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1. 发明授权

US06700785B2 Computer system which locks a server unit subassembly in a selected position in a support frame 有权
标题翻译：将服务器单元子组件锁定在支撑框架中的选定位置的计算机系统
公开(公告)号：US06700785B2
公开(公告)日：2004-03-02
申请号：US10039109
申请日：2002-01-04
申请人： William E. Berry , David S. De Lorenzo , Stephen W. Montgomery , Barrett M. Faneuf
发明人： William E. Berry , David S. De Lorenzo , Stephen W. Montgomery , Barrett M. Faneuf
IPC分类号： G06F116
CPC分类号： H05K7/20809 , G06F1/183 , G06F1/20 , G06F2200/201 , H05K7/1454
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
摘要翻译：描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。每个服务器单元子组件具有与框架上的框架部件接合的底座部件。热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。在一个实施例中，空气管道位于多个框架部件上。热量从框架部件转移到流过管道的空气中。改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

2. 发明授权

US06693797B2 Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another 失效
标题翻译：计算机系统具有机架级热接口部件和可与其彼此热接合和分离的框架级热接口部件
公开(公告)号：US06693797B2
公开(公告)日：2004-02-17
申请号：US10039148
申请日：2002-01-04
申请人： Barrett M. Faneuf , David S. De Lorenzo , Stephen W. Montgomery
发明人： Barrett M. Faneuf , David S. De Lorenzo , Stephen W. Montgomery
IPC分类号： H05K720
CPC分类号： H05K7/20809
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
摘要翻译：描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。每个服务器单元子组件具有与框架上的框架部件接合的底座部件。热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。在一个实施例中，空气管道位于多个框架部件上。热量从框架部件转移到流过管道的空气中。改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

3. 发明授权

US07233491B2 Frame-level thermal interface component for transfer of heat from an electronic component of a computer system 有权
标题翻译：用于从计算机系统的电子部件传送热量的帧级热接口部件
公开(公告)号：US07233491B2
公开(公告)日：2007-06-19
申请号：US11415559
申请日：2006-05-01
申请人： Barrett M. Faneuf , David S. De Lorenzo
发明人： Barrett M. Faneuf , David S. De Lorenzo
IPC分类号： H05K7/20
CPC分类号： H05K7/20809
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
摘要翻译：描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。每个服务器单元子组件具有与框架上的框架部件接合的底座部件。热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。在一个实施例中，空气管道位于多个框架部件上。热量从框架部件转移到流过管道的空气中。改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

4. 发明授权

US06643132B2 Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system 失效
标题翻译：机箱级热接口组件，用于从计算机系统的电子部件传输热量
公开(公告)号：US06643132B2
公开(公告)日：2003-11-04
申请号：US10039003
申请日：2002-01-04
申请人： Barrett M. Faneuf , David S. De Lorenzo
发明人： Barrett M. Faneuf , David S. De Lorenzo
IPC分类号： H05K720
CPC分类号： H05K7/20809 , G06F1/20
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
摘要翻译：描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。每个服务器单元子组件具有与框架上的框架部件接合的底座部件。热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。在一个实施例中，空气管道位于多个框架部件上。热量从框架部件转移到流过管道的空气中。改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

5. 发明授权

US07133283B2 Frame-level thermal interface component for transfer of heat from an electronic component of a computer system 有权
公开(公告)号：US07133283B2
公开(公告)日：2006-11-07
申请号：US10039110
申请日：2002-01-04
申请人： Barrett M. Faneuf , David S. De Lorenzo
发明人： Barrett M. Faneuf , David S. De Lorenzo
IPC分类号： H05K7/20
CPC分类号： H05K7/20809
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

6. 发明授权

US06813149B2 High capacity air-cooling systems for electronic apparatus and associated methods 有权
标题翻译：用于电子设备和相关方法的大容量空气冷却系统
公开(公告)号：US06813149B2
公开(公告)日：2004-11-02
申请号：US09896869
申请日：2001-06-29
申请人： Barrett M. Faneuf , William E. Berry , Ven R. Holalkere , David S. De Lorenzo
发明人： Barrett M. Faneuf , William E. Berry , Ven R. Holalkere , David S. De Lorenzo
IPC分类号： G06F116
CPC分类号： H05K7/20727
摘要： An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.
摘要翻译：用于高性能，高密度电子设备的改进的空气冷却系统在一个实施例中包括具有径向叶轮的单个风扇，具有有效地将空气引导到风扇进气口中的入口部分的挡板和两层出口增压室以特定地引导一个气流在最高的发热部件和所有部件的另一个气流。空气冷却系统设计用于为诸如服务器的低高度，高发热电子模块提供最大的冷却。通过仅使用与挡板的低阻气流特性匹配的单个风扇，空气冷却系统比多风扇系统具有显着的优点。还描述了一种计算机服务器和制造散热设备的方法。

