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11. 发明授权

US5914649A Chip fuse and process for production thereof 失效
标题翻译：芯片保险丝及其制造方法
公开(公告)号：US5914649A
公开(公告)日：1999-06-22
申请号：US991601
申请日：1997-12-16
申请人： Tadashi Isono , Yoshiyuki Tsuru , Yutaka Taniguchi , Fumio Suzuki
发明人： Tadashi Isono , Yoshiyuki Tsuru , Yutaka Taniguchi , Fumio Suzuki
IPC分类号： H01H85/041 , H01H85/046 , H01H85/06 , H01H85/08
CPC分类号： H01H85/0411 , H01H85/046
摘要： A chip fuse comprising an organic resin-made insulating substrate, a pair of electrodes formed at terminals of said organic resin-made insulating substrate, current protecting element wiring portions and a current protecting element positioned between said pair of electrodes and housed in said organic resin-made insulating substrate, said current protecting element having a thickness of 3-8 .mu.m and being supported on an organic resin layer having a high tracking resistance, and at least one space being formed at least on the current protecting element side, does not cause ignition nor smoking and is excellent in clearing characteristics.
摘要翻译：一种芯片熔丝，包括有机树脂制绝缘基板，在所述有机树脂制绝缘基板的端子处形成的一对电极，电流保护元件布线部分和位于所述一对电极之间的电流保护元件，并且容纳在所述有机树脂所述电流保护元件的厚度为3-8μm，并且被支撑在具有高跟踪电阻的有机树脂层上，并且至少一个至少形成在当前保护元件侧的空间不是引起点火或吸烟，清除特性极好。

12. 发明授权

US5932351A Heat resistant resin composition and adhesive sheet using the same 失效
标题翻译：耐热树脂组合物和使用其的粘合片
公开(公告)号：US5932351A
公开(公告)日：1999-08-03
申请号：US940009
申请日：1997-09-29
申请人： Eiichi Shinada , Yoshiyuki Tsuru , Takeshi Horiuchi
发明人： Eiichi Shinada , Yoshiyuki Tsuru , Takeshi Horiuchi
IPC分类号： C08L63/00 , C08L79/08 , H05K1/00 , H05K1/03 , H05K3/38 , H05K3/46 , B32B27/38 , C08F283/04
CPC分类号： H05K3/4626 , C08L63/00 , C08L79/08 , H05K1/0346 , H05K2201/0154 , H05K3/386 , H05K3/4676 , Y10T428/31511 , Y10T428/31551
摘要： A heat resistant resin composition comprising (a) a polyamide-imide resin and (b) a thermosetting resin component, said composition giving a cured product having a storage elastic modulus at 300.degree. C. of 30 MPa or more, provides an adhesive sheet showing excellent solder heat resistance.
摘要翻译：一种耐热树脂组合物，其包含（a）聚酰胺 - 酰亚胺树脂和（b）热固性树脂组分，所述组合物在300℃下的储能弹性模量为30MPa以上的固化产物提供了粘合片，优异的焊料耐热性。

13. 发明授权

US5178962A Metal-organic macromolecular synthetic resin composite and process for producing the same 失效
标题翻译：金属有机大分子合成树脂组合物及其制备方法
公开(公告)号：US5178962A
公开(公告)日：1993-01-12
申请号：US495268
申请日：1990-03-19
申请人： Toshio Miyamoto , Kunio Miyazaki , Ryuji Watanabe , Osamu Miura , Yukio Ookoshi , Yuichi Satsu , Michio Ohue , Shigeru Takahashi , Yoshiyuki Tsuru
发明人： Toshio Miyamoto , Kunio Miyazaki , Ryuji Watanabe , Osamu Miura , Yukio Ookoshi , Yuichi Satsu , Michio Ohue , Shigeru Takahashi , Yoshiyuki Tsuru
IPC分类号： B29C59/14 , C08J7/12 , C23C14/20 , H05K3/38
CPC分类号： C08J7/123 , B29C59/14 , C23C14/20 , C08J2379/08 , H05K3/381 , Y10T428/31678 , Y10T428/31699
摘要： A composite of metal and an organic film having a high adhesiveness without deterioration of film quality is provided by exposing the surface of organic film to at least one of chemically reactive gas phase molecules and gas phase ions thereby forming functional groups on the surface of organic film, and forming a metallic film thereon through the functional groups.

