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    • 11. 发明授权
    • Test module hanger for test fixtures
    • 用于测试夹具的测试模块挂钩
    • US5444387A
    • 1995-08-22
    • US196588
    • 1994-02-10
    • David R. Van LoanCharles J. JohnstonMark A. Swart
    • David R. Van LoanCharles J. JohnstonMark A. Swart
    • G01R1/04G01R31/316G01R31/00
    • G01R1/0425G01R31/316
    • Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
    • 安装在加载印刷电路板(PCB)上的集成电路(IC)封装由转换器模块测试,首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点,用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体,或者其可以包括具有包括柔性弹簧状金属化塑料指状物的单独触头的复合柔性电路材料。 测试模块上的触点可以直接可释放地接合IC封装上的引线,或者它们可以接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间,弹簧探头接触测试模块上的测试焊盘,并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 在另一个实施例中,翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。 在另一实施例中,集成电路封装包含内置的测试验证器系统,使得可以使用标准测试探针来测试封装而不使用单独的转换器模块。
    • 12. 发明授权
    • Test fixture with adjustable bearings and optical alignment system
    • 带可调节轴承和光学对准系统的测试夹具
    • US5422575A
    • 1995-06-06
    • US224006
    • 1994-04-05
    • Mary E. FerrerGary F. St. OngeCharles J. JohnstonMark A. Swart
    • Mary E. FerrerGary F. St. OngeCharles J. JohnstonMark A. Swart
    • G01R31/02G01R1/073G01R31/28
    • G01R1/07328
    • A test fixture for testing circuit boards has a vacuum chamber between a stationary probe plate and a movable top plate. Separate adjustable linear bearings located in quadrants of the fixture provide parallel alignment between the top plate and the probe plate. A continuous vacuum seal between the probe plate and top plate bypasses the bearings so the bearings are outside the vacuum area. Spring loaded test probes in the probe plate extend through holes in the top plate for access to a circuit board under test. The probes contact the board when the top plate moves down toward the probes under a vacuum. The top plate is secured to the probe plate by separate quick-release latch pins extending through the linear bearings. The moving top plate carries fixed tooling pins for mounting the board to the top plate. Movable bearing blocks support the bearings. The top plate is movable for aligning the board with the test probes. The top plate, latch pins, bearings and bearing blocks are movable as a unit relative to the probe plate. After the top plate is aligned with the probes to compensate for art shift among circuit board lots, the quick-release latches are engaged to retain the alignment. The latches are part of a guide post assembly for guiding vertical travel of the top plate during vacuum cycling of the test fixture. An optical alignment system in combination with the movable bearings provides a quick and easy means of aligning the board and the probes with extremely high accuracy.
    • 用于测试电路板的测试夹具在固定探针板和可移动顶板之间具有真空室。 位于夹具象限中的可分离的可调直线轴承提供顶板和探针板之间的平行对准。 探头板和顶板之间的连续真空密封件绕过轴承,因此轴承位于真空区域之外。 探针板中的弹簧加载的测试探针延伸穿过顶板中的孔,用于进入被测电路板。 当顶板在真空下向下移动探针时,探针接触板。 顶板通过延伸穿过直线轴承的单独的快速释放闩锁销固定到探针板上。 移动的顶板承载用于将板安装到顶板的固定工具销。 可移动轴承座支撑轴承。 顶板可移动以使板与测试探针对准。 顶板,闩锁销,轴承和轴承座可作为相对于探针板的单元移动。 在顶板与探针对准以补偿电路板批次之间的技术偏移之后,快速释放闩锁被接合以保持对准。 闩锁是用于在测试夹具的真空循环期间引导顶板的垂直行进的引导柱组件的一部分。 与可移动轴承结合的光学对准系统提供了一种快速且简便的方法,可以极高的精度对准电路板和探头。
    • 13. 发明授权
    • Testing of integrated circuit devices on loaded printed circuit boards
    • 集成电路设备在负载印刷电路板上的测试
    • US5247246A
    • 1993-09-21
    • US698724
    • 1991-05-10
    • David R. Van LoanCharles J. JohnstonMark A. Swart
    • David R. Van LoanCharles J. JohnstonMark A. Swart
    • G01R1/04G01R31/316G01R31/00
    • G01R31/316G01R1/0425
    • Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it includes a composite flex-circuit material with individual contacts including flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. The translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing.
