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11. 发明授权

US5525547A Method of fabricating a molded semiconductor device having blocking banks between leads 失效
标题翻译：制造在引线之间具有阻挡堤的模制半导体器件的方法
公开(公告)号：US5525547A
公开(公告)日：1996-06-11
申请号：US161374
申请日：1993-12-02
申请人： Toshihiro Matsunaga , Yuji Shirai , Takayuki Okinaga , Osamu Horiuchi , Takashi Emata , Makoto Omata
发明人： Toshihiro Matsunaga , Yuji Shirai , Takayuki Okinaga , Osamu Horiuchi , Takashi Emata , Makoto Omata
IPC分类号： H01L21/56 , H01L23/495
CPC分类号： H01L23/49558 , H01L21/565 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/07802 , H01L2924/181
摘要： A molded semiconductor device has a plurality of slender leads formed with a sealing strip connecting them together to prevent the molding material from leaking out between the leads. Specifically, the sealing strip comprising an adhesive and an electrically insulating material is applied to the leads substantially perpendicular to the lengthwise direction of the leads. The strip is place such that an inner edge thereof substantially lies on a boundary line or inside where the molding terminates. The strip is then thrust into spaces formed between the leads. Thereafter the semiconductor chip is connected to the leads, the semiconductor chip and the leads are placed in a molding unit, the strip serving to block the molding material leaking outside the molding unit.
摘要翻译：模制的半导体器件具有多个细长的引线，其形成有将它们连接在一起的密封条，以防止模制材料在引线之间泄漏。具体地，包括粘合剂和电绝缘材料的密封条被施加到基本上垂直于引线的长度方向的引线。带材的位置使得其内边缘基本上位于模制终止的边界线或内部。然后将条带推入形成在引线之间的空间中。此后，将半导体芯片连接到引线，将半导体芯片和引线放置在模制单元中，该条用于阻止模制材料在模制单元外部泄漏。

12. 发明授权

US5448105A Semiconductor device having a leadframe and metal substrate 失效
标题翻译：具有引线框和金属基板的半导体装置
公开(公告)号：US5448105A
公开(公告)日：1995-09-05
申请号：US372901
申请日：1995-01-17
申请人： Kazunori Katoh , Gen Murakami , Hiromichi Suzuki , Takayuki Okinaga , Takashi Emata , Osamu Horiuchi
发明人： Kazunori Katoh , Gen Murakami , Hiromichi Suzuki , Takayuki Okinaga , Takashi Emata , Osamu Horiuchi
IPC分类号： H01L23/433 , H01L23/495 , H01L23/48 , H01L23/44 , H01L23/52 , H01L23/60
CPC分类号： H01L23/49506 , H01L23/4334 , H01L2224/45144 , H01L2224/48247 , H01L2224/48639 , H01L2224/48644 , H01L2224/49171 , H01L2224/85439 , H01L2224/85444 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01028 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802
摘要： A leadframe according to this invention is formed by bonding a single leadframe with a substrate using adhesive film or double-sided adhesive resin film, which is divided and attached to two or more predetermined points between them. This reduces the quantity of gas or contaminants generated from adhesives. Also, this results in the reduction of the stress generated during heat treatment of the leadframe and also in the elimination of warping of the lead frame due to thermal stress. Cracking does not occur on the resin because resin is removed easily and assuredly, and no air is left behind. This contributes to high reliability and increased productivity. The lead frame is further formed by bonding a plurality of metal substrates of different materials to single leadframe. This through more stable thermal behavior high reliability.
摘要翻译：根据本发明的引线框架是通过使用粘合剂膜或双面粘合树脂膜将单个引线框与基板结合而形成的，所述粘合膜或双面粘合树脂膜被分隔并附接到它们之间的两个或更多个预定点。这减少了由粘合剂产生的气体或污染物的数量。此外，这导致在引线框架的热处理期间产生的应力的减少以及由于热应力消除引线框架的翘曲。在树脂上不会发生裂纹，因为容易且可靠地除去树脂，并且不留下空气。这有助于高可靠性和提高的生产率。引线框通过将多种不同材料的金属基板结合到单引线框架而进一步形成。这通过更稳定的热行为高可靠性。

