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11. 发明申请

US20140048108A9 METHOD OF DIELECTRIC FILM TREATMENT 有权
标题翻译：电介质膜处理方法
公开(公告)号：US20140048108A9
公开(公告)日：2014-02-20
申请号：US12048188
申请日：2008-03-13
申请人： Seokmin Yun , Ji Zhu , John M. deLarios , Mark Wilcoxson
发明人： Seokmin Yun , Ji Zhu , John M. deLarios , Mark Wilcoxson
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , H01L21/02063 , H01L21/3105 , H01L21/31058 , H01L21/31138
摘要： A method and system for cleaning a surface of a substrate after an etching operation includes determining a plurality of process parameters associated with the surface of the substrate. The process parameters define characteristics related to the surface of the substrate such as characteristics of the substrate surface to be cleaned, contaminants to be removed, features formed on the substrate and chemicals used in the fabrication operations. A plurality of application chemistries are identified based on the process parameters. The plurality of application chemistries includes a first application chemistry as an emulsion having a first immiscible liquid combined with a second immiscible liquid and solid particles distributed within the first immiscible liquid. The plurality of application chemistries including the first application chemistry are applied to the surface of the substrate such that the combined chemistries enhance the cleaning process by substantially removing the particulate and polymer residue contaminants from the surface of the substrate while preserving the characteristics of the features and of the low-k dielectric material through which the features are formed.
摘要翻译：用于在蚀刻操作之后清洁衬底表面的方法和系统包括确定与衬底的表面相关联的多个工艺参数。工艺参数定义与衬底表面相关的特性，例如待清洁的衬底表面的特性，待除去的污染物，在衬底上形成的特征以及在制造操作中使用的化学品。基于工艺参数识别多个应用化学物质。多种应用化学品包括作为乳液的第一应用化学品，其具有与第一不混溶液体组合的第一不混溶液体和分散在第一不混溶液体内的固体颗粒。包括第一应用化学物质的多种施加化学物质被施加到基底的表面，使得组合的化学物质通过从衬底的表面基本上除去颗粒和聚合物残留的污染物同时保持特征的特征而增强了清洁过程，通过其形成特征的低k电介质材料。

12. 发明授权

US08388762B2 Substrate cleaning technique employing multi-phase solution 失效
标题翻译：使用多相溶液的基板清洗技术
公开(公告)号：US08388762B2
公开(公告)日：2013-03-05
申请号：US11743283
申请日：2007-05-02
申请人： Erik M. Freer , John M. deLarios , Michael Ravkin , Mikhail Korolik , Fritz C. Redeker
发明人： Erik M. Freer , John M. deLarios , Michael Ravkin , Mikhail Korolik , Fritz C. Redeker
IPC分类号： B08B3/04
CPC分类号： H01L21/02057 , H01L21/02052 , H01L21/67034 , H01L21/67057 , H01L21/67751
摘要： A method and system for cleaning opposed surfaces of a semiconductor wafer having particulate matter thereon. The method includes generating relative movement between a fluid and the substrate. The relative movement is in a direction that is transverse to a normal to one of the opposed surfaces and creates two spaced-apart flows. Each of the flows is adjacent to one of the opposed surfaces that is different from the opposed surface that is adjacent to the remaining flow of the plurality of flows. The fluid has coupling elements entrained therein, and the relative movement is established to impart sufficient drag upon a subset of the coupling elements to create movement of the coupling elements of the subset within the fluid. In this manner, a quantity of the drag is imparted upon the particulate matter to cause the particulate matter to move with respect to the substrate.
摘要翻译：一种用于清洁其上具有颗粒物质的半导体晶片的相对表面的方法和系统。该方法包括产生流体和衬底之间的相对运动。相对运动在与相对表面之一的法线横向的方向上，并且产生两个间隔开的流动。每个流体与相对于与多个流动的剩余流动相邻的相对表面不同的一个相对表面相邻。流体具有夹带在其中的耦合元件，并且建立相对运动以在联接元件的子集上施加足够的阻力以产生该流体内该子集的耦合元件的运动。以这种方式，将一定量的阻力赋予颗粒物质以使颗粒物质相对于基底移动。

13. 发明授权

US07967916B2 Method of preventing pattern collapse during rinsing and drying 有权
标题翻译：防止漂洗和干燥期间图案塌陷的方法
公开(公告)号：US07967916B2
公开(公告)日：2011-06-28
申请号：US12048412
申请日：2008-03-14
申请人： Seokmin Yun , John M. deLarios
发明人： Seokmin Yun , John M. deLarios
IPC分类号： B08B3/00 , B08B5/04
CPC分类号： H01L21/67051 , H01L21/02057 , H01L21/67028 , Y10S134/902
摘要： A system and method for preventing a pattern formed on a substrate from collapsing during a rinsing and drying phase of a fabrication operation includes determining a plurality of process parameters associated with a rinsing chemistry used during the rinsing operation. The process parameters define the characteristics of the rinsing chemistry and a substrate surface layer. A chemistry to reduce the surface tension of the rinsing chemistry (surface tension reducer) with at least one low surfactant chemical is identified based on the process parameters of the rinsing chemistry. The surface tension reducer is applied to the surface of the substrate such that the low surfactant chemical reduces the surface tension of the rinsing chemistry applied to the surface of the substrate thereby preventing the pattern from collapsing.
摘要翻译：用于防止在制造操作的漂洗和干燥阶段期间形成在衬底上的图案塌陷的系统和方法包括确定与漂洗操作期间使用的漂洗化学相关联的多个工艺参数。工艺参数定义漂洗化学品的特征和基材表面层。基于漂洗化学品的工艺参数，确定了用至少一种低表面活性剂化学品降低漂洗化学物（表面张力减小剂）表面张力的化学物质。将表面张力减小剂施加到基材的表面，使得低表面活性剂化学品降低施加到基材表面的漂洗化学品的表面张力，从而防止图案塌陷。

