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    • 14. 发明申请
    • Methods of making magnetic write heads with use of a resist channel shrinking solution having corrosion inhibitors
    • 使用具有腐蚀抑制剂的抗蚀剂通道收缩溶液制造磁性写入头的方法
    • US20060096081A1
    • 2006-05-11
    • US11312064
    • 2005-12-19
    • Christian BonhoteJila TabibDennis McKeanDaniel BedellJyh-Shuey LoHieu LamKim Lee
    • Christian BonhoteJila TabibDennis McKeanDaniel BedellJyh-Shuey LoHieu LamKim Lee
    • G11B5/127H04R31/00
    • G11B5/3116G11B5/3163Y10T29/49032Y10T29/49039Y10T29/49043Y10T29/49044Y10T29/49048Y10T29/49052
    • One preferred method for use in making a magnetic write head with use of the resist channel shrinking solution includes the steps of forming a first pole piece layer of a first pole piece; forming a gap layer over the first pole piece layer; forming a patterned resist over the first pole piece layer and the gap layer; electroplating a first pedestal portion of a second pole piece over the gap layer within a channel of the patterned resist; forming an oxide layer over the first pedestal portion; applying the resist channel shrinking solution comprising the resist channel shrinking film and the corrosion inhibitors over the patterned resist; baking the resist channel shrinking solution over the patterned resist to thereby reduce a width of the channel; removing the resist channel shrinking solution; electroplating a second pedestal portion of the second pole piece within the reduced-width channel of the patterned resist; removing the patterned resist; and milling the structure. Advantageously, the oxide layer and the corrosion inhibitors of the resist channel shrinking solution reduce corrosion in the pole piece during the act of baking the resist channel shrinking solution.
    • 使用抗蚀剂通道收缩溶液制造磁性写入头的一种优选方法包括以下步骤:形成第一极片的第一极片层; 在所述第一极片层上形成间隙层; 在所述第一极片层和所述间隙层上形成图案化的抗蚀剂; 在图案化的抗蚀剂的通道内的间隙层上电镀第二极片的第一基座部分; 在所述第一基座部分上形成氧化物层; 在图案化的抗蚀剂上施加包含抗蚀剂通道收缩膜和腐蚀抑制剂的抗蚀剂通道收缩溶液; 在图案化的抗蚀剂上烘烤抗蚀剂通道收缩溶液,从而减小通道的宽度; 去除抗蚀剂通道收缩溶液; 在所述图案化抗蚀剂的所述减小宽度的通道内电镀所述第二极靴的第二基座部分; 去除图案化的抗蚀剂; 并研磨结构。 有利地,抗蚀剂通道收缩溶液的氧化物层和腐蚀抑制剂在烘烤抗蚀剂通道收缩溶液的作用期间减少极片中的腐蚀。
    • 20. 发明授权
    • Method of adjusting the flatness of a slider using selective plasma etching
    • 使用选择性等离子体蚀刻来调节滑块的平坦度的方法
    • US06589436B1
    • 2003-07-08
    • US09593990
    • 2000-06-14
    • Jila TabibYiping HsiaoRichard HsiaoRichard T. CampbellCiaran A. Fox
    • Jila TabibYiping HsiaoRichard HsiaoRichard T. CampbellCiaran A. Fox
    • G11B1732
    • G11B5/6005Y10T29/49041
    • Provided is a reactive ion etching (RIE) method for use in altering the flatness of a slider, whereby a slider or row of sliders is placed within a RIE apparatus. The apparatus comprises essentially an electrode within a chamber having an inlet and an outlet. The electrode is controlled by a bias power source. A source power is provided to the chamber to generate the plasma, wherein a gas or gas mixture is first introduced to the chamber and the source power is adjusted to maximize the plasma composition of ions and reactive neutral species. The ions and reactive neutral species are generated from reactive chemical species such as CHF3 and other F-containing species. An inert gas such as Argon may also be present. Typically, TiC within the Al2O3 matrix of the slider substrate surface is etched at a faster rate than other substrate species.
    • 提供了用于改变滑块的平坦度的反应离子蚀刻(RIE)方法,由此在RIE装置内放置滑块或滑块排。 该设备基本上包括具有入口和出口的腔室内的电极。 电极由偏压电源控制。 将源功率提供给腔室以产生等离子体,其中首先将气体或气体混合物引入腔室,并且调节源功率以最大化离子和反应性中性物质的血浆组成。 离子和反应性中性物质由反应性化学物质如CHF3和其他含F物质产生。 惰性气体如氩气也可能存在。 通常,滑块衬底表面的Al 2 O 3基体内的TiC以比其它衬底物质更快的速度被蚀刻。