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    • 15. 发明授权
    • Lead-free solder material having good wettability
    • 具有良好润湿性的无铅焊料
    • US06649127B2
    • 2003-11-18
    • US09813551
    • 2001-03-21
    • Kazutaka HabuNaoko Takeda
    • Kazutaka HabuNaoko Takeda
    • C22C1302
    • B23K35/262C22C13/00
    • New and improved substantially lead-free solder compositions are provided exhibiting excellent wettability and mechanical properties. In an embodiment, an improved solder material is a substantially silver-free material including from about 0.5 to about 10% by weight of Zn, from about 0.5 to about 8% by weight of Bi, from about 0.005 to about 0.5% by weight of Ge, from about 0.3 to about 3% by weight of Cu and the balance to make 100% by weight of Sn. In another embodiment, an improved solder material includes from about 0.5 to 8% by weight of Bi, from about 0.5 to about 3% by weight of Ag, from about 0.01 to about 0.1% by weight of Ge, from about 0.3 to about 1% by weight of Cu, and the balance to make 100% by weight of Sn. In a further embodiment, an improved solder material includes from about 3 to about 15% by weight of Zn, from about 3 to about 10% by weight of In, from about 0.01 to about 0.3% by weight of Ge, from about 0.3 to about 3% by weight of Ag and the balance to make 100% by weight of Sn.
    • 提供了新的和改进的基本上无铅的焊料组合物,表现出优异的润湿性和机械性能。 在一个实施方案中,改进的焊料材料是基本上不含银的材料,包括约0.5至约10重量%的Zn,约0.5至约8重量%的Bi,约0.005至约0.5重量%的 Ge,约0.3〜约3重量%的Cu,余量为100重量%的Sn。 在另一个实施方案中,改进的焊料材料包括约0.5至8重量%的Bi,约0.5至约3重量%的Ag,约0.01至约0.1重量%的Ge,约0.3至约1 重量%的Cu,余量为100重量%的Sn。 在另一个实施方案中,改进的焊料材料包括约3至约15重量%的Zn,约3至约10重量%的In,约0.01至约0.3重量%的Ge,约0.3至 约3重量%的Ag,余量为100重量%的Sn。