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11. 发明申请

US20120135668A1 METHOD OF POLISHING A SUBSTRATE USING A POLISHING TAPE HAVING FIXED ABRASIVE 有权
标题翻译：使用固定磨料抛光胶带抛光底材的方法
公开(公告)号：US20120135668A1
公开(公告)日：2012-05-31
申请号：US13303485
申请日：2011-11-23
申请人： Masayuki Nakanishi , Masaya Seki , Kenji Kodera
发明人： Masayuki Nakanishi , Masaya Seki , Kenji Kodera
IPC分类号： B24B1/00
CPC分类号： B24B9/065 , B24B21/002 , B24B37/02
摘要： A method of polishing a peripheral portion of a substrate is provided. This method includes: causing sliding contact between the peripheral portion of the substrate and a polishing tape; and supplying a polishing liquid onto the polishing tape contacting the peripheral portion of the substrate. The polishing tape includes a base tape and a fixed abrasive formed on the base tape, and the polishing liquid is an alkaline polishing liquid containing an alkaline chemical and an additive including molecules that cause steric hindrance.
摘要翻译：提供了研磨基板周边部分的方法。该方法包括：引起基板的周边部分与研磨带之间的滑动接触; 以及将研磨液供给到与基板的周边部分接触的研磨带上。抛光带包括形成在基带上的基带和固定磨料，抛光液是含有碱性化学物质和包含引起空间位阻的分子的添加剂的碱性抛光液。

12. 发明申请

US20090142992A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20090142992A1
公开(公告)日：2009-06-04
申请号：US12292662
申请日：2008-11-24
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B1/00 , B24B9/00
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译：本发明提供一种用于抛光基板周边的抛光装置。该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

13. 发明授权

US08986069B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08986069B2
公开(公告)日：2015-03-24
申请号：US13459421
申请日：2012-04-30
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B9/00 , B24B1/00 , B24B21/00 , B24B9/06 , B24B37/04 , B24B37/30
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译：抛光装置抛光基板的周边。该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

14. 发明授权

US08187055B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08187055B2
公开(公告)日：2012-05-29
申请号：US12292662
申请日：2008-11-24
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B1/00 , B24B49/00
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译：抛光装置抛光基板的周边。该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

15. 发明申请

US20100255757A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：US20100255757A1
公开(公告)日：2010-10-07
申请号：US12819578
申请日：2010-06-21
申请人： Atsushi SHIGETA , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi SHIGETA , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： B24B49/10 , B24B49/16 , B24B21/12
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

16. 发明申请

US20070287364A1 Substrate processing method and substrate processing apparatus 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20070287364A1
公开(公告)日：2007-12-13
申请号：US11882398
申请日：2007-08-01
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： B24B7/00 , B24B1/00
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

17. 发明授权

US07767472B2 Substrate processing method and substrate processing apparatus 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US07767472B2
公开(公告)日：2010-08-03
申请号：US11882398
申请日：2007-08-01
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： H01L21/00
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

18. 发明申请

US20100136886A1 POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：抛光设备和基板加工设备
公开(公告)号：US20100136886A1
公开(公告)日：2010-06-03
申请号：US12699318
申请日：2010-02-03
申请人： Akihisa Hongo , Kenya Ito , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Akihisa Hongo , Kenya Ito , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B49/04 , B24B49/12 , B24B21/18 , B24B9/02
CPC分类号： B24B37/02 , B24B9/065 , B24B21/002
摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.
摘要翻译：本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。抛光装置包括：用于在其中形成抛光室的壳体，用于保持和旋转基板的旋转台;抛光带供给机构，用于将研磨带供给到抛光室中并且吸收已经被供给到抛光的研磨带用于将抛光带压靠在基板的斜面部分上的抛光头，用于将液体供应到基板的前表面和后表面的液体供应源，以及用于使抛光室的内部压力的调节机构被设定为低于抛光室的外部压力。

19. 发明申请

US20060019417A1 Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20060019417A1
公开(公告)日：2006-01-26
申请号：US11187024
申请日：2005-07-22
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： H01L21/66 , H01L21/302
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

20. 发明申请

US20090117828A1 Polishing apparatus and substrate processing apparatus 有权
标题翻译：抛光装置和基板处理装置
公开(公告)号：US20090117828A1
公开(公告)日：2009-05-07
申请号：US10581669
申请日：2005-02-23
申请人： Akihisa Hongo , Kenya Ito , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Akihisa Hongo , Kenya Ito , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B49/04 , B24B1/04 , B24B49/12 , B24B9/02 , B24B57/02
CPC分类号： B24B37/02 , B24B9/065 , B24B21/002
摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing (3) for forming a polishing chamber (2) therein, a rotational table (1) for holding and rotating a substrate (W), a polishing tape supply mechanism (6) for supplying a polishing tape (5) into the polishing chamber (2) and supplied to the polishing chamber (2), a polishing head (35) for pressing the polishing tape (5) against a bevel portion of the substrate (W), a liquid supply (50) for supplying a liquid to a front surface and a rear surface of the substrate (W), and a regulation mechanism (16) for making an internal pressure of the polishing chamber (2) being set to be lower than an external pressure of the polishing chamber (2).
摘要翻译：本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。抛光装置包括用于在其中形成研磨室（2）的壳体（3），用于保持和旋转基底（W）的旋转台（1），用于供应研磨带（5）的研磨带供给机构）到抛光室（2）中并供给到抛光室（2），用于将抛光带（5）压靠在基板（W）的斜面部分上的抛光头（35）将液体供给到所述基板（W）的前表面和后表面;以及调节机构（16），用于使所述研磨室（2）的内部压力被设定为低于所述研磨室（2）。

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