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    • 15. 发明申请
    • SYSTEMS AND METHODS FOR PROVIDING MEMORY MODULES WITH MULTIPLE HUB DEVICES
    • 用多个集线器件提供存储器模块的系统和方法
    • US20070276977A1
    • 2007-11-29
    • US11420046
    • 2006-05-24
    • Paul W. CoteusWarren E. MauleEdward J. SeminaroRobert B. Tremaine
    • Paul W. CoteusWarren E. MauleEdward J. SeminaroRobert B. Tremaine
    • G06F13/14G06F12/00
    • G06F13/4243G06F13/4247
    • Systems and methods for providing memory modules with multiple hub devices. Exemplary systems include a cascade-interconnect memory system with a memory bus, a memory controller and a memory module. The memory controller is in communication with the memory bus for generating, receiving and responding to memory access requests. The memory module includes a first hub device with three or more ports and a second hub device with three or more ports. A first port on the first hub device is in communication with the memory controller via the memory bus, a second port on the first hub device is in communication with a first set of memory devices, and a third port on the first hub device is cascade connected to a first port on the second hub device. A second port on the second hub device is in communication with a second set of memory devices and a third port on the second hub device supports a cascaded connection to a subsequent hub device in the memory system.
    • 为多个集线器设备提供内存模块的系统和方法。 示例性系统包括具有存储器总线的级联互连存储器系统,存储器控制器和存储器模块。 存储器控制器与存储器总线通信,用于生成,接收和响应存储器访问请求。 存储器模块包括具有三个或更多个端口的第一集线器设备和具有三个或更多个端口的第二集线器设备。 第一集线器设备上的第一端口经由存储器总线与存储器控制器通信,第一集线器设备上的第二端口与第一组存储器设备通信,第一集线器设备上的第三端口级联 连接到第二集线器设备上的第一端口。 第二集线器设备上的第二端口与第二组存储器设备通信,并且第二集线器设备上的第三端口支持与存储器系统中的后续集线器设备的级联连接。
    • 16. 发明授权
    • Systems and methods for providing memory modules with multiple hub devices
    • 为多个集线器设备提供内存模块的系统和方法
    • US07640386B2
    • 2009-12-29
    • US11420046
    • 2006-05-24
    • Paul W. CoteusWarren E. MauleEdward J. SeminaroRobert B. Tremaine
    • Paul W. CoteusWarren E. MauleEdward J. SeminaroRobert B. Tremaine
    • G06F13/00
    • G06F13/4243G06F13/4247
    • Systems and methods for providing memory modules with multiple hub devices. Exemplary systems include a cascade-interconnect memory system with a memory bus, a memory controller and a memory module. The memory controller is in communication with the memory bus for generating, receiving and responding to memory access requests. The memory module includes a first hub device with three or more ports and a second hub device with three or more ports. A first port on the first hub device is in communication with the memory controller via the memory bus, a second port on the first hub device is in communication with a first set of memory devices, and a third port on the first hub device is cascade connected to a first port on the second hub device. A second port on the second hub device is in communication with a second set of memory devices and a third port on the second hub device supports a cascaded connection to a subsequent hub device in the memory system.
    • 为多个集线器设备提供内存模块的系统和方法。 示例性系统包括具有存储器总线的级联互连存储器系统,存储器控制器和存储器模块。 存储器控制器与存储器总线通信,用于生成,接收和响应存储器访问请求。 存储器模块包括具有三个或更多个端口的第一集线器设备和具有三个或更多个端口的第二集线器设备。 第一集线器设备上的第一端口经由存储器总线与存储器控制器通信,第一集线器设备上的第二端口与第一组存储器设备通信,第一集线器设备上的第三端口级联 连接到第二集线器设备上的第一端口。 第二集线器设备上的第二端口与第二组存储器设备通信,并且第二集线器设备上的第三端口支持与存储器系统中的后续集线器设备的级联连接。
    • 17. 发明申请
    • Memory systems for automated computing machinery
    • 自动计算机的存储系统
    • US20080215790A1
    • 2008-09-04
    • US12102034
    • 2008-04-14
    • Paul W. CoteusKevin C. GowerRobert B. Tremaine
    • Paul W. CoteusKevin C. GowerRobert B. Tremaine
    • G06F13/36
    • G06F13/1684Y02D10/14
    • Design structures embodied in machine readable medium are provided. Embodiments of the design structure include a memory system comprising: a memory controller; a memory bus terminator; a high speed memory bus that interconnects the memory controller, the memory bus terminator, and at least one memory module; and the at least one memory module, the memory module comprising at least one memory hub device, high speed random access memory served by the memory hub device, two bus signal ports, and a segment of the high speed memory bus fabricated on the memory module so as to interconnect the bus signal ports and the memory hub device, the high speed memory bus connected to the memory hub device by a negligible electrical stub.
    • 提供体现在机器可读介质中的设计结构。 设计结构的实施例包括存储器系统,包括:存储器控制器; 一个内存总线终端; 将存储器控制器,存储器总线终端器和至少一个存储器模块互连的高速存储器总线; 和所述至少一个存储器模块,所述存储器模块包括至少一个存储器集线器设备,由所述存储器集线器设备服务的高速随机存取存储器,两个总线信号端口以及在所述存储器模块上制造的所述高速存储器总线的段 以便将总线信号端口和存储器集线器设备互连,高速存储器总线通过可忽略的电接头连接到存储器集线器设备。
    • 20. 发明授权
    • Memory systems for automated computing machinery
    • 自动计算机的存储系统
    • US07627732B2
    • 2009-12-01
    • US12102034
    • 2008-04-14
    • Paul W. CoteusKevin C. GowerRobert B. Tremaine
    • Paul W. CoteusKevin C. GowerRobert B. Tremaine
    • G06F12/00G06F13/00G06F13/28H04L12/50H04Q11/00
    • G06F13/1684Y02D10/14
    • Design structures embodied in machine readable medium are provided. Embodiments of the design structure include a memory system comprising: a memory controller; a memory bus terminator; a high speed memory bus that interconnects the memory controller, the memory bus terminator, and at least one memory module; and the at least one memory module, the memory module comprising at least one memory hub device, high speed random access memory served by the memory hub device, two bus signal ports, and a segment of the high speed memory bus fabricated on the memory module so as to interconnect the bus signal ports and the memory hub device, the high speed memory bus connected to the memory hub device by a negligible electrical stub.
    • 提供体现在机器可读介质中的设计结构。 设计结构的实施例包括存储器系统,包括:存储器控制器; 一个内存总线终端; 连接存储器控制器,存储器总线终端器和至少一个存储器模块的高速存储器总线; 和所述至少一个存储器模块,所述存储器模块包括至少一个存储器集线器设备,由所述存储器集线器设备服务的高速随机存取存储器,两个总线信号端口以及在所述存储器模块上制造的所述高速存储器总线的段 以便将总线信号端口和存储器集线器设备互连,高速存储器总线通过可忽略的电接头连接到存储器集线器设备。