第一表面和第二表面的半导体管芯和引线框架结构。模制材料可以围绕模具的至少一部分和引线框架结构的至少一部分形成。可焊层可以在模制材料的外表面和半导体管芯的第一表面上。

13. 发明申请

US20070001278A1 Semiconductor die package and method for making the same 有权
标题翻译：半导体管芯封装及其制造方法
公开(公告)号：US20070001278A1
公开(公告)日：2007-01-04
申请号：US11471291
申请日：2006-06-19
申请人： Oseob Jeon , Yoonhwa Choi , Boon Gooi , Maria Cristina Estacio , David Chong , Tan Keng , Shibaek Nam , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Lay Lim , Byoung-Ok Lee
发明人： Oseob Jeon , Yoonhwa Choi , Boon Gooi , Maria Cristina Estacio , David Chong , Tan Keng , Shibaek Nam , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Lay Lim , Byoung-Ok Lee
IPC分类号： H01L21/00
CPC分类号： H01L24/29 , H01L21/561 , H01L23/3121 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32057 , H01L2224/32225 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/4943 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/85013 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19043 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2924/0105 , H01L2924/01082 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/37099
摘要： Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
摘要翻译：公开了半导体管芯封装。示例性半导体管芯封装包括预成型衬底。预成型基板可以具有附接到其上的半导体管芯，并且封装材料可以设置在半导体管芯上方。

14. 发明申请

US20090313083A1 RENEWABLE ENERGY CALCULATOR 审中-公开
标题翻译：可再生能源计算器
公开(公告)号：US20090313083A1
公开(公告)日：2009-12-17
申请号：US12138753
申请日：2008-06-13
申请人： Jim Dillon , Ronald Blagus , Stephen Parr , Venkat Iyer , Alan Houghton
发明人： Jim Dillon , Ronald Blagus , Stephen Parr , Venkat Iyer , Alan Houghton
IPC分类号： G06Q10/00 , G06Q50/00 , G06Q40/00
CPC分类号： G06Q40/02 , G06Q10/06393 , G06Q30/02 , G06Q40/00 , Y04S10/58 , Y04S50/14
摘要： A calculator or system for evaluating renewable energies in various geospatial areas or regions and for targeting potential buyers. The calculator may have a financial model which has inputs of renewable energy data by region including respective energy outputs and monetary values. The inputs may also include financial information related to establishing renewable energies. An output from the financial model may include a scorecard of information. Also, customer information may be added to the scorecard. The scorecard may have an output that targets potential customers of renewable energies.
摘要翻译：用于评估各种地理空间地区或地区的可再生能源并针对潜在买家的计算器或系统。计算器可以具有按区域的可再生能源数据输入的财务模型，包括各自的能量输出和货币值。投入还可能包括与建立可再生能源有关的财务信息。财务模型的输出可以包括信息记分卡。此外，客户信息可以被添加到记分卡。记分卡可能具有针对可再生能源潜在客户的产出。

15. 发明申请

US20080044946A1 SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MANUFACTURING 失效
标题翻译：使用铅笔和夹子的半导体芯片封装及其制造方法
公开(公告)号：US20080044946A1
公开(公告)日：2008-02-21
申请号：US11856635
申请日：2007-09-17
申请人： Erwin Victor Cruz , Elsie Cabahug , Ti Ching Shian , Venkat Iyer
发明人： Erwin Victor Cruz , Elsie Cabahug , Ti Ching Shian , Venkat Iyer
IPC分类号： H01L21/60
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/568 , H01L23/49548 , H01L23/49551 , H01L23/49562 , H01L24/33 , H01L24/37 , H01L24/39 , H01L24/83 , H01L24/97 , H01L2224/16245 , H01L2224/29109 , H01L2224/29111 , H01L2224/29116 , H01L2224/2919 , H01L2224/32057 , H01L2224/32245 , H01L2224/37147 , H01L2224/73253 , H01L2224/83385 , H01L2224/83801 , H01L2224/8485 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12032 , H01L2924/12041 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/19043 , H01L2924/3651 , H01L2224/83 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip structure can be used in a MLP (micro-leadframe package).
摘要翻译：公开了一种用于半导体封装的夹子结构。夹子结构包括主要部分，从主要部分延伸的至少一个基座，下降部分和引导部分。凹陷部分在引导部分和主要部分之间。夹子结构可用于MLP（微引线框封装）。