14. 发明授权

US06529650B1 Optical circuit board and method of manufacturing the same 失效
标题翻译：光电路板及其制造方法
公开(公告)号：US06529650B1
公开(公告)日：2003-03-04
申请号：US09582097
申请日：2000-06-22
申请人： Yoshiyuki Tsuru
发明人： Yoshiyuki Tsuru
IPC分类号： G02B612
CPC分类号： G02B6/3612 , G02B6/262 , G02B6/4214 , G02B6/43
摘要： An optical circuit substrate having optical fiber placed and fixed in the form of a circuit on one side or on both sides of a substrate can be prepared with good efficiency by providing thereto an optical interconnection portion which makes an area for optical connection smaller and registration between an optical element and optical fiber easy.
摘要翻译：通过提供光学互连部分，可以通过提供光学连接部分来制备具有以基板的一侧或两侧上的电路形式放置和固定的光纤的光电路基板，该光互连部分使得光连接的区域更小并且在光学元件和光纤容易。

15. 发明授权

US5935452A Resin composition and its use in production of multilayer printed circuit board 失效
标题翻译：树脂组合物及其在多层印刷电路板生产中的应用
公开(公告)号：US5935452A
公开(公告)日：1999-08-10
申请号：US188905
申请日：1998-11-10
申请人： Teiichi Inada , Yoshiyuki Tsuru , Shin Takanezawa
发明人： Teiichi Inada , Yoshiyuki Tsuru , Shin Takanezawa
IPC分类号： C08L13/00 , C08L33/08 , C08L63/00 , H05K1/03 , H05K3/00 , H05K3/46 , H01B13/00
CPC分类号： H05K3/4673 , C08L13/00 , C08L33/08 , C08L63/00 , H05K3/002 , H05K3/4655 , H05K2201/0133 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2201/0358 , H05K2203/063 , H05K2203/0759 , H05K2203/0783 , H05K2203/122 , H05K3/4644 , H05K3/4652
摘要： A resin composition comprising (a) an epoxy resin having a number average molecular weight of 1200 or less, (b) a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, (c) a curing agent for the epoxy resin, and (d) a curing accelerator is easily chemically etched and suitable as an insulating adhesive for producing multilayer printed circuit boards.
摘要翻译：一种树脂组合物，其包含（a）数均分子量为1200以下的环氧树脂，（b）含羧酸的丙烯酸或丁腈橡胶，（c）环氧树脂的固化剂和（d ）固化促进剂易于化学蚀刻并适合作为制造多层印刷电路板的绝缘粘合剂。

16. 发明授权

US4219927A Method of producing a multistylus head device 失效
标题翻译：生产多头头装置的方法
公开(公告)号：US4219927A
公开(公告)日：1980-09-02
申请号：US938784
申请日：1978-09-01
申请人： Naoki Fukutomi , Yoshiyuki Tsuru , Kunio Kawaguchi , Susumu Naoyuki
发明人： Naoki Fukutomi , Yoshiyuki Tsuru , Kunio Kawaguchi , Susumu Naoyuki
IPC分类号： G03G15/05 , B41J2/395 , G01D15/06 , H05K3/10
CPC分类号： G01D15/06 , B41J2/395 , Y10T29/49162 , Y10T29/49165
摘要： A multistylus head device which comprises a vast plurality of insulated wires embedded in an insulating substrate having through-holes. The present multistylus device is characterized in that the insulated wires have their respective free terminals exposed on one edge of said insulating substrate and disposed in parallel at predetermined equal intervals in close proximity to each other to form electrodes and have their other terminals exposed respectively on the inner walls of said through-holes; and said other exposed terminals of the insulated wires are connected respectively to metal layers electrolessly deposited on the inner walls of the through-holes. The present multistylus head device is compact in size and excellent in reliability of terminal connection and is capable of recording a transmitted information with high density of printing. The exposed disposition of the wires at their respective free terminals in a parallel state at predetermined equal intervals are skillfully realized according to the method of the present invention. Thus, the present device can be produced at low cost, with reliability of the function of the produced device and is suitable for mass-production.
摘要翻译：一种多回头装置，其包括嵌入具有通孔的绝缘基板中的大量绝缘电线。本发明的多级装置的特征在于，绝缘线具有各自的自由端子露出在所述绝缘基板的一个边缘上并以彼此相邻的预定相等的间隔平行设置，以形成电极并使其另一个端子分别暴露在所述通孔的内壁; 并且绝缘线的所述其他暴露端子分别连接到无电沉积在通孔的内壁上的金属层。本发明的多头头装置的尺寸紧凑，端子连接的可靠性优异，能够以高密度的印刷记录发送的信息。根据本发明的方法，巧妙地实现了以预定相等的间隔在其各自的自由端子处以平行状态暴露的配线。因此，本装置可以以低成本制造，具有所制造的装置的功能的可靠性并且适合于批量生产。