7. 发明授权

US07770630B2 Modular capillary pumped loop cooling system 有权
标题翻译：模块化毛细管泵回路冷却系统
公开(公告)号：US07770630B2
公开(公告)日：2010-08-10
申请号：US10648170
申请日：2003-08-26
申请人： Jason B. Chesser , Barrett M. Faneuf , Stephen W. Montgomery
发明人： Jason B. Chesser , Barrett M. Faneuf , Stephen W. Montgomery
IPC分类号： F25B29/00
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/043 , F28D15/046 , G06F1/20 , H01L2924/0002 , H01L2924/3011 , H05K7/20009 , H05K7/20809 , H01L2924/00
摘要： A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.
摘要翻译：模块化毛细管泵回路（CPL）冷却系统及相关部件。模块化CPL冷却系统将热量从诸如设置在计算机机架内的微处理器的大功率电路组件传送到机箱内部或外部的其他位置，其中可以更容易地去除热量。在各种实施例中，CPL冷却系统包括通过柔性液体输送和蒸汽输送管线连接到一个或多个冷凝器的一个或多个蒸发器。在每个冷凝器内设置诸如体积的烧结铜的芯吸结构。芯吸结构基于毛细管机构和芯吸结构的上表面上的弯液面/蒸气界面之间的压力差将液态的工作流体（例如水）吸入蒸发器。当液体弯液面蒸发时，另外的流体被吸入蒸发器。然后将工作流体冷凝回冷凝器中的液体。

8. 发明授权

US06981543B2 Modular capillary pumped loop cooling system 有权
公开(公告)号：US06981543B2
公开(公告)日：2006-01-03
申请号：US09957792
申请日：2001-09-20
申请人： Jason B. Chesser , Barrett M. Faneuf , Stephen W. Montgomery
发明人： Jason B. Chesser , Barrett M. Faneuf , Stephen W. Montgomery
IPC分类号： F28D15/00 , F28F7/00 , H01K7/20 , H01L23/34
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/043 , F28D15/046 , G06F1/20 , H01L2924/0002 , H01L2924/3011 , H05K7/20009 , H05K7/20809 , H01L2924/00
摘要： A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

9. 发明授权

US06836407B2 Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure 有权
标题翻译：计算机系统具有多个服务器单元，该多个服务器单元将热传递到流过框架级流体通道结构的流体
公开(公告)号：US06836407B2
公开(公告)日：2004-12-28
申请号：US10039146
申请日：2002-01-04
申请人： Barrett M. Faneuf , Ven R. Holalkere , Stephen W. Montgomery
发明人： Barrett M. Faneuf , Ven R. Holalkere , Stephen W. Montgomery
IPC分类号： G06F120
CPC分类号： H05K7/20809 , G06F1/20 , H05K7/1454
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
摘要翻译：描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。每个服务器单元子组件具有与框架上的框架部件接合的底座部件。热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。在一个实施例中，空气管道位于多个框架部件上。热量从框架部件转移到流过管道的空气中。改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

10. 发明授权

US06776221B2 Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component 有权
标题翻译：具有机箱级毛细管泵回路的计算机系统将热量传递到框架级热接口部件
公开(公告)号：US06776221B2
公开(公告)日：2004-08-17
申请号：US10039136
申请日：2002-01-04
申请人： Stephen W. Montgomery , Barrett M. Faneuf
发明人： Stephen W. Montgomery , Barrett M. Faneuf
IPC分类号： F28F700
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/043 , F28D15/046 , G06F1/20 , H01L2924/0002 , H01L2924/3011 , H05K7/20009 , H05K7/20809 , H01L2924/00
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
摘要翻译：描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。每个服务器单元子组件具有与框架上的框架部件接合的底座部件。热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。在一个实施例中，空气管道位于多个框架部件上。热量从框架部件转移到流过管道的空气中。改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

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