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11. 发明申请

US20100190464A1 SIMPLE RADIO FREQUENCY INTEGRATED CIRCUIT (RFIC) PACKAGES WITH INTEGRATED ANTENNAS 有权
标题翻译：具有集成天线的简单无线电频率集成电路（RFIC）封装
公开(公告)号：US20100190464A1
公开(公告)日：2010-07-29
申请号：US12360538
申请日：2009-01-27
申请人： Ho Chung Chen , Brian A. Floyd , Duxian Liu
发明人： Ho Chung Chen , Brian A. Floyd , Duxian Liu
IPC分类号： H04B1/16 , H01L21/50
CPC分类号： H01Q9/0407 , H01L23/04 , H01L23/66 , H01L24/16 , H01L24/48 , H01L2223/6616 , H01L2223/6633 , H01L2223/6677 , H01L2224/16235 , H01L2224/48235 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/19039 , H01Q1/2283 , H01Q21/065 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described.
摘要翻译：射频集成电路芯片封装具有N个集成贴片天线，N为至少一个。该包装包括具有N个大体上平坦的贴片的盖部分和联接到盖部分的主要部分。主要部分又包括至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并与其平行。接地平面形成在其中没有任何耦合孔。主要部分还包括从N个大体上平坦的贴片向内间隔开并与之平行的N个馈送线，并且与大致平面的接地平面向外间隔开并与其平行。此外，主要部分包括耦合到馈线和接地平面的至少一个射频芯片。盖部分和主要部分协同地限定天线腔，并且N个大致平面的贴片和芯片位于天线腔中。包装形成无反光镜。还描述了制造技术。

12. 发明申请

US20100001906A1 RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES HAVING CHARACTERISTICS SUITABLE FOR MASS PRODUCTION 有权
标题翻译：无线电频率（RF）集成电路（IC）具有适合大规模生产的特性的封装
公开(公告)号：US20100001906A1
公开(公告)日：2010-01-07
申请号：US12168328
申请日：2008-07-07
申请人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
发明人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
IPC分类号： H01Q9/04 , H01Q13/10 , H01P11/00
CPC分类号： H01Q9/0457 , H01L23/66 , H01L24/48 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15313 , H01L2924/15323 , H01Q21/0075 , H01Q21/065 , Y10T29/49016 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A radio-frequency integrated circuit chip package with N integrated aperture-coupled patch antennas, N being at least one, includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn comprises at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein. The slots are substantially opposed to the patches. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and substantially parallel thereto, and at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, with the N generally planar patches located in the antenna cavity. Fabrication techniques are also described. In some embodiments, N is two or more and a phased array is formed.
摘要翻译：具有N个集成孔径耦合贴片天线的射频集成电路芯片封装，N为至少一个，包括具有N个大致平坦的贴片的盖部分和耦合到盖部分的主要部分。主要部分又包括至少一个大致平面的接地平面，该接地平面与N个大体上平坦的贴片间隔开并基本上与其平行。接地平面在其中至少形成有N个耦合孔隙。狭槽基本上与贴片相对。主要部分还包括从N个大体上平坦的贴片向内间隔开并且基本上与其平行的N个馈送线，以及耦合到馈电线和接地平面的至少一个射频芯片。盖部分和主要部分协作地限定天线腔，其中N个大体平面的贴片位于天线腔中。还描述了制造技术。在一些实施例中，N是两个或更多个并且形成相控阵列。

13. 发明授权

US07566952B2 On-chip circuit pad structure 失效
标题翻译：片上电路板结构
公开(公告)号：US07566952B2
公开(公告)日：2009-07-28
申请号：US11029518
申请日：2005-01-05
申请人： Brian A. Floyd , Ullrich R. Pfeiffer , Scott K. Reynods
发明人： Brian A. Floyd , Ullrich R. Pfeiffer , Scott K. Reynods
IPC分类号： H01L23/525
CPC分类号： H05K1/111 , H01L23/5225 , H01L23/66 , H01L24/03 , H01L24/05 , H01L24/16 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05552 , H01L2224/05553 , H01L2224/05599 , H01L2224/06051 , H01L2224/16 , H01L2224/48091 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/01075 , H01L2924/01082 , H01L2924/10329 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19051 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01P5/02 , H05K1/0237 , H05K2201/0723 , H05K2201/0792 , H05K2201/09781 , Y02P70/611 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Shielded circuit pad is provided where the parasitic capacitance is tuned out by the inclusion of a shunt transmission line stub which reduces the substrate induced loss in millimeter-wave applications. The circuit pad is located on the substrate, with a shield located beneath the circuit pad, and the shunt transmission line stub attached to the circuit pad. Accordingly, controlled impedance is obtained for millimeter-wave applications. The spacing between the circuit pad and the shield may then be minimized.
摘要翻译：提供屏蔽电路板，其中寄生电容通过包括分流传输线短截线来调谐，从而减小了毫米波应用中的衬底感应损耗。电路板位于基板上，屏蔽层位于电路板下方，并且分流传输线插脚连接到电路板。因此，对于毫米波应用获得受控阻抗。然后可以最小化电路板和屏蔽之间的间隔。

