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    • 11. 发明授权
    • Disk apparatus
    • 磁盘设备
    • US07533395B2
    • 2009-05-12
    • US10576378
    • 2004-10-18
    • Yukihiro ArakiShingo KageShinya OgasawaraNobuyuki Miroku
    • Yukihiro ArakiShingo KageShinya OgasawaraNobuyuki Miroku
    • G11B17/28
    • G11B17/0286
    • There is provided a disc device achieving a reduced thickness by reducing as much as possible the space required for sandwiching operation by a turn table and a clamper while assuring the space where an inserted disc is conveyed inside the device. The disc device includes: a clamper unit having a clamper for sandwiching a disc-shaped recording medium by a floating unit held via an elastic member to a fixed frame; and a disc recording/reproduction drive unit having a turn table. The disc device is configured so that when the disc-shaped recording medium is sandwiched, a part of the clamper and a part of the turn table are contained in each other.
    • 提供一种盘装置,通过尽可能地减小由转台和夹持器夹持操作所需的空间,同时确保插入的盘在设备内传送的空间,从而实现了厚度的减小。 盘装置包括:夹持器单元,具有用于通过经由弹性构件固定到固定框架的浮动单元夹持盘形记录介质的夹持器; 以及具有转盘的盘记录/再现驱动单元。 盘装置被构造成使得当盘形记录介质被夹持时,夹持器的一部分和转台的一部分彼此包含。
    • 13. 发明申请
    • Imaging Apparatus
    • 成像设备
    • US20120275778A1
    • 2012-11-01
    • US13395125
    • 2011-06-29
    • Shinya OgasawaraMakoto IyodaYoshikazu YamanoTomonori MizutaniYasuhiro Miyamoto
    • Shinya OgasawaraMakoto IyodaYoshikazu YamanoTomonori MizutaniYasuhiro Miyamoto
    • G03B17/02
    • G03B17/02F16M11/041
    • An imaging apparatus having a protection ring which protects a supporting device coupling section such that it is difficult for a user to touch the supporting device coupling section is provided. A supporting device can be coupled to a camera body, and the camera body includes a supporting device coupling section and a protection ring. The supporting device coupling section has a screw hole to which the supporting device can be coupled, and a supporting device coupling surface which is formed and exposed around the entrance of the screw hole. The protection ring includes a return spring which restricts the position of the protection ring, a return spring stopper which supports the return spring, and a supporting device contact surface which protrudes outward of the exposed surface formed around the entrance of the screw hole of the supporting device coupling section, in a direction toward a housing outside.
    • 提供一种具有保护环的成像装置,其保护支撑装置联接部分,使得用户难以接触支撑装置联接部分。 支撑装置可以耦合到相机主体,并且相机主体包括支撑装置联接部分和保护环。 支撑装置联接部分具有能够联接支撑装置的螺孔,以及围绕螺丝孔的入口形成和暴露的支撑装置联接表面。 保护环包括限制保护环的位置的复位弹簧,支撑复位弹簧的复位弹簧止动器,以及支撑装置接触表面,该支撑装置接触表面从形成在支撑件的螺钉孔的入口周围的暴露表面向外突出 装置联接部分,朝向壳体外部的方向。
    • 20. 发明授权
    • Method of manufacturing a head unit
    • 制造头单元的方法
    • US06640418B2
    • 2003-11-04
    • US09890476
    • 2001-07-31
    • Tetsuya OkanaMitsuhisa FujikiSatoshi YamabayashiShinya Ogasawara
    • Tetsuya OkanaMitsuhisa FujikiSatoshi YamabayashiShinya Ogasawara
    • G11B5127
    • G11B5/48G11B5/1871G11B5/488G11B5/4893G11B5/531G11B5/60G11B15/61G11B15/64Y10T29/49039Y10T29/4913Y10T29/49133Y10T29/49135
    • In processing a head unit in which a head relative height Y is Y′ with a grinding amount &Dgr;GD of &Dgr;GD′, the relationship between distances Bo between a vertex of a curved surface as a front face of a head chip and a head gap before and after grinding the front face of the head chip and a gap depth dimension GD, is predetermined with respect to a head unit in which the head relative height is substantially equal to Y′, through which Bo1 as the value of Bo before grinding corresponding to a target value of the value of Bo after grinding is determined and used as Bo1 of the head unit in which the head relative height Y is Y′. Thus, grinding of the front face of the head chip is conducted after Bo1 corresponding to the target value is determined. Hence, a head unit with the value of Bo after grinding falling within the range of standard values can be manufactured efficiently, and accordingly the yield can be improved.
    • 在处理头部相对高度Y为具有DeltaGD'的磨削量DeltaGD的头部单元的情况下,作为头部芯片的前表面的曲面的顶点与前面的头部间隙之间的曲面顶点之间的距离Bo之间的关系,以及 在研磨头芯片的前表面和间隙深度尺寸GD之后,相对于头部相对高度基本上等于Y'的头单元是预定的,通过该头部单元,Bo1作为磨削前的Bo值对应于 确定研磨后的Bo值的目标值,并将其用作头部相对高度Y为Y'的头部单元的Bo1。 因此,在确定与目标值对应的Bo1之后,进行头芯片的正面的磨削。 因此,可以有效地制造研磨后的Bo值在标准值的范围内的头单元,从而可以提高成品率。