17. 发明授权

US06171280B2 Aspirator having dual inter-operating manipulation units 有权
标题翻译：具有双重操作操作单元的抽吸器
公开(公告)号：US06171280B2
公开(公告)日：2001-01-09
申请号：US09385853
申请日：1999-08-30
申请人： Masanori Imazu , Yoshiyuki Tsuru , Tadashi Bandou , Kazuya Fukuda
发明人： Masanori Imazu , Yoshiyuki Tsuru , Tadashi Bandou , Kazuya Fukuda
IPC分类号： A61M100
CPC分类号： G01N35/1079 , G01N35/1011
摘要： First and second aspirator manipulation units operate a single-pipette in a coagulation analyzer for aspirating plasma samples from both rubber-capped as well as uncapped vessels. A first holder in the first aspirator manipulation unit actually retains the pipette, while a second holder in the second aspirator manipulation unit is configured to enclose the first holder leaving a predetermined amount of play. To move the pipette toward a sample vessel in a rack that has been shifted into aspiration position, the holders in the manipulation units are inter-fitted, and are translated down. If the pipette strikes a cap, a sensing means in the first aspirator manipulation unit signals a controller to operate the first aspirator manipulation unit to back the pipette upward slightly. Thereupon, the controller, via the second aspirator manipulation unit, actuates the second holder alone to press on the first holder to stab the pipette through the cap. For this operation, the pipette tip is cut obliquely and the rim of its inner wall is specially chamfered to prevent the punctured rubber in the cap from clogging the tip. After the pipette aspirates an aliquot of the plasma sample, the controller actuates the second holder in reverse to draw the pipette out from the cap. The first aspirator manipulation unit carries out other pipette manipulation operations alone. Accordingly, the pipette is driven differentially in accordance with the capped/uncapped status of the vessel present in the aspiration position.
摘要翻译：第一和第二抽吸器操纵单元在凝血分析仪中操作单移液管，用于从橡胶盖以及未加盖的容器吸出血浆样品。第一抽吸器操作单元中的第一保持器实际上保持移液管，而第二抽吸器操纵单元中的第二保持器构造成围绕第一保持器留下预定量的游隙。为了将移液管移动到已经移入吸气位置的支架上的样品容器中，操作单元中的保持器相互配合并向下翻转。如果移液管撞击帽，则第一吸气器操纵单元中的感测装置发出信号，控制器操作第一吸气器操作单元以稍微向上回吸移液管。于是，控制器经由第二吸气器操纵单元致动第二保持器单独按压在第一保持器上以将移液管刺穿帽盖。对于这种操作，移液管尖端倾斜切割，其内壁的边缘被特别倒角，以防止帽中的刺穿橡胶堵塞尖端。在吸管吸出等离子体样品的等分试样之后，控制器反向驱动第二个保持器，以将吸管从盖中抽出。第一抽吸器操作单元仅执行其他移液管操作操作。因此，移液管根据存在于抽吸位置中的容器的封盖/未加盖状态而差分驱动。

18. 发明授权

US6121553A Circuit boards using heat resistant resin for adhesive layers 失效
标题翻译：使用耐热树脂的电路板用于粘合剂层
公开(公告)号：US6121553A
公开(公告)日：2000-09-19
申请号：US957011
申请日：1997-10-23
申请人： Eiichi Shinada , Masao Kanno , Yuuichi Shimayama , Yoshiyuki Tsuru , Takeshi Horiuchi
发明人： Eiichi Shinada , Masao Kanno , Yuuichi Shimayama , Yoshiyuki Tsuru , Takeshi Horiuchi
IPC分类号： H01L23/498 , H05K3/00 , H05K3/10 , H05K3/38 , H05K3/42 , H05K3/46 , H05K1/03
CPC分类号： H05K3/4697 , H01L23/49894 , H05K3/103 , H05K3/386 , H05K3/4626 , H05K3/4655 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49109 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01019 , H01L2924/01039 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/3011 , H01L2924/30111 , H05K2201/0154 , H05K2201/0355 , H05K2201/09127 , H05K2201/10287 , H05K2203/063 , H05K3/0035 , H05K3/0094 , H05K3/429 , H05K3/4602 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917
摘要： An adhesive composition including (a) a polyamide-imide resin preferably having a molecular weight of 80,000 or more and (b) a thermosetting component preferably including an epoxy resin and a curing agent and/or a curing accelerator therefor is used for providing an insulating adhesive layer having a storage elastic modulus at 300.degree. C. of 30 MPa or more and a glass transition temperature of 180.degree. C. or higher. The insulating adhesive is suitable for use in wire scribed circuit boards, multilayer printed circuit boards, and circuit boards for chip carriers.
摘要翻译：一种粘合剂组合物，其包含（a）优选分子量为80,000以上的聚酰胺 - 酰亚胺树脂和（b）优选包含环氧树脂和固化剂的热固性组分和/或其固化促进剂，用于提供绝缘在300℃下的储能弹性模量为30MPa以上，玻璃化转变温度为180℃以上的粘合剂层。绝缘粘合剂适用于线切割电路板，多层印刷电路板和芯片载体的电路板。