16. 发明授权

US06724848B1 Sync regeneration in a universal serial bus 有权
标题翻译：通用串行总线同步再生
公开(公告)号：US06724848B1
公开(公告)日：2004-04-20
申请号：US09519511
申请日：2000-03-06
申请人： Venkat Iyer
发明人： Venkat Iyer
IPC分类号： H04L700
CPC分类号： H04L7/046 , H04L7/005
摘要： A Universal Serial Bus repeater is provided, comprising a method and apparatus for detecting a specified data pattern and regenerating or retransmitting the recognized data pattern. In some embodiments, the invention recognizes an end of sync signal, and is operable to retransmit the end of sync signal and the following data that is presumed to be valid as a result of sync recognition. In other embodiments, the invention recognizes and retransmits a properly aligned end of packet signal, the size of which is dependent on detection of whether the end of packet signal is a part of a start of frame packet.
摘要翻译：提供了一种通用串行总线中继器，包括用于检测指定数据模式并重新生成或重新发送所识别的数据模式的方法和装置。在一些实施例中，本发明识别同步信号的结束，并且可操作用于重传同步信号的结束以及作为同步识别的结果被认为是有效的后续数据。在其他实施例中，本发明识别和重新发送分组信号的正确对齐端，其大小取决于分组信号的结束是否是帧分组开始的一部分。

17. 发明授权

US06629186B1 Bus controller and associated device drivers for use to control a peripheral bus having at least one store-and-forward segment 失效
标题翻译：总线控制器和相关设备驱动器，用于控制具有至少一个存储转发段的外围总线
公开(公告)号：US06629186B1
公开(公告)日：2003-09-30
申请号：US09309088
申请日：1999-05-10
申请人： John I. Garney , John S. Howard , Venkat Iyer
发明人： John I. Garney , John S. Howard , Venkat Iyer
IPC分类号： G06F1312
CPC分类号： G06F13/102
摘要： A bus controller and its associated device drivers are provided to a digital system to operate and control a peripheral bus, including the selective operation of at least a first portion of the peripheral bus in a store-and-forward manner. The device drivers include a number of programming instructions. Upon programmed with the programming instructions, a digital system is enabled to operate the bus controller to facilitate communication with a first bus agent in this first portion. The programming instructions package a number of request packets destined for the first bus agent into a multi-packet package, schedule the multi-packet package to be transmitted in bulk, at a first communication speed, to a first hub in the first portion, for the first hub to buffer the request packets, and then forward the request packets to the first bus agent, on a packet-by-packet basis and at a second communication speed. In one embodiment, the second communication speed is slower than the first communication speed. In one embodiment, the programming instructions further schedule communications destined for a second bus agent of this first portion, for transmission to the first hub, at the first communication speed, for the first hub to repeat the communications for the second bus agent without buffering, at also the first communication speed.
摘要翻译：将总线控制器及其相关的设备驱动器提供给数字系统以操作和控制外围总线，包括以存储和转发的方式选择性地操作外围总线的至少第一部分。设备驱动程序包括一些编程指令。在使用编程指令编程时，数字系统能够操作总线控制器以便于在该第一部分中与第一总线代理的通信。编程指令将目的地为第一总线代理的多个请求分组封装成多分组包，将以多个第一通信速度批量发送的多分组分组调度到第一部分中的第一集线器，以便第一集线器缓冲请求分组，然后逐个分组地以第二通信速度将请求分组转发到第一总线代理。在一个实施例中，第二通信速度比第一通信速度慢。在一个实施例中，编程指令进一步调度目的地为该第一部分的第二总线代理的通信，用于以第一通信速度传输到第一集线器，以使第一集线器重复第二总线代理的通信而不进行缓冲，也是第一个通信速度。

