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11. 发明授权

US07356917B2 Method for manufacturing multi-layer printed circuit board 有权
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US07356917B2
公开(公告)日：2008-04-15
申请号：US11116320
申请日：2005-04-28
申请人： Toshikazu Harada , Koji Kondo
发明人： Toshikazu Harada , Koji Kondo
IPC分类号： H05K3/30 , H05K1/03
CPC分类号： H05K1/0242 , H05K1/024 , H05K3/382 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0191 , H05K2201/0352 , H05K2203/065 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49163 , Y10T428/24917
摘要： A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.
摘要翻译：多层印刷电路板包括绝缘基板; 设置在所述绝缘基板的表面上的表面导电图案; 以及嵌入绝缘基板中的内导电图案。表面导电图案在绝缘基板侧具有表面粗糙度，表面导电图案的表面粗糙度大于内部导电图案的表面粗糙度。

12. 发明申请

US20080049849A1 Communication system using differential two-wire type of communication line 有权
标题翻译：通信系统采用差分两线式通信线路
公开(公告)号：US20080049849A1
公开(公告)日：2008-02-28
申请号：US11882289
申请日：2007-07-31
申请人： Naoto Sakai , Koji Kondo
发明人： Naoto Sakai , Koji Kondo
IPC分类号： H04B3/00
CPC分类号： H04B3/50 , H04L25/0272 , H04L25/085
摘要： A communication system comprises the network, plural nodes, and a reducer. The network comprises a main line and a plurality of branch lines branched from the main line respectively, the main line and each of the branch lines being respectively formed into a differential two-wire type of communication line consisting of a first communion line and a second communication line. The plural nodes are connected to two or more branch lines of the branch lines to communicate frames of data among the branches with each other. The reducer is arranged to each node to reduce either an impedance of each of the first and second communication lines or an impedance between the first and second communication lines during a specified period of time starting at a time instant when a node completes sending out the frames of data to be transmitted.
摘要翻译：通信系统包括网络，多个节点和减速器。网络包括主线和分别从主线分支的多条分支线，主线和每条分支线分别形成为由第一通道线和第二通线组成的差分两线式通信线路通讯线。多个节点连接到分支线路的两条或更多条支线，以便在分支之间彼此传送数据帧。减速器被布置到每个节点以在从节点完成发送帧的时刻开始的指定时间段内减小第一和第二通信线路中的每一个的阻抗或第一和第二通信线路之间的阻抗要发送的数据。

13. 发明授权

US07304248B2 Multi-layer printed circuit board and method for manufacturing the same 有权
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US07304248B2
公开(公告)日：2007-12-04
申请号：US10814803
申请日：2004-04-01
申请人： Kazuo Tada , Koji Kondo , Satoshi Takeuchi
发明人： Kazuo Tada , Koji Kondo , Satoshi Takeuchi
IPC分类号： H05K1/16
CPC分类号： H05K1/167 , H05K3/4611 , H05K3/4614 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0317 , H05K2203/065 , Y10T29/49082 , Y10T29/49126 , Y10T29/49128
摘要： A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.
摘要翻译：多层印刷电路板包括：具有多层叠热塑性树脂膜的树脂基板; 嵌入树脂基板中的薄膜电阻器; 以及设置在薄膜电阻器上的电极。热塑性树脂膜包括由金属膜制成的导电图案。电极被设置在电极之上或之下的导电图案覆盖。

14. 发明申请

US20060067534A1 Storage medium storing stereo enhancement processing program, stereo enhancement apparatus and stereo enhancement method 审中-公开
标题翻译：存储介质存储立体声增强处理程序，立体声增强装置和立体声增强方法
公开(公告)号：US20060067534A1
公开(公告)日：2006-03-30
申请号：US11157978
申请日：2005-06-22
申请人： Masato Mizuta , Yasushi Ida , Koji Kondo
发明人： Masato Mizuta , Yasushi Ida , Koji Kondo
IPC分类号： H04R5/00 , H04B1/00
CPC分类号： H04S1/002
摘要： A game apparatus functioning as a stereo enhancement apparatus includes a CPU, and the CPU generates sound signals of stereo sounds required for the game. The CPU adjusts volumes of stereo sounds simultaneously played from respective sound sources on the basis of pan of the respective sound sources, and mixes the plurality of stereo sounds whose volumes have been adjusted to generate a stereo sound of two channels. Next, the stereo sound including an L channel sound signal (Lin) and an R channel sound signal (Rin) that have been mixed is divided into two systems, and then, a stereo enhancement signal (Lin−Rin) is generated. Then, the stereo enhancement signal is delayed, an added signal obtained by adding the delayed stereo enhancement signal to the Lin is generated, and a subtracted signal obtained by subtracting the delayed stereo enhancement signal from the Rin is generated. Then, the added signal is output from a speaker for L channel, and the subtracted signal is output from a speaker for R channel.
摘要翻译：用作立体声增强装置的游戏装置包括CPU，并且CPU生成游戏所需的立体声的声音信号。 CPU根据相应声源的平移来调整从相应的声源同时播放的立体声音量，并且将已经调节其音量的多个立体声混合以产生两声道的立体声。接下来，包括混合的L声道声音信号（Lin）和R声道声音信号（Rin）的立体声被分成两个系统，然后产生立体声增强信号（Lin-Rin）。然后，立体声增强信号被延迟，产生通过将延迟立体声增强信号加到林而获得的相加信号，并且产生通过从Rin中减去延迟立体声增强信号而获得的相减信号。然后，从L通道的扬声器输出相加的信号，并且从用于R声道的扬声器输出相减信号。