    • 安装在加载印刷电路板(PCB)上的集成电路(IC)封装由转换器模块测试,首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点,用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体,或者其包括具有单独触头的复合柔性电路材料,包括柔性弹簧状金属化塑料指状物。 测试模块上的触点可以直接地与IC封装上的引线相接触,或者它们接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间,弹簧探头接触测试模块上的测试焊盘,并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。
    • 14. 发明授权
    • Twisting electrical test probe with controlled pointing accuracy
    • 扭转具有受控指向精度的电气测试探头
    • US5391995A
    • 1995-02-21
    • US189693
    • 1994-02-01
    • Charles J. JohnstonMark A. Swart
    • Charles J. JohnstonMark A. Swart
    • G01R1/067G01R1/073
    • G01R1/06722
    • A spring biased test probe for testing electrical printed circuit boards includes an elongated tubular barrel having an open end, and a compression spring within a spring seating end of the barrel, opposite from its open end. A plunger inserted in the barrel reciprocates during testing, sliding within the barrel and biased by the spring pressure. The plunger includes a forward end portion outside the barrel, a slidable tail portion that contacts the spring and slides within a barrel, and an intermediate twisted portion between the forward end and the tail portion of the plunger. The forward end of the plunger has a probe tip configured to make frictional pressure contact with the board to be tested. The intermediate portion is twisted about its axis to form a spiral with helical grooves contacted by circumferentially spaced apart crimps in the side of the barrel, adjacent the open end of the barrel. The plunger is rotated about its axis by its contact with the crimps as the plunger travels axially in the barrel. The twisted intermediate section of the plunger and the forward end of the plunger extend outside the barrel which is contained in an elongated tubular outer receptacle. The forward end of the plunger includes an elongated enlarged diameter guide bearing section between the probe tip and the twisted section of the plunger.
    • 用于测试电气印刷电路板的弹簧偏置测试探针包括具有开口端的细长管状筒体和与其开口端相对的筒体的弹簧座端部内的压缩弹簧。 插入桶中的柱塞在测试期间往复运动,在筒内滑动并被弹簧压力偏压。 柱塞包括在筒外部的前端部分,可滑动的尾部部分,其接触弹簧并在筒体内滑动,以及在柱塞的前端部和尾部之间的中间扭转部分。 柱塞的前端具有构造成与要测试的板摩擦压力接触的探针尖端。 中间部分围绕其轴线扭转以形成螺旋形,螺旋形沟槽与筒体的开口端相邻,在圆筒的侧面中周向间隔开的卷曲接触。 当柱塞在筒体中轴向移动时,柱塞通过其与卷曲部的接触而绕其轴线旋转。 柱塞的扭转中间部分和柱塞的前端延伸到容纳在细长管状外部容器中的筒的外部。 柱塞的前端包括在探针尖端和柱塞扭转部分之间的细长的扩大直径的导向轴承部分。
    • 15. 发明授权
    • Test fixture
    • 测试夹具
    • US5300881A
    • 1994-04-05
    • US84755
    • 1993-06-30
    • Mary E. FerrerGary F. St. OngeCharles J. JohnstonMark A. Swart
    • Mary E. FerrerGary F. St. OngeCharles J. JohnstonMark A. Swart
    • G01R31/02G01R1/073G01R31/28
    • G01R1/07328
    • A test fixture for testing circuit boards has a vacuum chamber between a stationary probe plate and a movable top plate. Separate adjustable linear bearings located in quadrants of the fixture provide parallel alignment between the top plate and the probe plate. A continuous vacuum seal between the probe plate and top plate bypasses the bearings so the bearings are outside the vacuum area. Spring loaded test probes in the probe plate extend through holes in the top plate for access to a circuit board under test. The probes contact the board when the top plate moves down toward the probes under a vacuum. The top plate is secured, to the probe plate by separate quick-release latch pins extending through the linear bearings. The moving top plate carries fixed tooling pins for mounting the board to the top plate. Movable bearing blocks support the bearings. The top plate is movable for aligning the board with the test probes. The top plate, latch pins, bearings and bearing blocks are movable as a unit relative to the probe plate. After the top plate is aligned with the probes to compensate for art shift among circuit board lots, the quick-release latches are engaged to retain the alignment.
