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11. 发明申请

US20070209593A1 Semiconductor wafer cooling device 审中-公开
标题翻译：半导体晶圆冷却装置
公开(公告)号：US20070209593A1
公开(公告)日：2007-09-13
申请号：US11369773
申请日：2006-03-07
申请人： Ravinder Aggarwal , Jim Kusbel
发明人： Ravinder Aggarwal , Jim Kusbel
IPC分类号： H01L21/677 , C23C16/00
CPC分类号： C23C16/54 , H01L21/67167 , H01L21/67196 , H01L21/68707
摘要： This invention relates to an apparatus and a method for cooling a semiconductor wafer while it is being transferred from one station to another. More particularly, the invention relates to an active cooling system in the end effecter of a robot used for moving a semiconductor wafer from one process station to another.
摘要翻译：本发明涉及一种半导体晶片在从一个工位转移到另一个工位时进行冷却的装置和方法。更具体地，本发明涉及用于将半导体晶片从一个处理站移动到另一个处理站的机器人的末端执行器中的主动冷却系统。

12. 发明申请

US20060154385A1 Fabrication pathway integrated metrology device 审中-公开
标题翻译：制造路径综合计量装置
公开(公告)号：US20060154385A1
公开(公告)日：2006-07-13
申请号：US11031479
申请日：2005-01-07
申请人： Ravinder Aggarwal
发明人： Ravinder Aggarwal
IPC分类号： H01L21/66
CPC分类号： H01L21/67253 , H01L21/67167 , H01L21/67724 , H01L21/67775 , H01L22/20
摘要： An in-line, non-freestanding substrate measurement system is integrated into the substrate fabrication pathway. One embodiment includes a metrology device integrated into a guided vehicle. Another embodiment provides a system for simultaneously measuring both sides of a substrate. A metrology device may be integrated into the front handling chamber of a process tool. Other embodiments provide methods for the measurement of substrates using pathway integrated metrology devices.
摘要翻译：在衬底制造途径中集成了一种在线非独立式衬底测量系统。一个实施例包括集成到引导车辆中的计量装置。另一实施例提供一种用于同时测量衬底的两侧的系统。计量装置可以集成到处理工具的前处理室中。其他实施例提供了使用路径集成测量装置来测量衬底的方法。

13. 发明申请

US20060045663A1 Load port with manual FOUP door opening mechanism 审中-公开
标题翻译：装载端口带手动FOUP门打开机构
公开(公告)号：US20060045663A1
公开(公告)日：2006-03-02
申请号：US10912299
申请日：2004-08-05
申请人： Ravinder Aggarwal , James Kusbel
发明人： Ravinder Aggarwal , James Kusbel
IPC分类号： H01L21/677
CPC分类号： H01L21/67772 , H01L21/67775
摘要： A load port comprises a platform for receiving a FOUP. The platform includes features for manually removing a FOUP door. The platform also includes features for placing the FOUP in operative relation to a wafer transfer robot configured to transfer wafers between first and second containers.
摘要翻译：负载端口包括用于接收FOUP的平台。该平台包括手动取出FOUP门的功能。平台还包括用于将FOUP放置在操作关系中的功能，该晶片传送机器人被配置为在第一和第二容器之间传送晶片。

14. 发明申请

US20050184270A1 Slit valve for a semiconductor processing system 有权
公开(公告)号：US20050184270A1
公开(公告)日：2005-08-25
申请号：US11112166
申请日：2005-04-22
申请人： Ravinder Aggarwal , Jim Kusbel , Jerry Davis
发明人： Ravinder Aggarwal , Jim Kusbel , Jerry Davis
IPC分类号： F16K3/02 , F16K51/00 , F16K3/00
CPC分类号： F16K51/00 , F16K3/0209
摘要： A slit valve for a semiconductor processing apparatus, for fluidly sealing a passage connecting two chambers of the apparatus, such as a substrate reaction chamber and a region outside the reaction chamber. The slit valve comprises an actuator plate movable within a slot in one wall of the passage, the actuator plate and the slot oriented generally transverse to the passage. The actuator plate has a first position in which the valve is open, permitting the transfer of a substrate through the passage. The actuator plate also has a second position in which the valve is closed, and in which the actuator plate fluidly seals the passage such that fluid cannot flow through the passage across the actuator plate. A protective cover is configured to prevent debris within the passage (e.g., broken wafers, shards, particulate contaminants, etc.) from flowing into the slot when the actuator plate occupies its second position. In one embodiment, the cover is pivotably secured to the first wall of the passage, proximate the slot. In another embodiment, the cover is secured to the actuator plate, proximate an end thereof. In a preferred embodiment, the cover comprises a plate.

15. 发明授权

US06883250B1 Non-contact cool-down station for wafers 失效
标题翻译：用于晶圆的非接触式冷却站
公开(公告)号：US06883250B1
公开(公告)日：2005-04-26
申请号：US10701681
申请日：2003-11-04
申请人： Ravinder Aggarwal , Bob Haro
发明人： Ravinder Aggarwal , Bob Haro
IPC分类号： H01L21/00 , F26B7/00 , F25D25/00
CPC分类号： H01L21/67196 , H01L21/67109
摘要： A stationary cooling station for cooling wafers after the wafers have been subjected to semiconductor processing supports the wafer by flowing gas in accordance with the Bernoulli principle. An upper wall of the cooling station contains a plurality of gas outlets that direct gas to flow over the top surface of the wafer. In this way, a low-pressure region is created over the wafer and the wafer is suspended within the cooling station, without directly contacting any surface for support. In addition to providing lift for the wafer, the gas is a thermally conductive gas that can cool the wafer by conducting heat away from it.
摘要翻译：用于在晶片经过半导体处理之后冷却晶片的固定式冷却站通过根据伯努利原理流动气体来支撑晶片。冷却站的上壁包含多个气体出口，其引导气体流过晶片的顶表面。以这种方式，在晶片上形成低压区域，并且将晶片悬挂在冷却站内，而不直接接触用于支撑的任何表面。除了为晶片提供电梯之外，气体是导热气体，其可以通过将热量远离其来冷却晶片。