15. 发明申请

US20060044735A1 Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device 有权
标题翻译：用于半导体器件的封装衬底，其制造方法和半导体器件
公开(公告)号：US20060044735A1
公开(公告)日：2006-03-02
申请号：US11213867
申请日：2005-08-30
申请人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
发明人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
IPC分类号： H05K1/00
CPC分类号： H05K3/4632 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/0271 , H05K1/114 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/068 , H05K2201/09063 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2203/1178 , H01L2924/00 , H01L2224/0401
摘要： A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
摘要翻译：具有形成在表面上的导电图案的多个膜绝缘体和在厚度方向上穿过膜绝缘体的导电通孔堆叠在一起并且集体地经受压力和热量以形成为单个单元。在如此形成的多层板的一个最外层上，多个连接端子暴露于外部，LSI芯片的连接凸块固定在这些连接端子上。在相对侧的最外层，设置多个金属焊盘，并且在每个金属焊盘上固定焊球以形成用于连接到主板的球栅阵列（BGA）结构。

16. 发明授权

US06972070B2 Method of manufacturing a printed wiring board 有权
标题翻译：制造印刷电路板的方法
公开(公告)号：US06972070B2
公开(公告)日：2005-12-06
申请号：US10643919
申请日：2003-08-20
申请人： Yoshitaro Yazaki , Yoshihiko Shiraishi , Koji Kondo , Toshikazu Harada , Tomohiro Yokochi
发明人： Yoshitaro Yazaki , Yoshihiko Shiraishi , Koji Kondo , Toshikazu Harada , Tomohiro Yokochi
IPC分类号： H05K1/09 , H05K1/11 , H05K3/40 , H05K3/46 , H05K3/00
CPC分类号： H05K3/4632 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0272 , H05K2201/0305 , H05K2201/0355 , H05K2201/0394 , H05K2201/09827 , H05K2201/09863 , H05K2203/0425 , H05K2203/1131 , Y10T428/24917
摘要： A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.
摘要翻译：通过用层间导电材料填充形成在布线板的绝缘膜层上的孔，制成加压印刷线路板。绝缘膜与导体图案堆叠，并且每个导体图案封闭通孔。夹层导电材料在加压压制程序后在通孔中形成固体导电材料。固体导电材料包括两种类型的导电材料。第一类导电材料包括金属，第二类导电材料包括由导体图案的金属和导体金属形成的合金。导体图形可靠地电连接，而不依赖于机械接触。

17. 发明授权

US06851091B1 Image display apparatus and method 失效
标题翻译：图像显示装置及方法
公开(公告)号：US06851091B1
公开(公告)日：2005-02-01
申请号：US09573719
申请日：2000-05-15
申请人： Fumitaka Honda , Koji Kondo
发明人： Fumitaka Honda , Koji Kondo
IPC分类号： G06F17/30 , G11B27/10 , G11B27/11 , G11B27/28 , G11B27/34 , G06F3/00
CPC分类号： G06F17/30852 , G06F17/30843 , G11B27/105 , G11B27/11 , G11B27/28 , G11B27/34 , G11B2220/415
摘要： An imaging device capable of displaying an outline of a moving picture as a still picture is realized. Further, reproduction of a moving picture that is started from any desired scene by using an index picture can be realized. When VD index pictures displayed on a browser screen are selected, a corresponding index representative still picture is displayed. Therefore, a moving picture such as a moving picture of a quick motion whose contents cannot be easily grasped only by the VD index picture, can be easily recognized with the addition of the corresponding index representative still picture. By selecting the VD index pictures displayed on the browser screen, display of the corresponding moving picture is started from a portion corresponding to the selected VD index picture.
摘要翻译：实现了能够将运动图像的轮廓显示为静止图像的成像装置。此外，可以实现通过使用索引图片从任何期望的场景开始的运动图像的再现。当选择浏览器屏幕上显示的VD索引图片时，显示相应的索引代表静态图片。因此，通过添加对应的索引代表静止图像，可以容易地识别诸如快速运动的运动图像的运动图像，其内容不能仅由VD索引图像来掌握。通过选择浏览器屏幕上显示的VD索引图片，从对应于所选择的VD索引图片的部分开始显示相应的运动图像。

