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1. 发明授权

US07018504B1 Loadlock with integrated pre-clean chamber 有权
标题翻译：带集成预清洁室的负载锁定
公开(公告)号：US07018504B1
公开(公告)日：2006-03-28
申请号：US09658784
申请日：2000-09-11
申请人： Ivo Raaijmakers , Ravinder Aggarwal , James Kusbel
发明人： Ivo Raaijmakers , Ravinder Aggarwal , James Kusbel
IPC分类号： C23F1/00 , H01L21/306 , C23C16/00
CPC分类号： H01L21/67751 , H01L21/67167 , H01L21/67201 , H01L21/67757
摘要： A wafer carrier adapted to hold a plurality of wafers and is positioned on an elevator plate in a load lock. The elevator plate is adapted to move between a first position with the carrier in a first chamber of the load lock and a second position with the carrier in the auxiliary chamber. In the second position, the elevator plate substantially seals the auxiliary chamber from the first chamber. In use, a first wafer is placed onto the wafer carrier. The wafer carrier can moved into the auxiliary chamber before or after the first wafer is placed onto the wafer carrier. The first wafer is auxiliary processed in the auxiliary chamber. A second wafer is placed onto the wafer carrier. Preferably after the second wafer is placed onto the wafer carrier, the first wafer is removed from the load lock. A third wafer is preferably then placed onto the wafer carrier so that the second wafer can cool. The second wafer is then removed from the load lock. The cycle is repeated.
摘要翻译：适于保持多个晶片并且位于加载锁中的电梯板上的晶片载体。所述升降板适于在所述负载锁的第一室中的所述载体的第一位置和所述辅助室中的所述载体的第二位置之间移动。在第二位置，升降板基本上将辅助室与第一室密封。在使用中，将第一晶片放置在晶片载体上。在将第一晶片放置在晶片载体上之前或之后，晶片载体可以移动到辅助室中。第一个晶片在辅助室中辅助处理。将第二晶片放置在晶片载体上。优选地，在将第二晶片放置在晶片载体上之后，将第一晶片从负载锁上移除。然后优选将第三晶片放置在晶片载体上，使得第二晶片可以冷却。然后将第二个晶片从负载锁中取出。重复循环。

2. 发明申请

US20050169730A1 Semiconductor processing tool front end interface with sealing capability 审中-公开
标题翻译：半导体加工工具前端接口具有密封性能
公开(公告)号：US20050169730A1
公开(公告)日：2005-08-04
申请号：US10834577
申请日：2004-04-29
申请人： Ravinder Aggarwal , James Kusbel
发明人： Ravinder Aggarwal , James Kusbel
IPC分类号： H01L21/00 , H01L21/677 , B65G1/00
CPC分类号： H01L21/67126 , H01L21/67772 , H01L21/67775
摘要： A sealing member provides a seal between a front opening unified pod (FOUP) and a semiconductor processing tool. The seal inhibits fluid flow between an ambient environment and a minienvironment in a front end of the processing tool while the FOUP and minienvironment are open to one another for transporting wafers between the processing tool and the FOUP.
摘要翻译：密封构件在前开口统一吊舱（FOUP）和半导体加工工具之间提供密封。密封件防止处理工具前端的周围环境和环境之间的流体流动，同时FOUP和环境相互打开以在处理工具和FOUP之间传输晶片。

3. 发明申请

US20060045663A1 Load port with manual FOUP door opening mechanism 审中-公开
标题翻译：装载端口带手动FOUP门打开机构
公开(公告)号：US20060045663A1
公开(公告)日：2006-03-02
申请号：US10912299
申请日：2004-08-05
申请人： Ravinder Aggarwal , James Kusbel
发明人： Ravinder Aggarwal , James Kusbel
IPC分类号： H01L21/677
CPC分类号： H01L21/67772 , H01L21/67775
摘要： A load port comprises a platform for receiving a FOUP. The platform includes features for manually removing a FOUP door. The platform also includes features for placing the FOUP in operative relation to a wafer transfer robot configured to transfer wafers between first and second containers.
摘要翻译：负载端口包括用于接收FOUP的平台。该平台包括手动取出FOUP门的功能。平台还包括用于将FOUP放置在操作关系中的功能，该晶片传送机器人被配置为在第一和第二容器之间传送晶片。

4. 发明授权

US09033194B1 Dispensing apparatus 有权
标题翻译：点胶装置
公开(公告)号：US09033194B1
公开(公告)日：2015-05-19
申请号：US13679959
申请日：2012-11-16
申请人： Al Grabowski , James Kusbel
发明人： Al Grabowski , James Kusbel
IPC分类号： B65D25/40 , B65D25/42 , B65D25/48 , B65D47/06
CPC分类号： B65D47/263 , B65D51/249 , B65D83/04
摘要： A dispenser including a chamber having a cavity, a spout in communication with the cavity and having an inner surface, a rotatable dial in communication with the spout and having an outer surface, and wherein the dial is positioned at least partially within the spout and rotates coaxially with the spout for dispensing a product within the cavity.
摘要翻译：一种分配器，包括具有空腔的腔室，与所述空腔连通并具有内表面的喷口，与所述喷口连通并具有外表面的可旋转刻度盘，并且其中所述表盘至少部分地定位在所述喷口内并且旋转与喷口同轴，用于在腔内分配产品。

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