专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US07427640B1 Oil materials comprising dimerdiol ester and cosmetics comprising the ester 有权
标题翻译：包含二聚二醇酯和包含酯的化妆品的油料
公开(公告)号：US07427640B1
公开(公告)日：2008-09-23
申请号：US09604763
申请日：2000-06-26
申请人： Tsuyoshi Katayama , Masakazu Okumura , Nobuaki Hattori , Makoto Nakajima , Osamu Kimura
发明人： Tsuyoshi Katayama , Masakazu Okumura , Nobuaki Hattori , Makoto Nakajima , Osamu Kimura
IPC分类号： A61K47/14 , A61K8/00 , A61K8/02
CPC分类号： C07C69/003 , A61K8/375 , A61K8/85 , A61Q1/02 , A61Q1/06 , A61Q1/10 , A61Q5/02 , A61Q5/12 , A61Q17/04 , A61Q19/00
摘要： An oil material comprising a dimerdiol ester with a monocarboxylic acid having 4 to 34 carbon atoms or with a dimerdiol ester with a dicarboxylic acid; and a cosmetic and an external agent excellent in safety, stability, gloss, feeling and the like comprising the dimerdiol carboxylate.
摘要翻译：一种油料，其包含具有4至34个碳原子的一元羧酸的二聚二醇酯或与二羧酸的二聚二醇酯; 以及包含二聚体二羧酸酯的安全性，稳定性，光泽，感觉等优异的化妆品和外用剂。

12. 发明授权

US07115026B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US07115026B2
公开(公告)日：2006-10-03
申请号：US11201307
申请日：2005-08-11
申请人： Makoto Nakajima , Yoshio Nakamura , Tadakazu Miyashita
发明人： Makoto Nakajima , Yoshio Nakamura , Tadakazu Miyashita
IPC分类号： B24B7/22
CPC分类号： B24B37/08 , B24B41/007
摘要： An upper polishing plate is moved downward until facing a lower polishing plate to polish a work piece. The upper polishing plate is rotated in a horizontal plane together with a first elastic member, a second elastic member, an outer member and a connecting member. A pressure difference between a first pressing force pressing the outer member or an inner member upward and a second pressing force pressing the outer member or the inner member downward, which is produced in a first closed space by supplying a compressed fluid into and discharging the same from the first closed space, is adjusted, so that a third pressing force of the upper polishing plate, which presses a work piece, can be adjusted.
摘要翻译：上抛光板向下移动直到面向下抛光板以抛光工件。上部抛光板与第一弹性构件，第二弹性构件，外部构件和连接构件一起在水平面中旋转。通过将压缩流体供给到其中并在其中排出而在第一封闭空间中产生的压缩外部构件或内部构件向上的第一按压力与第二按压力之间的压力差从第一封闭空间被调节，从而能够调节按压工件的上部抛光板的第三按压力。

13. 发明申请

US20050028843A1 Method of cleaning abrasive plates of abrasive machine and cleaning device 审中-公开
公开(公告)号：US20050028843A1
公开(公告)日：2005-02-10
申请号：US10937685
申请日：2004-09-09
申请人： Yasuhide Denda , Yoshio Nakamura , Yoshinobu Nishimoto , Makoto Nakajima , Tsuyoshi Hasegawa , Norihiko Moriya
发明人： Yasuhide Denda , Yoshio Nakamura , Yoshinobu Nishimoto , Makoto Nakajima , Tsuyoshi Hasegawa , Norihiko Moriya
IPC分类号： B08B3/02 , B08B15/04 , B24B37/08 , B24B53/007 , B24B53/017 , B24B49/00
CPC分类号： B24B37/08 , B08B3/024 , B08B15/04 , B08B2203/0229 , B24B53/017 , Y10S134/902
摘要： The method of the present invention cleans abrasive faces of an upper abrasive plate and a lower abrasive plate of an abrasive machine. The method is executed by a cleaning device including: a nozzle for jetting water; a brush for preventing the jetted water from scattering in the air, the brush enclosing the nozzle; and another brush for closing a gap between the preventing brush and an outer edge of the upper abrasive plate, the method is characterized by the steps of: jetting water from the nozzle toward the abrasive face of the upper abrasive plate; moving the nozzle toward the outer edge of the upper abrasive plate; and closing the gap by the closing brush when the gap is formed between the preventing brush and the outer edge of the upper abrasive plate.