18. 发明授权

US08058107B2 Semiconductor die package using leadframe and clip and method of manufacturing 失效
标题翻译：使用引线框和夹子的半导体管芯封装及其制造方法
公开(公告)号：US08058107B2
公开(公告)日：2011-11-15
申请号：US11856635
申请日：2007-09-17
申请人： Erwin Victor R. Cruz , Elsie Cabahug , Ti Ching Shian , Venkat Iyer
发明人： Erwin Victor R. Cruz , Elsie Cabahug , Ti Ching Shian , Venkat Iyer
IPC分类号： H01L21/00 , H01L23/495
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/568 , H01L23/49548 , H01L23/49551 , H01L23/49562 , H01L24/33 , H01L24/37 , H01L24/39 , H01L24/83 , H01L24/97 , H01L2224/16245 , H01L2224/29109 , H01L2224/29111 , H01L2224/29116 , H01L2224/2919 , H01L2224/32057 , H01L2224/32245 , H01L2224/37147 , H01L2224/73253 , H01L2224/83385 , H01L2224/83801 , H01L2224/8485 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12032 , H01L2924/12041 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/19043 , H01L2924/3651 , H01L2224/83 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip structure can be used in a MLP (micro-leadframe package).
摘要翻译：公开了一种用于半导体封装的夹子结构。夹子结构包括主要部分，从主要部分延伸的至少一个基座，下降部分和引导部分。凹陷部分在引导部分和主要部分之间。夹子结构可用于MLP（微引线框封装）。

19. 发明授权

US07285849B2 Semiconductor die package using leadframe and clip and method of manufacturing 失效
公开(公告)号：US07285849B2
公开(公告)日：2007-10-23
申请号：US11282967
申请日：2005-11-18
申请人： Erwin Victor R. Cruz , Elsie Cabahug , Ti Ching Shian , Venkat Iyer
发明人： Erwin Victor R. Cruz , Elsie Cabahug , Ti Ching Shian , Venkat Iyer
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/568 , H01L23/49548 , H01L23/49551 , H01L23/49562 , H01L24/33 , H01L24/37 , H01L24/39 , H01L24/83 , H01L24/97 , H01L2224/16245 , H01L2224/29109 , H01L2224/29111 , H01L2224/29116 , H01L2224/2919 , H01L2224/32057 , H01L2224/32245 , H01L2224/37147 , H01L2224/73253 , H01L2224/83385 , H01L2224/83801 , H01L2224/8485 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12032 , H01L2924/12041 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/19043 , H01L2924/3651 , H01L2224/83 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip structure can be used in a MLP (micro-leadframe package).

20. 发明申请

US20060286164A1 Pharmaceutical composition containing a stable and clear solution of anti-inflammatory drug in soft gelatin capsule and process for producing the same 审中-公开
标题翻译：药物组合物含有稳定而清澈的抗炎药物在软明胶胶囊中的溶液及其制备方法
公开(公告)号：US20060286164A1
公开(公告)日：2006-12-21
申请号：US10545601
申请日：2004-06-07
申请人： Venkat Iyer , Shivaraj Katageri
发明人： Venkat Iyer , Shivaraj Katageri
IPC分类号： A61K31/192 , A61K9/64 , A61K9/14
CPC分类号： A61K9/08 , A61K9/4858 , A61K9/4866 , A61K47/08 , A61K47/10 , A61K47/32
摘要： Disclosed herein is a pharmaceutical composition comprising a soft gelatin capsule containing a clear and stable solution of sodium dihydratate salt of ibuprofen by employing a system of solubilizer, co-solubilizer and antioxidants.
摘要翻译：本文公开了一种药物组合物，其包含通过使用增溶剂，助溶剂和抗氧化剂体系的含有布洛芬的二氢化钠二钠盐的透明且稳定的溶液的软明胶胶囊。

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