16. 发明授权

US06704496B2 High temperature drop-off of a substrate 有权
标题翻译：衬底的高温下降
公开(公告)号：US06704496B2
公开(公告)日：2004-03-09
申请号：US10291897
申请日：2002-11-08
申请人： Paul Jacobson , Ivo Raaijmakers , Ravinder Aggarwal , Robert C. Haro
发明人： Paul Jacobson , Ivo Raaijmakers , Ravinder Aggarwal , Robert C. Haro
IPC分类号： F26B330
CPC分类号： H01L21/28556
摘要： A substrate to be processed in a high temperature processing chamber is preheated to avoid the problems associated with thermal shock when the substrate is dropped onto a heated susceptor. Preheating is effected by holding the substrate over a susceptor maintained at or near the processing temperature until the temperature of the substrate approaches the processing temperature. Thus, wafer warping and breakage are greatly reduced, and wafer throughput is improved because of time saved in maintaining the susceptor at constant temperature without cool down and reheat periods.
摘要翻译：在高温处理室中待加工的基板被预热以避免当基板落在加热的基座上时与热冲击相关的问题。通过将基板保持在保持在处理温度处于或接近加工温度的基座上直到基板的温度接近处理温度来实现预热。因此，晶片翘曲和断裂大大降低，并且由于在将感受器维持在恒定温度而不降温和再加热时间的情况下节省时间，晶片产量得到改善。

17. 发明申请

US20100255658A1 SUBSTRATE REACTOR WITH ADJUSTABLE INJECTORS FOR MIXING GASES WITHIN REACTION CHAMBER 有权
标题翻译：带反应室混合气体的可调式喷射器的基板反应器
公开(公告)号：US20100255658A1
公开(公告)日：2010-10-07
申请号：US12420010
申请日：2009-04-07
申请人： Ravinder Aggarwal , Rand Conner , John Disanto , James A. Alexander
发明人： Ravinder Aggarwal , Rand Conner , John Disanto , James A. Alexander
IPC分类号： H01L21/20 , C23C16/455
CPC分类号： C23C16/45574 , C23C16/04 , C23C16/45504 , C23C16/45563
摘要： Methods and apparatuses for separately injecting gases into a reactor for a substrate processing system. The flow profiles of the gases are controlled with two or more sets of adjustable gas flow injectors. The methods are particularly useful for selective deposition of gases in a CVD system using volatile combinations of precursors and etchants. In either case, the gases are provided along separate flow paths that intersect in a relatively open reaction space, rather than in more confined upstream locations.
摘要翻译：将气体分别注入用于基板处理系统的反应器的方法和装置。气体的流量分布由两组或多组可调气流注入器控制。该方法对于使用前体和蚀刻剂的易失性组合在CVD系统中选择性沉积气体特别有用。在任一情况下，气体沿着在相对开放的反应空间中相交的分开的流动路径而不是在更限制的上游位置中提供。

18. 发明申请

US20100145547A1 THERMOCOUPLE 有权
标题翻译：热电偶
公开(公告)号：US20100145547A1
公开(公告)日：2010-06-10
申请号：US12330096
申请日：2008-12-08
申请人： Buz Darabnia , Andy Yednak , Mike Halpin , Loren Jacobs , Ravinder Aggarwal
发明人： Buz Darabnia , Andy Yednak , Mike Halpin , Loren Jacobs , Ravinder Aggarwal
IPC分类号： G05D23/00 , G01K7/02
CPC分类号： G01K7/04 , C23C16/46 , G01K13/00
摘要： A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
摘要翻译：描述了用于半导体加工反应的热电偶。热电偶包括具有测量尖端和在相对端的开口的护套。接收第一线和第二线的一部分的支撑构件被容纳在护套内。第一和第二线形成在测量尖端处接触鞘的内表面的接合点。间隔构件固定在护套的开口处并接收支撑构件。间隔构件允许支撑构件，第一线和第二线自由地相对于彼此热膨胀而不在其中引入压缩或拉伸应力。

19. 发明授权

US07725012B2 Movable radiant heat sources 有权
标题翻译：活动辐射热源
公开(公告)号：US07725012B2
公开(公告)日：2010-05-25
申请号：US11655556
申请日：2007-01-19
申请人： Ravinder Aggarwal , Jeroen Stoutjesdijk
发明人： Ravinder Aggarwal , Jeroen Stoutjesdijk
IPC分类号： A21B2/00 , C23C16/00
CPC分类号： H01L21/67115
摘要： A semiconductor processing apparatus including a processing chamber and a plurality of radiant heat sources. The radiant heat sources heat a workpiece within the chamber. At least one of the radiant heat sources is movable during processing in an oscillatory motion along a path less than about 10 mm from a geometric center of the oscillatory motion.
摘要翻译：一种半导体处理装置，包括处理室和多个辐射热源。辐射热源加热室内的工件。辐射热源中的至少一个在沿着振荡运动的几何中心小于约10mm的路径的振荡运动的处理期间是可移动的。

20. 外观设计

USD600223S1 Susceptor ring 有权
标题翻译：受难环
公开(公告)号：USD600223S1
公开(公告)日：2009-09-15
申请号：US29322630
申请日：2008-08-07
申请人： Ravinder Aggarwal , Bob Haro
设计人： Ravinder Aggarwal , Bob Haro

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