14. 发明申请

US20080164917A1 CIRCUITS AND METHODS FOR IMPLEMENTING SUB-INTEGER-N FREQUENCY DIVIDERS USING PHASE ROTATORS 有权
标题翻译：使用相位旋转器实现子整数N分频器的电路和方法
公开(公告)号：US20080164917A1
公开(公告)日：2008-07-10
申请号：US11621879
申请日：2007-01-10
申请人： Brian A. Floyd , Sergey V. Rylov
发明人： Brian A. Floyd , Sergey V. Rylov
IPC分类号： H03B19/12 , H03L7/18
CPC分类号： H03L7/1974
摘要： Circuits and methods are provided for implementing programmable sub-integer N frequency dividers for use in, e.g., frequency synthesizer applications, providing glitch free outputs signals with minimal fractional spurs. Phase-rotating sub-integer N frequency dividers are programmable to provide multi-modulus division with a wide range of arbitrary sub-integer division ratios.
摘要翻译：提供了用于实现可用于例如频率合成器应用的可编程子整数N分频器的电路和方法，以最小的分数杂散提供无毛刺输出信号。相位旋转子整数N分频器是可编程的，以提供宽范围的任意子整数除法比的多模除法。

15. 发明授权

US4890536A Floating fitting cable attachment 失效
标题翻译：浮动接头电缆附件
公开(公告)号：US4890536A
公开(公告)日：1990-01-02
申请号：US202656
申请日：1988-05-27
申请人： Brian A. Floyd
发明人： Brian A. Floyd
IPC分类号： F41F3/073
CPC分类号： F41F3/073
摘要： Missile support cables are passed through cable fitter support blocks, which are ridgidly affixed to the silo, and are swaged to heavy blocks resting upon the support blocks via a canister having ductile mesh therein. Upon a downblast, the cables are maintained in tension due to the low downward acceleration of the heavy blocks, while the support blocks are rapidly downwardly accelerated and upon rebound, smash into the energy absorbing canister which prevents the failure of the cables by controlling excess tension therein.
摘要翻译：导弹支撑电缆通过电缆钳工支撑块，它们被固定在筒仓上，并通过其中具有延性网的罐而被模锻到搁置在支撑块上的重块。在下降时，由于重块的低向下加速度，电缆被保持在张力中，同时支撑块快速向下加速并且在回弹时，通过控制过大的张力而粉碎到能量吸收罐中，从而防止电缆的故障其中。

16. 发明授权

US08091481B1 Gas strut separation for staged rocket 有权
标题翻译：气体支柱分离用于分段火箭
公开(公告)号：US08091481B1
公开(公告)日：2012-01-10
申请号：US12434388
申请日：2009-05-01
申请人： Brian A. Floyd
发明人： Brian A. Floyd
IPC分类号： F42B15/10
CPC分类号： F42B15/36
摘要： A staged rocket apparatus includes first and second stages connected by a releasable connector. A plurality of pressurized gas struts are connected between the first and second stages and provide a separating force urging the first and second stages apart. The gas struts are held in a telescopingly collapsed first position by the releasable connector. The separating force is maintained at a minimum value so long as the releasable connector holds the struts in their first position. When the releasable connector is disconnected the separating force increases due to gas flow through a metering passage having a progressively increasing flow area from a high pressure chamber to a low pressure chamber.
摘要翻译：分段火箭装置包括通过可释放连接器连接的第一和第二阶段。多个加压气体支柱连接在第一和第二平台之间，并提供分开力，以使第一和第二平台分开。气体支柱通过可释放的连接器保持在可伸缩的第一位置。分离力保持在最小值，只要可释放连接器将支柱固定在其第一位置即可。当可释放连接器断开时，分离力由于气流通过具有从高压室到低压室逐渐增加的流动面积的计量通道而增加。