    • 用于测试电路板的测试夹具在固定探针板和可移动顶板之间具有真空室。 位于夹具象限中的可分离的可调直线轴承提供顶板和探针板之间的平行对准。 探头板和顶板之间的连续真空密封件绕过轴承,因此轴承位于真空区域之外。 探针板中的弹簧加载的测试探针延伸穿过顶板中的孔,用于进入被测电路板。 当顶板在真空下向下移动探针时,探针接触板。 顶板通过延伸穿过直线轴承的单独的快速释放闩锁销固定到探针板上。 移动的顶板承载用于将板安装到顶板的固定工具销。 可移动轴承座支撑轴承。 顶板可移动以使板与测试探针对准。 顶板,闩锁销,轴承和轴承座可作为相对于探针板的单元移动。 在顶板与探针对准以补偿电路板批次之间的技术偏移之后,快速释放闩锁被接合以保持对准。
    • 16. 发明授权
    • Testing of integrated circuit devices on loaded printed circuit
    • 集成电路板器件在装载印刷电路板上的测试
    • US5289117A
    • 1994-02-22
    • US998554
    • 1992-12-30
    • David R. Van LoanCharles J. JohnstonMark A. Swart
    • David R. Van LoanCharles J. JohnstonMark A. Swart
    • G01R1/04G01R31/316G01R31/00
    • G01R1/0425G01R31/316
    • Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
    • 安装在加载印刷电路板(PCB)上的集成电路(IC)封装由转换器模块测试,首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点,用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体,或者其可以包括具有包括柔性弹簧状金属化塑料指状物的单独触头的复合柔性电路材料。 测试模块上的触点可以直接可释放地接合IC封装上的引线,或者它们可以接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间,弹簧探头接触测试模块上的测试焊盘,并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 在另一个实施例中,翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。 在另一实施例中,集成电路封装包含内置的测试验证器系统,使得可以使用标准测试探针来测试封装而不使用单独的转换器模块。
    • 17. 发明授权
    • Testing of integrated circuit devices on loaded printed circuit boards
    • 集成电路器件在加载印刷电路板上的测试
    • US5049813A
    • 1991-09-17
    • US427932
    • 1989-10-25
    • David R. Van LoanCharles J. JohnstonMark A. Swart
    • David R. Van LoanCharles J. JohnstonMark A. Swart
    • G01R1/04G01R31/316G01R31/00
    • G01R1/0425G01R31/316
    • Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
    • 安装在加载印刷电路板(PCB)上的集成电路(IC)封装由转换器模块测试,首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点,用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体,或者其可以包括具有包括柔性弹簧状金属化塑料指状物的单独触头的复合柔性电路材料。 测试模块上的触点可以直接可释放地接合IC封装上的引线,或者它们可以接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间,弹簧探头接触测试模块上的测试焊盘,并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 在另一个实施例中,翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。 在另一实施例中,集成电路封装包含内置的测试验证器系统,使得可以使用标准测试探针来测试封装而不使用单独的转换器模块。
    • 18. 发明授权
    • Electrical test probe having rotational control of the probe shaft
    • 电测试探针具有探头轴的旋转控制
    • US5032787A
    • 1991-07-16
    • US431477
    • 1989-11-03
    • Charles J. JohnstonMark A. Swart
    • Charles J. JohnstonMark A. Swart
    • G01R1/067
    • H01R11/18G01R1/06722H01R13/2421
    • A test probe assembly includes a barrel having a hollow interior and a plunger which slides axially in the barrel. The plunger has an outer portion extending through an open end of the barrel, terminating in a contact tip outside the barrel for contact with a test point. In one embodiment, the plunger also has a hollow, elongated receptacle extending through the barrel. The receptacle has a geometric-shaped pilot hole, preferably square, spaced from the open end of the barrel. An elongated fixed guide member in the barrel extends through the pilot hole. The guide member extends through the interior of the barrel away from the pilot hole. The guide member has an outer surface of preferably square-shaped configuration engaging the pilot hole. A spring inside the barrel extends along the guide member and is biased against the internal end of the receptacle inside the barrel. Axial travel of the plunger into the barrel is against the bias of the spring. The square-shaped outer surface of the guide member, engaging the square pilot hole, controls rotational motion of the plunger as it travels along the guide member against the bias of the spring. In one embodiment, a helical configuration in the outer surface of the guide member engages the pilot hole so that axial travel of the receptacle causes the plunger to rotate about its axis, in order to provide good frictional contact between the plunger tip and the test point on a unit under test. In another embodiment, the cooperating square-shaped engaging portions of the guide member and the pilot hole provide controlled linear and non-rotational travel of the plunger relative to the barrel.
    • 19. 发明授权
    • Repetitive-switching
    • 重复切换
    • US4983909A
    • 1991-01-08
    • US442289
    • 1989-11-28
    • Mark A. SwartCharles J. Johnston
    • Mark A. SwartCharles J. Johnston
    • G01R1/067
    • G01R1/06722
    • A breakaway switch probe comprises an outer barrel, a movable plunger in one end portion of the barrel, a terminal projecting from the other end of the barrel, and a breakaway clip mounted on the barrel and normally engaging a contact surface on the plunger for retaining the plunger in its at-rest position, substantially immovable in the barrel and out of contact with a switch point on the terminal. The plunger is normally retained in its at-rest position spaced from the switch point so that absence of contact between the plunger and the switch point produces an electrical open-circuit condition in electrical test circuitry connected to the probe. An external test force of less than the preset level applied to the plunger in opposition to the resistance force of the breakaway clip will not move the plunger from its at-rest position, thereby retaining the open-circuit test indication. The breakaway clip is movable away from its engagement with the contact surface of the plunger when the external test force applied to it exceeds the threshold level, and the movement of the breakaway clip away from the plunger contact surface releases the plunger for travel in the barrel toward and into contact with the switch point to produce a closed-circuit condition in the electrical test circuit connected to the switch probe.