会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 13. 发明授权
    • High capacity air-cooling systems for electronic apparatus and associated methods
    • 用于电子设备和相关方法的大容量空气冷却系统
    • US06813149B2
    • 2004-11-02
    • US09896869
    • 2001-06-29
    • Barrett M. FaneufWilliam E. BerryVen R. HolalkereDavid S. De Lorenzo
    • Barrett M. FaneufWilliam E. BerryVen R. HolalkereDavid S. De Lorenzo
    • G06F116
    • H05K7/20727
    • An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.
    • 用于高性能,高密度电子设备的改进的空气冷却系统在一个实施例中包括具有径向叶轮的单个风扇,具有有效地将空气引导到风扇进气口中的入口部分的挡板和两层出口增压室 以特定地引导一个气流在最高的发热部件和所有部件的另一个气流。 空气冷却系统设计用于为诸如服务器的低高度,高发热电子模块提供最大的冷却。 通过仅使用与挡板的低阻气流特性匹配的单个风扇,空气冷却系统比多风扇系统具有显着的优点。 还描述了一种计算机服务器和制造散热设备的方法。