18. 发明授权

US06218030B1 Soldered product 失效
标题翻译：焊接产品
公开(公告)号：US06218030B1
公开(公告)日：2001-04-17
申请号：US08908457
申请日：1997-08-07
申请人： Toshihiro Miyake , Koji Kondo , Takashi Kurahashi , Nozomu Okumura , Makoto Takagi
发明人： Toshihiro Miyake , Koji Kondo , Takashi Kurahashi , Nozomu Okumura , Makoto Takagi
IPC分类号： B21D3900
CPC分类号： B23K35/3612 , B23K1/015 , B23K2101/40 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/16 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/3489 , Y10S428/939 , Y10T428/12514 , Y10T428/12556 , Y10T428/1259 , H01L2924/00014
摘要： A soldered product having secure reliable joints, without the use of flux, is disclosed. The soldered product includes a first member having a connected portion and a second member, also having a connected portion, facing the first member. The connected portions of the first and second members are electrically connected by a connecting material. A layer of hydrocarbon, including alkane, alkene or alkyne, is disposed around the periphery of the connecting material.
摘要翻译：公开了一种焊接产品，具有安全可靠的接头，而不使用焊剂。焊接产品包括具有连接部分的第一构件和第二构件，第二构件也具有面向第一构件的连接部分。第一和第二构件的连接部分通过连接材料电连接。包括烷烃，烯烃或炔烃在内的碳氢化合物层围绕连接材料的周边设置。

19. 发明授权

US5897692A Electroless plating solution 失效
标题翻译：化学镀溶液
公开(公告)号：US5897692A
公开(公告)日：1999-04-27
申请号：US925059
申请日：1997-09-08
申请人： Kazunori Kotsuka , Koji Kondo
发明人： Kazunori Kotsuka , Koji Kondo
IPC分类号： C23C18/34 , C23C18/50 , H05K3/24
CPC分类号： C23C18/34 , C23C18/50 , H05K3/244
摘要： An electroless plating solution having high stability and capable of preventing the formation of nodules is disclosed. The electroless plating solution includes metal ions which includes nickel ions and copper and/or cobalt ions, a complexing agent containing a hydroxycarboxylic acid and a reducing agent and having a pH of at least 7, and an anionic surfactant. The electroless plating solution further includes iron ions provided by a source selected from potassium ferrocyanide and potassium ferricyanide. The completing agent is preferably used in a molar amount at least equal to that of the metal ions. The electroless plating solution is preferred to contain from 1 mg/L to 0.2 g/L of iron ions and from 10 ppm to 10 g/L of the anionic surfactant.
摘要翻译：公开了具有高稳定性并且能够防止结核形成的化学镀溶液。化学镀溶液包括包含镍离子和铜和/或钴离子的金属离子，含有羟基羧酸和还原剂并且pH至少为7的络合剂和阴离子表面活性剂。化学镀溶液还包括由选自亚铁氰化钾和铁氰化钾的源提供的铁离子。完成剂优选以至少等于金属离子的摩尔量使用。化学镀溶液优选含有1mg / L至0.2g / L的铁离子和10ppm至10g / L的阴离子表面活性剂。

20. 发明授权

US5511719A Process of joining metal members 失效
标题翻译：连接金属部件的工艺
公开(公告)号：US5511719A
公开(公告)日：1996-04-30
申请号：US251921
申请日：1994-06-01
申请人： Toshihiro Miyake , Katuya Bando , Toshiaki Yagura , Koji Kondo
发明人： Toshihiro Miyake , Katuya Bando , Toshiaki Yagura , Koji Kondo
IPC分类号： B23K1/06 , H05K3/34 , H05K3/36 , B23K1/20
CPC分类号： H05K3/363 , B23K1/06 , B23K2201/42 , H05K2203/0195 , H05K2203/0285 , H05K3/3473 , H05K3/3494
摘要： A process of joining metal members, comprising the steps of: providing a first group of a plurality of metal members, each member having a solder bead formed thereon; providing a second group of a plurality of metal members, each member having a solder bead formed thereon; abutting the first group of metal members against the second group of metal members by direct contact between the solder beads; applying an ultrasonic vibration through the metal members to the solder beads in contact; and subsequently heating the beads to cause the solder beads to be bonded together.
摘要翻译：一种连接金属构件的方法，包括以下步骤：提供多个金属构件的第一组，每个构件具有形成在其上的焊球; 提供第二组多个金属构件，每个构件具有形成在其上的焊球; 通过焊料珠之间的直接接触将第一组金属构件抵靠第二组金属构件; 将超声波振动通过金属构件接触到焊球; 随后加热珠子以使焊料珠结合在一起。

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