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    • 19. 发明授权
    • Soldering equipment and soldering method for electronic components
    • 焊接设备及焊接方法
    • US08011562B2
    • 2011-09-06
    • US12600399
    • 2009-08-29
    • Hisao IshikawaMasanori Yokoyama
    • Hisao IshikawaMasanori Yokoyama
    • B23K31/02
    • B23K1/085B23K1/0016B23K3/0653B23K2101/42B23K2103/12C22B25/08H05K3/3468
    • A tin or solder alloy film is formed by ejecting molten tin liquid or molten solder alloy liquid in a jet state onto a copper surface of an electronic component. The overflowing molten tin or molten solder alloy liquid is transported to a stirrer. Then, cuprate and the like mixed in the overflowing molten tin or molten solder alloy liquid are taken in to the organic fatty acid solution by fiercely stirring and mixing the molten tin or molten solder alloy liquid in contact with a solution at a temperature of 180 to 350° C. containing 1 to 80 weight % of organic fatty acid having 12 to 20 carbon number that circulates in the stirrer to purify the overflowing molten tin or molten solder alloy liquid. The mixed solution is introduced into a reservoir of the organic fatty acid solution, and the purified molten tin solution or molten solder alloy liquid separated according to the specific gravity difference in the reservoir of the organic fatty acid solution is returned from the bottom of the organic fatty acid solution reservoir to the reservoir of the molten tin or molten solder liquid by a pump for circulation use. By means of this, copper is prevented from accumulating in the molten tin or molten solder liquid, and thus it is possible to continuously perform a stable soldering process for a long term.
    • 通过将喷射状态的熔融锡液体或熔融焊料合金液体喷射到电子部件的铜表面上来形成锡或焊料合金膜。 将溢出的熔融锡或熔融的焊料合金液体输送到搅拌器。 然后,在溢出的熔融锡或熔融的焊料合金液中混合的铜酸盐等通过在与180℃的温度下与溶液接触的熔融锡或熔融焊料合金液体剧烈搅拌和混合而被吸入有机脂肪酸溶液中 350℃,含有1至80重量%的具有12至20个碳数的有机脂肪酸,其在搅拌器中循环以净化溢出的熔融锡或熔融的焊料合金液体。 将混合溶液引入有机脂肪酸溶液的储存器中,并且根据有机脂肪酸溶液的储存器中的比重差分离的纯化的熔融锡溶液或熔融的焊料合金液体从有机脂肪酸溶液的底部返回 通过用于循环使用的泵将脂肪酸溶液储存在熔融锡或熔融焊料液体的储存器中。 借此,可以防止铜在熔融锡或熔融焊料液中积聚,从而可以长期连续地进行稳定的焊接工艺。