14. 发明授权

US5549502A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5549502A
公开(公告)日：1996-08-27
申请号：US162679
申请日：1993-12-06
申请人： Kohichi Tanaka , Hiromasa Hashimoto , Yasuo Inada , Makoto Nakajima
发明人： Kohichi Tanaka , Hiromasa Hashimoto , Yasuo Inada , Makoto Nakajima
IPC分类号： B24B37/34 , B24B1/00
CPC分类号： B24B37/345
摘要： A grinding method and apparatus having a position aligning mechanism to correctly achieve the centering of each work on a work table and locate an orientation flat part of each work at a predetermined position, and a displacing mechanism for reciprocally slidably displacing a top ring and the work table in order to assure that the center of each work is positionally aligned with the center of each top ring at an original position after completion of the centering of each work on the work table and the locating of the orientation flat part, and subsequently, centering each top ring with the gravitational center of each work so as to cancel a positional offset state prior to holding the work with the top ring to thrust the work against the grinding or polishing surface. The invention also includes a polishing method and apparatus in which both of a top ring and a rotary disc are reciprocally slidably displaced to improve the polishing efficiency of the device.
摘要翻译：一种磨削方法和装置，其具有位置对准机构，以正确地实现每个工件在工作台上的对中并将每个工件的定向平面部分定位在预定位置，以及位移机构，用于可往复地滑动地移动顶环和工件以确保每个工件的中心在完成每个工件在工作台上的定心和定位平面部分的定位之后在原始位置与每个顶环的中心位置对准，然后定心每个顶环具有每个工件的重力中心，以便在用顶环保持工件之前取消位置偏移状态，以将工件推向研磨或抛光表面。本发明还包括抛光方法和装置，其中顶环和旋转盘都可往复滑动地移位，以提高装置的抛光效率。

15. 发明授权

US5441444A Polishing machine 失效
标题翻译：抛光机
公开(公告)号：US5441444A
公开(公告)日：1995-08-15
申请号：US130473
申请日：1993-10-01
申请人： Makoto Nakajima
发明人： Makoto Nakajima
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304 , B24B7/22
CPC分类号： B24B37/30
摘要： An object of the present invention is to provide a polishing machine having a smaller holding section. In the polishing machine of the present invention, a polishing plate polishes a wafer. A holding section has a concave section. A carrying plate, which is provided in the concave section, holds the wafer. A press mechanism for pressing the carrying plate toward the polishing plate comprises an elastic plate dividing an inner space of the concave section into an upper space, which is formed as an air tight chamber, and a lower space, and allowing the carrying plate to move in the vertical and the horizontal directions by elastic transformation, and a fluid supplying unit for supplying fluid into the upper space for pressurizing. In the polishing machine, the elastic plate is formed into a plate, so that its size in the vertical direction can be small, and the vertical size of the polishing machine also can be smaller.
摘要翻译：本发明的目的是提供一种具有较小保持部分的抛光机。在本发明的研磨机中，抛光板对晶片进行抛光。保持部具有凹部。设置在凹部中的承载板保持晶片。用于将承载板朝向抛光板按压的按压机构包括将凹部的内部空间分割成形成为气密室的上部空间和下部空间的弹性板，并且允许承载板移动通过弹性变形在垂直和水平方向上，以及用于将流体供应到上部空间用于加压的流体供应单元。在抛光机中，弹性板形成为板，使得其在垂直方向上的尺寸可以较小，并且抛光机的垂直尺寸也可以更小。

16. 发明授权

US09291900B2 Composition for forming resist underlayer film, containing silicon that bears diketone-structure-containing organic group 有权
标题翻译：用于形成抗蚀剂下层膜的组合物，其含有含有二酮结构的有机基团的硅
公开(公告)号：US09291900B2
公开(公告)日：2016-03-22
申请号：US13981142
申请日：2012-01-24
申请人： Yuta Kanno , Daisuke Sakuma , Makoto Nakajima
发明人： Yuta Kanno , Daisuke Sakuma , Makoto Nakajima
IPC分类号： G03F7/075 , G03F7/09 , G03F7/20 , G03F7/30 , G03F7/36 , G03F7/11 , C09D183/06 , C08L83/06 , H01L21/308 , C09D4/00 , C08G77/14
CPC分类号： G03F7/0752 , C08G77/14 , C08L83/06 , C09D4/00 , C09D183/06 , G03F7/0755 , G03F7/0757 , G03F7/091 , G03F7/094 , G03F7/11 , G03F7/2041 , G03F7/30 , G03F7/36 , H01L21/3081 , H01L21/3088 , Y10T428/31663
摘要： A composition for forming a lithographic resist underlayer film, including, as a silane, a hydrolyzable organosilane, a hydrolysate thereof, or a hydrolytic condensate thereof, wherein the silane includes a hydrolyzable organosilane of Formula (1) below: [(R1)aSi(R2)(3-a)]b(R3) Formula (1) [where R3 is a group of Formula (2), (3), or (4): (in Formulae (2), (3), and (4), at least one from among R4, R5, and R6 is a group bonded to a silicon atom directly or through a linking group.), R1 is an alkyl group, an aryl group, an aralkyl group, an alkyl halide group, an aryl halide group, an aralkyl halide group, an alkenyl group, or an organic group having an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, an amino group, or a cyano group, or a combination thereof, R2 is an alkoxy group, an acyloxy group, or a halogen atom].
摘要翻译：一种用于形成光刻抗蚀剂下层膜的组合物，其包含作为硅烷的可水解的有机硅烷，其水解物或其水解缩合物，其中所述硅烷包括下述式（1）的可水解的有机硅烷：[（R1）aSi（ R2）（3-a）] b（R3）式（1）[其中R3是式（2），（3）或（4）的基团：（在式（2），（3） 4）中，R4，R5和R6中的至少一个是直接或通过连接基与硅原子键合的基团。），R1是烷基，芳基，芳烷基，烷基卤基，芳基卤基，芳烷基卤基，烯基或具有环氧基，丙烯酰基，甲基丙烯酰基，巯基，氨基或氰基的有机基团，或其组合，R 2 是烷氧基，酰氧基或卤素原子]。