14. 发明申请

US20100206340A1 Method for Removing Contamination from a Substrate and for Making a Cleaning Solution 有权
标题翻译：从基材去除污染物和清洁溶液的方法
公开(公告)号：US20100206340A1
公开(公告)日：2010-08-19
申请号：US12768349
申请日：2010-04-27
申请人： Erik M. Freer , John M. deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
发明人： Erik M. Freer , John M. deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
IPC分类号： B08B3/00
CPC分类号： H01L21/02052 , B08B7/02 , C11D9/00 , C11D9/02 , C11D9/267 , C11D11/0047 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/42 , H01L21/02057 , H01L21/02096
摘要： A method is provided for removing contamination from a substrate. The method includes applying a cleaning solution having a dispersed phase, a continuous phase and particles dispersed within the continuous phase to a surface of the substrate. The method includes forcing one of the particles dispersed within the continuous phase proximate to one of the surface contaminants. The forcing is sufficient to overcome any repulsive forces between the particles and the surface contaminants so that the one of the particles and the one of the surface contaminants are engaged. The method also includes removing the engaged particle and surface contaminant from the surface of the substrate. A process to manufacture the cleaning material is also provided.
摘要翻译：提供了一种用于从衬底去除污染物的方法。该方法包括将具有分散相，连续相和分散在连续相内的颗粒的清洗溶液施加到基材的表面。该方法包括迫使分散在连续相内的颗粒中的一种接近一种表面污染物。强制足以克服颗粒和表面污染物之间的任何排斥力，使得颗粒中的一个和表面污染物之一接合。该方法还包括从基材的表面除去接合的颗粒和表面污染物。还提供了制造清洁材料的方法。

15. 发明申请

US20080271749A1 Substrate cleaning technique employing multi-phase solution 失效
标题翻译：使用多相溶液的基板清洗技术
公开(公告)号：US20080271749A1
公开(公告)日：2008-11-06
申请号：US11743283
申请日：2007-05-02
申请人： Erik M. Freer , John M. deLarios , Michael Ravkin , Mikhail Korolik , Fritz C. Redeker
发明人： Erik M. Freer , John M. deLarios , Michael Ravkin , Mikhail Korolik , Fritz C. Redeker
IPC分类号： C25F3/30 , B08B3/00 , B08B3/10
CPC分类号： H01L21/02057 , H01L21/02052 , H01L21/67034 , H01L21/67057 , H01L21/67751
摘要： A method and system for cleaning opposed surfaces of a semiconductor wafer having particulate matter thereon. The method includes generating relative movement between a fluid and the substrate. The relative movement is in a direction that is transverse to a normal to one of the opposed surfaces and creates two spaced-apart flows. Each of the flows is adjacent to one of the opposed surfaces that is different from the opposed surface that is adjacent to the remaining flow of the plurality of flows. The fluid has coupling elements entrained therein, and the relative movement is established to impart sufficient drag upon a subset of the coupling elements to create movement of the coupling elements of the subset within the fluid. In this manner, a quantity of the drag is imparted upon the particulate matter to cause the particulate matter to move with respect to the substrate.
摘要翻译：一种用于清洁其上具有颗粒物质的半导体晶片的相对表面的方法和系统。该方法包括产生流体和衬底之间的相对运动。相对运动在与相对表面之一的法线横向的方向上，并且产生两个间隔开的流动。每个流体与相对于与多个流动的剩余流动相邻的相对表面不同的一个相对表面相邻。流体具有夹带在其中的耦合元件，并且建立相对运动以在联接元件的子集上施加足够的阻力以产生该流体内该子集的耦合元件的运动。以这种方式，将一定量的阻力赋予颗粒物质以使颗粒物质相对于基底移动。

16. 发明授权

US06200201B1 Cleaning/buffer apparatus for use in a wafer processing device 失效
标题翻译：用于晶片处理装置的清洁/缓冲装置
公开(公告)号：US06200201B1
公开(公告)日：2001-03-13
申请号：US09009583
申请日：1998-01-20
申请人： Mikhael Ravkin , John M. deLarios , Xiuhua Zhang , Thomas R. Gockel
发明人： Mikhael Ravkin , John M. deLarios , Xiuhua Zhang , Thomas R. Gockel
IPC分类号： B24B700
CPC分类号： H01L21/67046 , B08B1/04 , B24B29/02 , B24B37/04 , H01L21/67028
摘要： A semiconductor processing system, such as a system for buffing or scrubbing both sides of a wafer at the same time, that includes a processing box for use with chemical solutions, a positioning device to position a semiconductor substrate, or other similar semiconductor material or device, and a placement device to place a buffing pad or scrubbing brush.
摘要翻译：半导体处理系统，例如用于同时抛光或擦洗晶片两面的系统，其包括用于化学溶液的处理盒，定位装置以定位半导体衬底或其它类似的半导体材料或器件以及放置装置以放置抛光垫或擦洗刷。

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