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1. 发明授权

US5897692A Electroless plating solution 失效
标题翻译：化学镀溶液
公开(公告)号：US5897692A
公开(公告)日：1999-04-27
申请号：US925059
申请日：1997-09-08
申请人： Kazunori Kotsuka , Koji Kondo
发明人： Kazunori Kotsuka , Koji Kondo
IPC分类号： C23C18/34 , C23C18/50 , H05K3/24
CPC分类号： C23C18/34 , C23C18/50 , H05K3/244
摘要： An electroless plating solution having high stability and capable of preventing the formation of nodules is disclosed. The electroless plating solution includes metal ions which includes nickel ions and copper and/or cobalt ions, a complexing agent containing a hydroxycarboxylic acid and a reducing agent and having a pH of at least 7, and an anionic surfactant. The electroless plating solution further includes iron ions provided by a source selected from potassium ferrocyanide and potassium ferricyanide. The completing agent is preferably used in a molar amount at least equal to that of the metal ions. The electroless plating solution is preferred to contain from 1 mg/L to 0.2 g/L of iron ions and from 10 ppm to 10 g/L of the anionic surfactant.
摘要翻译：公开了具有高稳定性并且能够防止结核形成的化学镀溶液。化学镀溶液包括包含镍离子和铜和/或钴离子的金属离子，含有羟基羧酸和还原剂并且pH至少为7的络合剂和阴离子表面活性剂。化学镀溶液还包括由选自亚铁氰化钾和铁氰化钾的源提供的铁离子。完成剂优选以至少等于金属离子的摩尔量使用。化学镀溶液优选含有1mg / L至0.2g / L的铁离子和10ppm至10g / L的阴离子表面活性剂。

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