17. 发明授权

US08835093B2 Resist underlayer film forming composition containing silicon having anion group 有权
标题翻译：含有具有阴离子基团的硅的抗蚀剂下层膜形成组合物
公开(公告)号：US08835093B2
公开(公告)日：2014-09-16
申请号：US13133751
申请日：2009-12-16
申请人： Wataru Shibayama , Makoto Nakajima , Yuta Kanno
发明人： Wataru Shibayama , Makoto Nakajima , Yuta Kanno
IPC分类号： G03F7/004 , G03F7/11 , G03F7/075 , G03F7/09 , C08L83/04 , H01L21/308 , C09D183/04
CPC分类号： H01L21/3086 , C08L83/04 , C09D183/04 , G03F7/0752 , G03F7/091 , G03F7/11
摘要： There is provided a resist underlayer film forming composition for lithography for forming a resist underlayer film capable of being used as a hardmask. A resist underlayer film forming composition for lithography comprising a silane compound containing an anion group, wherein the silane compound containing an anion group is a hydrolyzable organosilane in which an organic group containing an anion group is bonded to a silicon atom and the anion group forms a salt structure, a hydrolysis product thereof, or a hydrolysis-condensation product thereof. The anion group may be a carboxylic acid anion, a phenolate anion, a sulfonic acid anion, or a phosphonic acid anion. The hydrolyzable organosilane may be a compound of Formula (1): R1aR2bSi(R3)4−(a+b) (1). A composition comprising a mixture of a hydrolyzable organosilane of Formula (1), and at least one organic silicon compound selected from the group consisting of a compound of Formula (2): R4aSi(R5)4−a (2) and a compound of Formula (3): [R6cSi(R7)3−c]2Yb (3); a hydrolysis product of the mixture; or a hydrolysis-condensation product of the mixture.
摘要翻译：提供了用于形成能够用作硬掩模的抗蚀剂下层膜的光刻用抗蚀剂下层膜形成用组合物。一种用于光刻的抗蚀剂下层膜形成组合物，其包含含有阴离子基团的硅烷化合物，其中含有阴离子基团的硅烷化合物是其中含有阴离子基团的有机基团与硅原子键合的可水解的有机硅烷，并且阴离子基团形成盐结构，其水解产物或其水解缩合产物。阴离子基团可以是羧酸阴离子，酚盐阴离子，磺酸阴离子或膦酸阴离子。可水解的有机硅烷可以是式（1）的化合物：R1aR2bSi（R3）4-（a + b）（1）。一种组合物，其包含式（1）的可水解有机硅烷和至少一种选自式（2）的化合物：R4aSi（R5）4-a（2）的化合物和式（3）：[R6cSi（R7）3-c] 2Yb（3）; 该混合物的水解产物; 或该混合物的水解缩合产物。