13. 发明授权

US09388008B2 Base material for disk, process for producing the same, and disk roll 有权
标题翻译：磁盘基材，制造方法及磁盘卷
公开(公告)号：US09388008B2
公开(公告)日：2016-07-12
申请号：US12612278
申请日：2009-11-04
申请人： Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
发明人： Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
IPC分类号： B65H27/00
CPC分类号： B65H27/00 , B65H2402/80 , B65H2404/1321 , Y10T428/21
摘要： The present invention relates to a process for producing a base material for obtaining therefrom ring-shaped disks for use in a disk roll including a rotating shaft and the ring-shaped disks fitted thereon by insertion, whereby the peripheral surface of the disks serves as a conveying surface, the process including molding a raw slurry material into a platy shape and drying the plate, the raw slurry material containing inorganic fibers which have a wet volume of 300 mL/5 g or larger and which are amorphous or have a degree of crystallinity of 50% or lower.
摘要翻译：本发明涉及一种用于制造用于获得圆盘的基材的方法，所述圆盘用于包括旋转轴的盘卷和通过插入安装在其上的环形盘，由此盘的周面用作所述方法包括将原料浆料成型为板状并干燥板，含有湿体积为300mL / 5g或更大的无定形或具有结晶度的无机纤维的原料浆料为50％以下。

14. 发明申请

US20120255327A1 Disk roll and base material thereof 有权
标题翻译：盘卷及其基材
公开(公告)号：US20120255327A1
公开(公告)日：2012-10-11
申请号：US13064642
申请日：2011-04-05
申请人： Kazuhisa Watanabe , Masaaki Nakayama , Osamu Horiuchi
发明人： Kazuhisa Watanabe , Masaaki Nakayama , Osamu Horiuchi
IPC分类号： C03B17/00 , C04B35/80 , B29C39/02 , C03B15/02
CPC分类号： C03B17/061 , B65H27/00 , C03B17/068 , C04B33/32 , C04B33/36 , C04B35/636 , C04B2235/3427 , C04B2235/5228 , C04B2235/5264 , C04B2235/6567 , C04B2235/77 , C04B2235/94 , C04B2235/9607
摘要： A disk roll base material includes 20 to 38 wt % of alumina silicate wool that include 40 to 60 wt % of alumina and 40 to 60 wt % of silica, and have a content of shots having a dimension of 45 μm or more of 5 wt % or less, 10 to 30 wt % of kibushi clay, 2 to 20 wt % of bentonite, and 20 to 40 wt % of mica.
摘要翻译：圆盘辊基材料包括20至38重量％的氧化铝硅酸盐棉，其包含40至60重量％的氧化铝和40至60重量％的二氧化硅，并且具有45重量或更多的尺寸为5重量％ 10〜30重量％的赤柏粘土，2〜20重量％的膨润土，20〜40重量％的云母。

