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    • 11. 发明授权
    • Semiconductor integrated circuit device, memory module and storage device
    • 半导体集成电路器件,存储器模块和存储器件
    • US06538929B2
    • 2003-03-25
    • US09987189
    • 2001-11-13
    • Mitsuru HirakiShoji Shukuri
    • Mitsuru HirakiShoji Shukuri
    • G11C1604
    • G11C7/08G11C7/20G11C7/22G11C11/406G11C11/40615G11C11/4072G11C11/4074G11C16/06G11C16/20G11C16/30G11C29/02G11C29/021G11C29/026G11C29/028G11C29/4401G11C29/50012G11C29/70G11C2029/0401G11C2029/1208
    • A semiconductor integrated circuit device is provided which includes a central processing unit, an electrically reprogrammable nonvolatile memory and a volatile memory while sharing a data bus, and utilizes stored information of the nonvolatile memory to repair a defect of the volatile memory. This volatile memory includes a volatile storage circuit for latching repair information for repairing a defective normal memory cell with a redundancy memory cell. The nonvolatile memory reads out the repair information from itself in response to an instruction to initialize the semiconductor integrated circuit device. In response to the initializing instruction, the volatile storage circuit latches the repair information from the nonvolatile memory. A fuse program circuit is not needed for the defect repair, but a defect which occurs after burn-in can be newly repaired so that the new defect can be repaired even after the packaging is formed over a circuit substrate.
    • 提供一种半导体集成电路装置,其包括中央处理单元,电可重新编程的非易失性存储器和易失性存储器,同时共享数据总线,并且利用非易失性存储器的存储信息来修复易失性存储器的缺陷。 这种易失性存储器包括一个易失性存储电路,用于锁存修复信息以用冗余存储单元修复有缺陷的正常存储单元。 非易失性存储器响应于初始化半导体集成电路器件的指令从其自身读出修复信息。 响应于初始化指令,易失性存储电路锁存来自非易失性存储器的修复信息。 缺陷修复不需要保险丝编程电路,但是可以重新修复在老化之后发生的缺陷,使得即使在电路基板上形成封装之后,也可以修复新的缺陷。
    • 14. 发明授权
    • Method for repairing semiconductor integrated circuit device
    • 半导体集成电路器件修复方法
    • US06341090B1
    • 2002-01-22
    • US09497119
    • 2000-02-03
    • Mitsuru HirakiShoji Shukuri
    • Mitsuru HirakiShoji Shukuri
    • G11C700
    • G11C16/06
    • To improve the efficiency for repairing a defect of a large-scale integrated circuit. A semiconductor integrated circuit device comprises, a central processing unit (10), an electrically reprogrammable nonvolatile memory (11) and a volatile memory (12, 13) while sharing a data bus (16), and utilizes the stored information of the nonvolatile memory so as to repair a defect of the volatile memory. This volatile memory includes a volatile storage circuit (12AR, 13AR) for latching the repair information for repairing a defective normal memory cell with a redundancy memory cell. The nonvolatile memory reads out the repair information from itself in response to an instruction to initialize the semiconductor integrated circuit device. In response to the initializing instruction, the volatile storage circuit latches the repair information from the nonvolatile memory. Any fuse program circuit is not needed for the detect repair, but a defect to occur after a burn-in can be newly repaired so that the new defect can be repaired even after the packaging over a circuit substrate.
    • 一种半导体集成电路装置,包括中央处理单元(10),电可再编程非易失性存储器(11)和易失性存储器(12,13),同时共享 数据总线(16),并且利用所存储的非易失性存储器的信息来修复易失性存储器的缺陷。 这种易失性存储器包括一个易失性存储电路(12AR,13AR),用于通过冗余存储器单元锁存用于修复有缺陷的正常存储单元的修复信息。 非易失性存储器响应于初始化半导体集成电路器件的指令从其自身读出修复信息。 响应于初始化指令,易失性存储电路锁存来自非易失性存储器的修复信息。 任何保险丝编程电路不需要用于检测修复,但是可以重新修复在老化之后发生的缺陷,使得即使在电路基板上的封装之后也可以修复新的缺陷。
    • 16. 发明授权
    • Semiconductor integrated circuit device, memory module and storage device
    • 半导体集成电路器件,存储器模块和存储器件
    • US06201733B1
    • 2001-03-13
    • US09435035
    • 1999-11-05
    • Mitsuru HirakiShoji Shukuri
    • Mitsuru HirakiShoji Shukuri
    • G11C1604
    • G11C16/06
    • To improve the efficiency for repairing a defect of a large-scale integrated circuit, a semiconductor integrated circuit device is formed of, a central processing unit (10), an electrically reprogrammable nonvolatile memory (11) and a volatile memory (12, 13) while sharing a data bus (16), and utilizes stored information of the nonvolatile memory to repair a defect of the volatile memory. This volatile memory includes a volatile storage circuit (12AR, 13AR) for latching repair information for repairing a defective normal memory cell with a redundancy memory cell. The nonvolatile memory reads out the repair information from itself in response to an instruction to initialize the semiconductor integrated circuit device. In response to the initializing instruction, the volatile storage circuit latches the repair information from the nonvolatile memory. No fuse program circuit is not needed for the detect repair, and a defect which occurs after a burn-in can be newly repaired so that the new defect can be repaired, even after the packaging over a circuit substrate.