18. 发明申请

US20130302991A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, CONTAINING SILICON THAT BEARS DIKETONE-STRUCTURE-CONTAINING ORGANIC GROUP 有权
标题翻译：用于形成耐下层膜的组合物，含有含有酮结构的有机组织的硅
公开(公告)号：US20130302991A1
公开(公告)日：2013-11-14
申请号：US13981142
申请日：2012-01-24
申请人： Yuta Kanno , Daisuke Sakuma , Makoto Nakajima
发明人： Yuta Kanno , Daisuke Sakuma , Makoto Nakajima
IPC分类号： H01L21/308
CPC分类号： G03F7/0752 , C08G77/14 , C08L83/06 , C09D4/00 , C09D183/06 , G03F7/0755 , G03F7/0757 , G03F7/091 , G03F7/094 , G03F7/11 , G03F7/2041 , G03F7/30 , G03F7/36 , H01L21/3081 , H01L21/3088 , Y10T428/31663
摘要： A composition for forming a lithographic resist underlayer film, including, as a silane, a hydrolyzable organosilane, a hydrolysate thereof, or a hydrolytic condensate thereof, wherein the silane includes a hydrolyzable organosilane of Formula (1) below: [(R1)aSi(R2)(3-a)]b(R3) Formula (1) [where R3 is a group of Formula (2), (3), or (4): (in Formulae (2), (3), and (4), at least one from among R4, R5, and R6 is a group bonded to a silicon atom directly or through a linking group.), R1 is an alkyl group, an aryl group, an aralkyl group, an alkyl halide group, an aryl halide group, an aralkyl halide group, an alkenyl group, or an organic group having an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, an amino group, or a cyano group, or a combination thereof, R2 is an alkoxy group, an acyloxy group, or a halogen atom].
摘要翻译：一种用于形成光刻抗蚀剂下层膜的组合物，其包含作为硅烷的可水解的有机硅烷，其水解物或其水解缩合物，其中所述硅烷包括下述式（1）的可水解的有机硅烷：[（R1）aSi（ R2）（3-a）] b（R3）式（1）[其中R3是式（2），（3）或（4）的基团：（在式（2），（3） 4）中，R4，R5和R6中的至少一个是直接或通过连接基与硅原子键合的基团。），R1是烷基，芳基，芳烷基，烷基卤基，芳基卤基，芳烷基卤基，烯基或具有环氧基，丙烯酰基，甲基丙烯酰基，巯基，氨基或氰基的有机基团，或其组合，R 2 是烷氧基，酰氧基或卤素原子]。

19. 发明申请

US20120181788A1 JOINT STRUCTURE 有权
标题翻译：联合结构
公开(公告)号：US20120181788A1
公开(公告)日：2012-07-19
申请号：US13297903
申请日：2011-11-16
申请人： Shinjiro Inomata , Makoto Nakajima
发明人： Shinjiro Inomata , Makoto Nakajima
IPC分类号： F16L13/02
CPC分类号： B23K33/004 , F16L23/026 , F16L23/14 , G21C7/10 , G21C13/032 , Y02E30/39
摘要： In a joint structure, a tube member having a polygonal cross-section can be joined to a flange surface by full penetration welding with good strength margin, without imparting unreasonable force to the weld portion. The joint structure comprises a polygonal cylindrical lower guide tube joined by butt welding to a surface of a middle flange having a through-hole of the same shape as the lower guide tube, wherein at the end of the lower guide tube, within the linear portions that constitute each of the sides of the lower guide tube, there exists a weld portion welded to the surface in at least one location and an unwelded portion located separately from the weld portion, and a level difference at least as large as a distance equivalent to the weld shrinkage of the weld portion is provided between the end positions of the weld portion of the unwelded portion.
摘要翻译：在接头结构中，具有多边形横截面的管构件可以通过全面穿透焊接而具有良好的强度裕度而接合到凸缘表面，而不会对焊接部分施加不合理的力。该接合结构包括一个多边形的圆柱形下导向管，其通过对接焊接到具有与下导管相同形状的通孔的中间凸缘的表面上，其中在下导向管的端部处于直线部分构成下引导管的每个侧面，在至少一个位置处存在焊接到表面的焊接部分和与焊接部分分开定位的未焊接部分，并且至少等于相当于焊接部的焊接收缩率设置在未焊接部的焊接部的端部位置之间。

20. 发明授权

US08163460B2 Underlayer coating forming composition for lithography containing polysilane compound 有权
标题翻译：用于含聚硅烷化合物的光刻用底层涂料组合物
公开(公告)号：US08163460B2
公开(公告)日：2012-04-24
申请号：US11920840
申请日：2006-05-12
申请人： Satoshi Takei , Keisuke Hashimoto , Makoto Nakajima
发明人： Satoshi Takei , Keisuke Hashimoto , Makoto Nakajima
IPC分类号： G03F7/004 , G03F7/075 , G03F7/26
CPC分类号： G03F7/0752 , C09D183/16 , G03F7/11 , Y10S430/128
摘要： There is provided an underlayer coating for lithography that is used in lithography process of the manufacture of semiconductor devices, that can be used as a hardmask, and that causes no intermixing with photoresists; and a composition for forming the underlayer coating.The composition comprises a polysilane compound, a crosslinkable compound, a crosslinking catalyst and a solvent. The polysilane compound is preferably a polysilane compound having a bond between silicons at the main chain.
摘要翻译：提供了用于光刻的底层涂层，其用于制造半导体器件的光刻工艺，其可以用作硬掩模，并且不会与光致抗蚀剂混合; 和用于形成下层涂层的组合物。该组合物包含聚硅烷化合物，可交联化合物，交联催化剂和溶剂。聚硅烷化合物优选为在主链上具有硅的键的聚硅烷化合物。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式