15. 发明授权

US07097395B2 Chip-breaking tool for tapping and female thread processing method 有权
标题翻译：攻丝和内螺纹加工方法的破碎工具
公开(公告)号：US07097395B2
公开(公告)日：2006-08-29
申请号：US10901166
申请日：2004-07-29
申请人： Osamu Horiuchi , Yoshihiko Murakami
发明人： Osamu Horiuchi , Yoshihiko Murakami
IPC分类号： B23B51/08
CPC分类号： B23G5/062 , B23B51/08 , B23G5/20 , B23G2200/143 , B23G2200/24 , B23G2240/08 , Y10T408/03 , Y10T408/348 , Y10T408/356 , Y10T408/62 , Y10T408/9048 , Y10T409/4028
摘要： Since the chip-breaking groove 30 is cut in the inner peripheral surface of the prepared hole 22 by compressing the chip-breaking tool 10 into the prepared hole 22 prior to the tapping process (the cutting process of the female thread) by the cut tap, the chip can be securely broken by the chip-breaking groove 30 and well discharged even in the case that the work 20 is made of the material having the high ductility. Accordingly, for example, as shown in FIG. 10, it is possible to prevent a lot of long connected chips from entwining the tap, it is unnecessary to monitor the tapping work, and it is possible to achieve a complete automation (an unmanned work). Further, it is possible to inhibit the cut tap from being broken due to the pinching of the chip, and it is easy to execute a treatment such as a chip cleaning or the like.
摘要翻译：由于通过在切割过程（内螺纹的切割过程）之前通过切割丝锥将切屑破坏工具10压缩到预备孔22中，从而在预备孔22的内周面上切割切屑槽30 即使在工件20由具有高延展性的材料制成的情况下，也可以通过切屑槽30牢固地断开切屑，并且即使在切屑槽30中也能够良好地排出切屑。因此，例如，如图1所示。如图10所示，可以防止大量长连接的芯片与水龙头缠结，不需要监视攻丝工作，并且可以实现完全的自动化（无人工作）。此外，可以抑制由于芯片的夹持而导致的切断丝锥破损，并且容易进行诸如芯片清洁等的处理。

16. 外观设计

USD521663S1 Headlamp for vehicle 有权
公开(公告)号：USD521663S1
公开(公告)日：2006-05-23
申请号：US29221144
申请日：2005-01-13
申请人： Seiji Watanabe , Osamu Horiuchi
设计人： Seiji Watanabe , Osamu Horiuchi

17. 外观设计

USD517457S1 Bumper for vehicle 有权
公开(公告)号：USD517457S1
公开(公告)日：2006-03-21
申请号：US29221143
申请日：2005-01-13
申请人： Osamu Horiuchi , Toshihiro Ooyama
设计人： Osamu Horiuchi , Toshihiro Ooyama

18. 发明申请

US20050053437A1 Chip-breaking tool for tapping and female thread processing method 有权
标题翻译：攻丝和内螺纹加工方法的破碎工具
公开(公告)号：US20050053437A1
公开(公告)日：2005-03-10
申请号：US10901166
申请日：2004-07-29
申请人： Osamu Horiuchi , Yoshihiko Murakami
发明人： Osamu Horiuchi , Yoshihiko Murakami
IPC分类号： B23B51/08 , B23G5/06 , B23G5/20
CPC分类号： B23G5/062 , B23B51/08 , B23G5/20 , B23G2200/143 , B23G2200/24 , B23G2240/08 , Y10T408/03 , Y10T408/348 , Y10T408/356 , Y10T408/62 , Y10T408/9048 , Y10T409/4028
摘要： Since the chip-breaking groove 30 is cut in the inner peripheral surface of the prepared hole 22 by compressing the chip-breaking tool 10 into the prepared hole 22 prior to the tapping process (the cutting process of the female thread) by the cut tap, the chip can be securely broken by the chip-breaking groove 30 and well discharged even in the case that the work 20 is made of the material having the high ductility. Accordingly, for example, as shown in FIG. 10, it is possible to prevent a lot of long connected chips from entwining the tap, it is unnecessary to monitor the tapping work, and it is possible to achieve a complete automation (an unmanned work). Further, it is possible to inhibit the cut tap from being broken due to the pinching of the chip, and it is easy to execute a treatment such as a chip cleaning or the like.
摘要翻译：由于通过在切割过程（内螺纹的切割过程）之前通过切割丝锥将切屑破坏工具10压缩到预备孔22中，从而在预备孔22的内周面上切割切屑槽30 即使在工件20由具有高延展性的材料制成的情况下，也可以通过切屑槽30牢固地断开切屑，并且即使在切屑槽30中也能够良好地排出切屑。因此，例如，如图1所示。如图10所示，可以防止大量长连接的芯片与水龙头缠结，不需要监视攻丝工作，并且可以实现完全的自动化（无人工作）。此外，可以抑制由于芯片的夹持而导致的切断丝锥破损，并且容易进行诸如芯片清洁等的处理。

