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11. 发明申请

US20150008950A1 MANUFACTURING ADVANCED TEST PROBES 审中-公开
标题翻译：制造高级测试探针
公开(公告)号：US20150008950A1
公开(公告)日：2015-01-08
申请号：US13977665
申请日：2011-12-31
申请人： Roy E. Swart , Paul B. Fischer , Charlotte C. Kwong
发明人： Roy E. Swart , Paul B. Fischer , Charlotte C. Kwong
IPC分类号： G01R3/00 , B23K26/38 , B23K26/18 , G01R1/067 , G01R1/073
CPC分类号： G01R3/00 , B23K26/18 , B23K26/38 , G01R1/067 , G01R1/073 , Y10T29/49156
摘要： Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed.
摘要翻译：实施例涉及测试探针的形成。一种方法包括提供导电材料的散装片材。使用激光以预定图案切割散片，以形成测试探针。描述和要求保护其他实施例。

12. 发明授权

US07105925B2 Differential planarization 失效
标题翻译：差分平面化
公开(公告)号：US07105925B2
公开(公告)日：2006-09-12
申请号：US11055453
申请日：2005-02-02
申请人： James A. Boardman , Sarah E. Kim , Paul B. Fischer , Mauro J. Kobrinsky
发明人： James A. Boardman , Sarah E. Kim , Paul B. Fischer , Mauro J. Kobrinsky
IPC分类号： H01L23/48 , H01L23/52 , H01L29/49
CPC分类号： H01L21/7684 , H01L21/76819 , H01L2924/0002 , H01L2924/00
摘要： Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dimensions and uniformity of various layers may be accurately controlled using the disclosed techniques.
摘要翻译：公开了用于优化和控制化学机械平面化的方法和结构。本发明的实施例包括使包括交替的金属和金属间层的非平面表面的平面化技术。使用所公开的技术可以精确地控制各层的相对突出尺寸和均匀性。

13. 发明授权

US09835648B2 Liquid metal interconnects 有权
公开(公告)号：US09835648B2
公开(公告)日：2017-12-05
申请号：US13173933
申请日：2011-06-30
申请人： Rajashree Baskaran , Kimin Jun , Ting Zhong , Roy E. Swart , Paul B. Fischer
发明人： Rajashree Baskaran , Kimin Jun , Ting Zhong , Roy E. Swart , Paul B. Fischer
IPC分类号： G01R31/28 , G01R1/04 , H01R3/08 , G01R1/067
CPC分类号： G01R1/0416 , G01R1/06783 , H01R3/08 , Y10T29/49204
摘要： Embodiments of the invention provide methods for forming electrical connections using liquid metals. Electrical connections that employ liquid metals are useful for testing and validation of semiconductor devices. Electrical connections are formed between the probes of a testing interface and the electronic interface of a device under test through a liquid metal region. In embodiments of the invention, liquid metal interconnects are comprised of gallium or liquid metal alloys of gallium. The use of liquid metal contacts does not require a predetermined amount of force be applied in order to reliably make an electrical connection.

14. 发明授权

US09391447B2 Interposer to regulate current for wafer test tooling 有权
标题翻译：用于晶圆测试工具调节电流的插件
公开(公告)号：US09391447B2
公开(公告)日：2016-07-12
申请号：US13976970
申请日：2012-03-06
申请人： Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
发明人： Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
IPC分类号： H02H9/08 , H02H9/02 , G01R1/36 , G01R31/28 , G01R1/073
CPC分类号： H02H9/02 , G01R1/07385 , G01R1/36 , G01R31/2889
摘要： An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.
摘要翻译：描述了内插器来调节晶圆测试工具中的电流。在一个示例中，插入器包括耦合到自动测试设备的第一连接焊盘和耦合到被测器件的第二连接焊盘。插入器还包括过电流限制电路，用于连接第一和第二连接焊盘，并且当第一和第二连接焊盘之间的电流超过预定量时，断开第一和第二连接焊盘。

15. 发明授权

US06914002B2 Differential planarization 失效
标题翻译：差分平面化
公开(公告)号：US06914002B2
公开(公告)日：2005-07-05
申请号：US10334308
申请日：2002-12-28
申请人： James A. Boardman , Sarah E. Kim , Paul B. Fischer , Mauro J. Kobrinsky
发明人： James A. Boardman , Sarah E. Kim , Paul B. Fischer , Mauro J. Kobrinsky
IPC分类号： H01L21/768 , H01L21/302
CPC分类号： H01L21/7684 , H01L21/76819 , H01L2924/0002 , H01L2924/00
摘要： Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dimensions and uniformity of various layers may be accurately controlled using the disclosed techniques.
摘要翻译：公开了用于优化和控制化学机械平面化的方法和结构。本发明的实施例包括使包括交替的金属和金属间层的非平面表面的平面化技术。使用所公开的技术可以精确地控制各层的相对突出尺寸和均匀性。