17. 发明申请

US20090256752A1 RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES WITH INTEGRATED APERTURE-COUPLED PATCH ANTENNA(S) IN RING AND/OR OFFSET CAVITIES 有权
标题翻译：无线电频率（RF）集成电路（IC）包装与环形和/或偏移CAVIENS中的集成光纤耦合天线
公开(公告)号：US20090256752A1
公开(公告)日：2009-10-15
申请号：US12102051
申请日：2008-04-14
申请人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
发明人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
IPC分类号： H01Q9/04 , H01P11/00
CPC分类号： H01Q21/065 , G06K19/07749 , G06K19/07786 , H01L23/3121 , H01L23/66 , H01L2223/6677 , H01L2224/16 , H01L2224/16227 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15323 , H01Q1/2283 , H01Q1/38 , H01Q9/0457 , H01Q21/061 , H01Q23/00 , Y10T29/49016
摘要： A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein, and the slots are substantially opposed to the patches. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is spaced inwardly from the feed lines, and is formed with a chip-receiving cavity, with the chip located in the chip-receiving cavity. A second substrate layer is interposed in a region between the ground plane and a plane defined by the patch, the patch is formed in a first metal layer, the ground plane is formed in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located. “Island” and “offset” configurations, as well as fabrication methods, are also disclosed.
摘要翻译：射频集成电路芯片封装具有N个集成的孔耦合贴片天线，N为至少两个，并且包括N个通常为平面的贴片，以及至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并基本上与之平行。。接地平面在其中形成有至少N个耦合孔隙，并且槽基本上与贴片相对。 N个进料管线从接地平面向内隔开并基本上与其平行，并且至少一个射频芯片与进料管线向内间隔开并连接到进料管线和接地平面。第一衬底层从馈电线向内隔开，并且形成有芯片接收腔，芯片位于芯片接收腔中。第二基板层插入在接地平面和由贴片限定的平面之间的区域中，贴片形成在第一金属层中，接地平面形成在第二金属层中，第二基板层限定天线其中N个大体平面的贴片位于其中。还公开了“岛”和“偏移”结构以及制造方法。

18. 发明授权

US07459981B2 Circuits and methods for implementing transformer-coupled amplifiers at millimeter wave frequencies 有权
公开(公告)号：US07459981B2
公开(公告)日：2008-12-02
申请号：US11830221
申请日：2007-07-30
申请人： Brian A. Floyd , David Goren , Ullrich R. Pfeiffer , Scott Kevin Reynolds
发明人： Brian A. Floyd , David Goren , Ullrich R. Pfeiffer , Scott Kevin Reynolds
IPC分类号： H03F3/04
CPC分类号： H03F3/195 , H03F3/45089 , H03F3/604 , H03F2200/537 , H03F2200/541 , H03F2203/45731
摘要： Circuits and methods are provided for building integrated transformer-coupled amplifiers with on-chip transformers that are designed to resonate or otherwise tune parasitic capacitances to achieve frequency tuning of amplifiers at millimeter wave operating frequencies.

19. 发明授权

US07210282B1 Case burning rocket 失效
标题翻译：案例燃火箭
公开(公告)号：US07210282B1
公开(公告)日：2007-05-01
申请号：US10916352
申请日：2004-08-11
申请人： Brian A. Floyd
发明人： Brian A. Floyd
IPC分类号： F02K9/32
CPC分类号： F02K9/72 , F02K9/28 , F02K9/34 , F02K9/343
摘要： A case-burning rocket booster includes a combustible case containing a solid rocket fuel, a combustion chamber adjustably coupled to the case for burning the case and the solid rocket fuel, a nozzle connected to the combustion chamber for expelling the burned case and fuel to generate thrust, and a drive system for pulling the combustion chamber and nozzle up the case as the case and fuel burn. A hybrid version of the case-burning rocket also includes an oxidizer supply system for supplying varying amounts of oxidizer to the combustion chamber to vary the thrust generated by burning the case and the fuel.
摘要翻译：一种燃烧式火箭助推器包括一个包含固体火箭燃料的可燃壳体，一个可调节地联接到壳体上用于燃烧壳体和固体火箭燃料的燃烧室，连接到燃烧室的喷嘴，用于排出燃烧的壳体和燃料以产生推力和驱动系统，用于拉动燃烧室并在壳体和燃料燃烧时将喷嘴向上喷出。壳体燃烧火箭的混合版本还包括用于向燃烧室供应不同量的氧化剂的氧化剂供应系统，以改变由燃烧壳体和燃料产生的推力。

20. 发明授权

US08269671B2 Simple radio frequency integrated circuit (RFIC) packages with integrated antennas 有权
标题翻译：具有集成天线的简单射频集成电路（RFIC）封装
公开(公告)号：US08269671B2
公开(公告)日：2012-09-18
申请号：US12360538
申请日：2009-01-27
申请人： Ho Chung Chen , Brian A. Floyd , Duixian Liu
发明人： Ho Chung Chen , Brian A. Floyd , Duixian Liu
IPC分类号： H01Q1/24
CPC分类号： H01Q9/0407 , H01L23/04 , H01L23/66 , H01L24/16 , H01L24/48 , H01L2223/6616 , H01L2223/6633 , H01L2223/6677 , H01L2224/16235 , H01L2224/48235 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/19039 , H01Q1/2283 , H01Q21/065 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described.
摘要翻译：射频集成电路芯片封装具有N个集成贴片天线，N为至少一个。该包装包括具有N个大体上平坦的贴片的盖部分和联接到盖部分的主要部分。主要部分又包括至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并与其平行。接地平面形成在其中没有任何耦合孔。主要部分还包括从N个大体上平坦的贴片向内间隔开并与之平行的N个馈送线，并且与大致平面的接地平面向外间隔开并与其平行。此外，主要部分包括耦合到馈线和接地平面的至少一个射频芯片。盖部分和主要部分协同地限定天线腔，并且N个大致平面的贴片和芯片位于天线腔中。包装形成无反光镜。还描述了制造技术。

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