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    • 13. 发明授权
    • Collapsable gate for deposited nanostructures
    • 用于沉积的纳米结构的可折叠门
    • US08492748B2
    • 2013-07-23
    • US13169542
    • 2011-06-27
    • Josephine B. ChangPaul ChangMichael A. GuillornPhilip S. Waggoner
    • Josephine B. ChangPaul ChangMichael A. GuillornPhilip S. Waggoner
    • H01L29/06H01L31/00H01L29/15H01L51/40
    • H01L29/66045H01L51/055
    • A disposable material layer is first deposited on a graphene layer or a carbon nanotube (CNT). The disposable material layer includes a material that is less inert than graphene or CNT so that a contiguous dielectric material layer can be deposited at a target dielectric thickness without pinholes therein. A gate stack is formed by patterning the contiguous dielectric material layer and a gate conductor layer deposited thereupon. The disposable material layer shields and protects the graphene layer or the CNT during formation of the gate stack. The disposable material layer is then removed by a selective etch, releasing a free-standing gate structure. The free-standing gate structure is collapsed onto the graphene layer or the CNT below at the end of the selective etch so that the bottom surface of the contiguous dielectric material layer contacts an upper surface of the graphene layer or the CNT.
    • 一次性材料层首先沉积在石墨烯层或碳纳米管(CNT)上。 一次性材料层包括比石墨烯或CNT更不惰性的材料,使得可以以目标电介质厚度沉积连续的电介质材料层而没有针孔。 通过图案化连续的介电材料层和沉积在其上的栅极导体层来形成栅极叠层。 一次性材料层在形成栅极叠层期间屏蔽并保护石墨烯层或CNT。 然后通过选择性蚀刻去除一次性材料层,释放独立的栅极结构。 独立栅极结构在选择性蚀刻结束时在石墨烯层或CNT上折叠,使得连续介电材料层的底表面接触石墨烯层或CNT的上表面。
    • 14. 发明授权
    • Compressive (PFET) and tensile (NFET) channel strain in nanowire FETs fabricated with a replacement gate process
    • 用替代栅极工艺制造的纳米线FET中的压电(PFET)和拉伸(NFET)沟道应变
    • US08492208B1
    • 2013-07-23
    • US13344352
    • 2012-01-05
    • Guy CohenMichael A. GuillornConal Eugene Murray
    • Guy CohenMichael A. GuillornConal Eugene Murray
    • H01L21/00H01L29/76
    • H01L29/775B82Y10/00B82Y40/00H01L29/66439
    • A method of fabricating a FET device is provided which includes the following steps. Nanowires/pads are formed in a SOI layer over a BOX layer, wherein the nanowires are suspended over the BOX. A HSQ layer is deposited that surrounds the nanowires. A portion(s) of the HSQ layer that surround the nanowires are cross-linked, wherein the cross-linking causes the portion(s) of the HSQ layer to shrink thereby inducing strain in the nanowires. One or more gates are formed that retain the strain induced in the nanowires. A FET device is also provided wherein each of the nanowires has a first region(s) that is deformed such that a lattice constant in the first region(s) is less than a relaxed lattice constant of the nanowires and a second region(s) that is deformed such that a lattice constant in the second region(s) is greater than the relaxed lattice constant of the nanowires.
    • 提供一种制造FET器件的方法,其包括以下步骤。 纳米线/焊盘形成在BOX层上的SOI层中,其中纳米线悬挂在BOX上。 沉积围绕纳米线的HSQ层。 围绕纳米线的HSQ层的一部分交联,其中交联导致HSQ层的一部分收缩,从而诱导纳米线中的应变。 形成一个或多个保持在纳米线中诱发的应变的栅极。 还提供了一种FET器件,其中每个纳米线具有变形的第一区域,使得第一区域中的晶格常数小于纳米线的松弛晶格常数和第二区域, 其变形使得第二区域中的晶格常数大于纳米线的松弛晶格常数。
    • 17. 发明授权
    • Single gate inverter nanowire mesh
    • 单门逆变器纳米线网
    • US08084308B2
    • 2011-12-27
    • US12470128
    • 2009-05-21
    • Josephine ChangPaul ChangMichael A. GuillornJeffrey Sleight
    • Josephine ChangPaul ChangMichael A. GuillornJeffrey Sleight
    • H01L21/00H01L21/84H01L27/148H01L27/105
    • H01L27/1203H01L27/092H01L29/0673H01L29/42392H01L29/78696Y10S977/762Y10S977/938
    • Nanowire-based devices are provided. In one aspect, a field-effect transistor (FET) inverter is provided. The FET inverter includes a plurality of device layers oriented vertically in a stack, each device layer having a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region, wherein the source and drain regions of one or more of the device layers are doped with an n-type dopant and the source and drain regions of one or more other of the device layers are doped with a p-type dopant; a gate common to each of the device layers surrounding the nanowire channels; a first contact to the source regions of the one or more device layers doped with an n-type dopant; a second contact to the source regions of the one or more device layers doped with a p-type dopant; and a third contact common to the drain regions of each of the device layers. Techniques for fabricating a FET inverter are also provided.
    • 提供基于纳米线的设备。 一方面,提供了场效应晶体管(FET)逆变器。 FET反相器包括在堆叠中垂直取向的多个器件层,每个器件层具有源极区,漏极区和连接源极区和漏极区的多个纳米线通道,其中一个或多个 更多的器件层掺杂有n型掺杂剂,并且器件层中的一个或多个其它器件层的源极和漏极区掺杂有p型掺杂剂; 围绕纳米线通道的每个器件层共用的栅极; 与掺杂有n型掺杂剂的一个或多个器件层的源极区的第一接触; 与掺杂有p型掺杂剂的一个或多个器件层的源极区的第二接触; 以及每个器件层的漏极区域共同的第三接触。 还提供了用于制造FET逆变器的技术。