19. 发明授权

US5874009A Multilayer printed circuit board with epoxy resin and carboxylated rubber as adhesive 失效
标题翻译：多层印刷电路板采用环氧树脂和羧化橡胶作粘合剂
公开(公告)号：US5874009A
公开(公告)日：1999-02-23
申请号：US514739
申请日：1995-08-14
申请人： Teiichi Inada , Yoshiyuki Tsuru , Shin Takanezawa
发明人： Teiichi Inada , Yoshiyuki Tsuru , Shin Takanezawa
IPC分类号： C08L13/00 , C08L33/08 , C08L63/00 , H05K1/03 , H05K3/00 , H05K3/46 , B32B7/12 , B32B27/04 , B32B27/38
CPC分类号： H05K3/4673 , C08L13/00 , C08L33/08 , C08L63/00 , H05K3/002 , H05K3/4655 , H05K2201/0133 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2201/0358 , H05K2203/063 , H05K2203/0759 , H05K2203/0783 , H05K2203/122 , H05K3/4644 , H05K3/4652
摘要： A multilayered printed circuit board is produced by (a) forming a resin layer on an inner circuit substrate and abrading it to expose the circuit conductors, (b) contacting a copper foil having a layer of insulating adhesive composed of an epoxy resin, a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, a curing agent and accelerator with the resin layer and exposed circuit conductors, (c) removing portions necessary for connection with the copper foil and insulating adhesive exposed to the holes by etching, (d) connecting the copper foil with circuits exposed to the holes and forming a surface circuit by processing the outer layer of the copper foil, and (e) repeating steps (a) to (d) to obtained a multilayered structure.
摘要翻译：通过（a）在内部电路基板上形成树脂层并研磨以暴露电路导体，（b）使具有由环氧树脂，羧酸的绝缘粘合剂层的铜箔接触而制造多层印刷电路板含酸的丙烯酸或丙烯腈 - 丁二烯橡胶，具有树脂层和暴露的电路导体的固化剂和加速剂，（c）去除与铜箔连接所需的部分和通过蚀刻暴露于孔的绝缘胶，（d）连接具有暴露于孔的电路的铜箔，通过加工铜箔的外层形成表面电路，以及（e）重复步骤（a）至（d）以获得多层结构。

20. 发明授权

US4842899A Process for forming metallic film on inorganic material 失效
标题翻译：在无机材料上形成金属膜的方法
公开(公告)号：US4842899A
公开(公告)日：1989-06-27
申请号：US32511
申请日：1987-03-31
申请人： Yoshiyuki Tsuru , Toshiro Okamura , Tetsuya Okishima , Masayoshi Ikeda , Masahiro Kawamura
发明人： Yoshiyuki Tsuru , Toshiro Okamura , Tetsuya Okishima , Masayoshi Ikeda , Masahiro Kawamura
IPC分类号： C23C18/18 , H05K3/38
CPC分类号： C23C18/1893 , C23C18/1865 , H05K3/381
摘要： A metallic film can be formed on a ceramic surface with high adhesive strength by roughening the ceramic surface by (a) dissolving and removing a vitreous substance and (b) roughening a substance constituting mainly a first surface layer, followed by conventional electroless plating.
摘要翻译：通过（a）溶解和除去玻璃质物质和（b）使主要构成第一表面层的物质粗糙化，然后进行常规的化学镀，可以通过使陶瓷表面粗糙化而在具有高粘合强度的陶瓷表面上形成金属膜。

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