16. 发明申请

US20140029150A1 INTERPOSER TO REGULATE CURRENT FOR WAFER TEST TOOLING 有权
标题翻译：用于调节流量测试工具的插件
公开(公告)号：US20140029150A1
公开(公告)日：2014-01-30
申请号：US13976970
申请日：2012-03-06
申请人： Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
发明人： Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
IPC分类号： H02H9/02
CPC分类号： H02H9/02 , G01R1/07385 , G01R1/36 , G01R31/2889
摘要： An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.
摘要翻译：描述了内插器来调节晶圆测试工具中的电流。在一个示例中，插入器包括耦合到自动测试设备的第一连接焊盘和耦合到被测器件的第二连接焊盘。插入器还包括过电流限制电路，用于连接第一和第二连接焊盘，并且当第一和第二连接焊盘之间的电流超过预定量时，断开第一和第二连接焊盘。

17. 发明申请

US20130000117A1 LIQUID METAL INTERCONNECTS 有权
标题翻译：液体金属互连
公开(公告)号：US20130000117A1
公开(公告)日：2013-01-03
申请号：US13173933
申请日：2011-06-30
申请人： Rajashree Baskaran , Kimin Jun , Ting Zhong , Roy E. Swart , Paul B. Fischer
发明人： Rajashree Baskaran , Kimin Jun , Ting Zhong , Roy E. Swart , Paul B. Fischer
IPC分类号： H01R43/16
CPC分类号： G01R1/0416 , G01R1/06783 , H01R3/08 , Y10T29/49204
摘要： Embodiments of the invention provide methods for forming electrical connections using liquid metals. Electrical connections that employ liquid metals are useful for testing and validation of semiconductor devices. Electrical connections are formed between the probes of a testing interface and the electronic interface of a device under test through a liquid metal region. In embodiments of the invention, liquid metal interconnects are comprised of gallium or liquid metal alloys of gallium. The use of liquid metal contacts does not require a predetermined amount of force be applied in order to reliably make an electrical connection.
摘要翻译：本发明的实施例提供了使用液态金属形成电连接的方法。使用液态金属的电气连接对于半导体器件的测试和验证是有用的。通过液态金属区域在测试界面的探针和被测器件的电子接口之间形成电连接。在本发明的实施例中，液态金属互连由镓或镓的液态金属合金构成。为了可靠地进行电连接，使用液态金属触点不需要施加预定量的力。

18. 发明授权

US07666465B2 Introducing nanotubes in trenches and structures formed thereby 失效
标题翻译：在由此形成的沟槽和结构中引入纳米管
公开(公告)号：US07666465B2
公开(公告)日：2010-02-23
申请号：US11026320
申请日：2004-12-29
申请人： Paul B. Fischer , Anne E. Miller , Kenneth C. Cadien , Chris E. Barns
发明人： Paul B. Fischer , Anne E. Miller , Kenneth C. Cadien , Chris E. Barns
IPC分类号： B05D1/00 , B05D1/04
CPC分类号： B82Y10/00 , B82Y30/00 , H01L51/0012 , H01L51/0048 , H01L51/0052 , Y10S977/72 , Y10T428/24562 , Y10T428/24612 , Y10T428/24744
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include providing a substrate comprising at least one opening, and then applying a nanotube slurry comprising at least one nanotube to the substrate, wherein the at least one nanotube is substantially placed within the at least one opening.
摘要翻译：描述形成微电子结构的方法。这些方法的实施方案包括提供包含至少一个开口的基底，然后将包含至少一个纳米管的纳米管浆料施加到所述基底，其中所述至少一个纳米管基本上放置在所述至少一个开口内。

19. 发明授权

US07205236B2 Semiconductor substrate polishing methods and equipment 有权
标题翻译：半导体衬底抛光方法和设备
公开(公告)号：US07205236B2
公开(公告)日：2007-04-17
申请号：US10952655
申请日：2004-09-28
申请人： Paul B. Fischer , Chris E. Barns
发明人： Paul B. Fischer , Chris E. Barns
IPC分类号： H01L21/461 , H01L21/302
CPC分类号： H01L21/7684 , B24B37/042 , B24B37/046 , C25F3/02 , H01L21/32115 , H01L21/32125
摘要： According to one aspect of the present invention, a method of electrochemically polishing a semiconductor substrate may be provided. A semiconductor substrate processing fluid, having a plurality of abrasive particles therein, may be placed between the surface of the semiconductor substrate and the polish head. The polish head may be moved relative to the surface of the semiconductor substrate to cause the abrasive particles to polish the surface of the semiconductor substrate. According to a second aspect of the present invention, a method for electro-polishing a semiconductor substrate may be provided. A semiconductor substrate may be placed in an electrolytic solution. A surface of the semiconductor substrate may be contacted with at least one conductive member. A voltage may be applied across the electrolytic solution and the at least one conductive member. The at least one conductive member may be moved across the surface of the semiconductor substrate.
摘要翻译：根据本发明的一个方面，可以提供一种电化学抛光半导体衬底的方法。可以在半导体衬底的表面和抛光头之间放置其中具有多个磨料颗粒的半导体衬底处理流体。抛光头可以相对于半导体衬底的表面移动，以使研磨颗粒抛光半导体衬底的表面。根据本发明的第二方面，可以提供一种用于电抛光半导体衬底的方法。可以将半导体衬底放置在电解液中。半导体衬底的表面可以与至少一个导电构件接触。可以在电解液和至少一个导电构件之间施加电压。至少一个导电构件可以跨过半导体衬底的表面移动。

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