19. 发明申请

US20050030997A1 Semiconductor laser device and its manufacturing method 失效
标题翻译：半导体激光器件及其制造方法
公开(公告)号：US20050030997A1
公开(公告)日：2005-02-10
申请号：US10845666
申请日：2004-05-13
申请人： Akira Tanaka , Yoshiyuki Itoh , Osamu Horiuchi , Akio Makuta , Koichi Gen-Ei , Hideo Shiozawa
发明人： Akira Tanaka , Yoshiyuki Itoh , Osamu Horiuchi , Akio Makuta , Koichi Gen-Ei , Hideo Shiozawa
IPC分类号： G11B7/125 , H01S5/00 , H01S5/02 , H01S5/042 , H01S5/06 , H01S5/065 , H01S5/20 , H01S5/22 , H01S5/223 , H01S5/227 , H01S5/343 , H01S5/40
CPC分类号： B82Y20/00 , H01S5/0421 , H01S5/0601 , H01S5/0654 , H01S5/0658 , H01S5/2022 , H01S5/2081 , H01S5/209 , H01S5/2206 , H01S5/2231 , H01S5/3202 , H01S5/34326 , H01S5/3436 , H01S5/4031 , H01S5/4087
摘要： A semiconductor laser device comprises: a cladding layer of a first conductivity type; an active layer provided on the cladding layer; and a cladding layer of a second conductivity type provided on the active layer. At least a part of the cladding layer of the second conductivity type has a ridge stripe. The ridge stripe includes: an upper part having substantially vertical sidewalls; and a lower portion having sidewalls inclined so that the stripe becomes wider toward the active layer.
摘要翻译：半导体激光器件包括：第一导电类型的覆层; 设置在包层上的有源层; 以及设置在有源层上的第二导电类型的覆层。第二导电类型的包覆层的至少一部分具有脊条。脊条包括：具有基本垂直侧壁的上部; 以及具有侧壁倾斜使得条纹朝向有源层变宽的下部。

20. 发明授权

US09051200B2 Disk roll and base material thereof 有权
标题翻译：盘卷及其基材
公开(公告)号：US09051200B2
公开(公告)日：2015-06-09
申请号：US13064642
申请日：2011-04-05
申请人： Kazuhisa Watanabe , Masaaki Nakayama , Osamu Horiuchi
发明人： Kazuhisa Watanabe , Masaaki Nakayama , Osamu Horiuchi
IPC分类号： B25F5/02 , C03B17/06 , B65H27/00 , C04B33/32 , C04B33/36 , C04B35/636
CPC分类号： C03B17/061 , B65H27/00 , C03B17/068 , C04B33/32 , C04B33/36 , C04B35/636 , C04B2235/3427 , C04B2235/5228 , C04B2235/5264 , C04B2235/6567 , C04B2235/77 , C04B2235/94 , C04B2235/9607
摘要： A disk roll base material includes 20 to 38 wt % of alumina silicate wool that include 40 to 60 wt % of alumina and 40 to 60 wt % of silica, and have a content of shots having a dimension of 45 μm or more of 5 wt % or less, 10 to 30 wt % of kibushi clay, 2 to 20 wt % of bentonite, and 20 to 40 wt % of mica.
摘要翻译：圆盘辊基材料包括20至38重量％的氧化铝硅酸盐棉，其包含40至60重量％的氧化铝和40至60重量％的二氧化硅，并且具有45重量或更多的尺寸为5重量％ 10〜30重量％的赤柏粘土，2〜20重量％的膨润土，20〜40重量％的云母。

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