    • 为了提高修复大规模集成电路的缺陷的效率,半导体集成电路器件由中央处理单元(10),电可重新编程的非易失性存储器(11)和易失性存储器(12,13)构成, 同时共享数据总线(16),并利用非易失性存储器的存储信息来修复易失性存储器的缺陷。 这种易失性存储器包括一个易失性存储电路(12AR,13AR),用于通过冗余存储单元来锁定用于修复有缺陷的正常存储单元的修复信息。 非易失性存储器响应于初始化半导体集成电路器件的指令从其自身读出修复信息。 响应于初始化指令,易失性存储电路锁存来自非易失性存储器的修复信息。 不需要保险丝编程电路进行检测修复,并且可以重新修复在老化之后发生的缺陷,使得即使在电路基板上的封装之后也可以修复新的缺陷。
    • 18. 发明申请
    • NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20120112265A1
    • 2012-05-10
    • US13350703
    • 2012-01-13
    • Natsuo AJIKAShoji ShukuriSatoshi ShimizuTaku Ogura
    • Natsuo AJIKAShoji ShukuriSatoshi ShimizuTaku Ogura
    • H01L29/792H01L21/336
    • H01L27/11568G11C16/0441G11C16/0491H01L21/26586H01L29/792
    • A non-volatile semiconductor device includes an n type well formed in a semiconductor substrate having a surface, the surface having a plurality of stripe shaped grooves and a plurality of stripe shaped ribs, a plurality of stripe shaped p type diffusion regions formed in upper parts of each of the plurality of ribs, the plurality of stripe shaped p type diffusion regions being parallel to a longitudinal direction of the ribs, a tunneling insulation film formed on the grooves and the ribs, a charge storage layer formed on the tunneling insulating film, a gate insulation film formed on the charge storage layer, and a plurality of stripe shaped conductors formed on the gate insulating film, the plurality of stripe shaped conductors arranged in a direction intersecting the longitudinal direction of the ribs with a predetermined interval wherein an impurity diffusion structure in the ribs are asymmetric.
    • 非易失性半导体器件包括在具有表面的半导体衬底中形成的n型阱,表面具有多个条形槽和多个条状肋,多个条形p型扩散区形成在上部 所述多个条状p型扩散区域与所述肋的长度方向平行,形成在所述槽和所述肋上的隧道绝缘膜,形成在所述隧道绝缘膜上的电荷存储层, 形成在电荷存储层上的栅极绝缘膜和形成在栅极绝缘膜上的多个条状导体,所述多个条状导体沿着与肋的纵向相交的方向以预定间隔布置,其中杂质扩散 肋骨中的结构是不对称的。
    • 20. 发明申请
    • Non-Volatile Semiconductor Memory Device
    • 非易失性半导体存储器件
    • US20090090961A1
    • 2009-04-09
    • US12246193
    • 2008-10-06
    • Natsuo AjikaShoji ShukuriSatoshi ShimizuTaku Ogura
    • Natsuo AjikaShoji ShukuriSatoshi ShimizuTaku Ogura
    • H01L29/792H01L21/336
    • H01L27/11568G11C16/0441G11C16/0491H01L21/26586H01L29/792
    • A non-volatile semiconductor device includes an n type well formed in a semiconductor substrate having a surface, the surface having a plurality of stripe shaped grooves and a plurality of stripe shaped ribs, a plurality of stripe shaped p type diffusion regions formed in upper parts of each of the plurality of ribs, the plurality of stripe shaped p type diffusion regions being parallel to a longitudinal direction of the ribs, a tunneling insulation film formed on the grooves and the ribs, a charge storage layer formed on the tunneling insulating film, a gate insulation film formed on the charge storage layer, and a plurality of stripe shaped conductors formed on the gate insulating film, the plurality of stripe shaped conductors arranged in a direction intersecting the longitudinal direction of the ribs with a predetermined interval wherein an impurity diffusion structure in the ribs are asymmetric.
    • 非易失性半导体器件包括在具有表面的半导体衬底中形成的n型阱,表面具有多个条形槽和多个条状肋,多个条形p型扩散区形成在上部 所述多个条状p型扩散区域与所述肋的长度方向平行,形成在所述槽和所述肋上的隧道绝缘膜,形成在所述隧道绝缘膜上的电荷存储层, 形成在电荷存储层上的栅极绝缘膜和形成在栅极绝缘膜上的多个条状导体,所述多个条状导体沿着与肋的纵向相交的方向以预定间隔布置,其中杂质扩散 肋骨中的结构是不对称的。