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    • 11. 发明授权
    • Self-aligned mask formed utilizing differential oxidation rates of materials
    • 使用材料的不同氧化速率形成的自对准掩模
    • US06844225B2
    • 2005-01-18
    • US10345469
    • 2003-01-15
    • Huajie ChenKathryn T. SchonenbergGregory G. FreemanAndreas D. StrickerJae-Sung Rieh
    • Huajie ChenKathryn T. SchonenbergGregory G. FreemanAndreas D. StrickerJae-Sung Rieh
    • H01L21/321H01L21/331H01L29/732H01L29/737H01L21/00
    • H01L29/66242H01L21/32105Y10S438/911
    • A self-aligned oxide mask is formed utilizing differential oxidation rates of different materials. The self-aligned oxide mask is formed on a CVD grown base NPN base layer which compromises single crystal Si (or Si/SiGe) at active area and polycrystal Si (or Si/SiGe) on the field. The self-aligned mask is fabricated by taking advantage of the fact that poly Si (or Si/SiGe) oxidizes faster than single crystal Si (or Si/SiGe). An oxide film is formed over both the poly Si (or Si/siGe) and the single crystal Si (or Si/siGe) by using an thermal oxidation process to form a thick oxidation layer over the poly Si (or Si/siGe) and a thin oxidation layer over the single crystal Si (or Si/siGe), followed by a controlled oxide etch to remove the thin oxidation layer over the single crystal Si (or Si/siGe) while leaving the self-aligned oxide mask layer over the poly Si (or Si/siGe). A raised extrinsic base is then formed following the self-aligned mask formation. This self-aligned oxide mask blocks B diffusion from the raised extrinsic base to the corner of collector.
    • 使用不同材料的不同氧化速率形成自对准氧化物掩模。 自对准氧化物掩模形成在CVD生长的基底NPN基层上,其牺牲了场上的活性区域上的单晶Si(或Si / SiGe)和多晶Si(或Si / SiGe)。 通过利用多晶硅(或Si / SiGe)比单晶Si(或Si / SiGe)更快地氧化的事实来制造自对准掩模。 通过使用热氧化工艺在多晶硅(或Si / siGe)和单晶Si(或Si / siGe)上形成氧化膜,以在多晶硅(或Si / SiGe)上形成厚的氧化层,以及 在单晶Si(或Si / siGe)上方的薄氧化层,随后进行受控氧化物蚀刻以除去单晶Si(或Si / siGe)上的薄氧化层,同时将自对准氧化物掩模层留在 多晶硅(或Si / siGe)。 然后在自对准掩模形成之后形成隆起的外在基体。 该自对准氧化物掩模阻挡从扩展的外在碱基到收集器角的扩散。
    • 13. 发明授权
    • Bipolar transistor with dual shallow trench isolation and low base resistance
    • 具有双浅沟槽隔离和低基极电阻的双极晶体管
    • US07888745B2
    • 2011-02-15
    • US11425550
    • 2006-06-21
    • Marwan H. KhaterAndreas D. StrickerBradley A. OrnerMattias E. Dahlstrom
    • Marwan H. KhaterAndreas D. StrickerBradley A. OrnerMattias E. Dahlstrom
    • H01L29/72
    • H01L29/7378H01L29/66242
    • An improved bipolar transistor with dual shallow trench isolation for reducing the parasitic component of the base to collector capacitance Ccb and base resistance Rb is provided. The structure includes a semiconductor substrate having at least a pair of neighboring first shallow trench isolation (STI) regions disposed therein. The pair of neighboring first STI regions defines an active area in the substrate. The structure also includes a collector disposed in the in the active area of the semiconductor substrate, a base layer disposed atop a surface of the semiconductor substrate in the active area, and a raised extrinsic base disposed on the base layer. In accordance with the present, the raised extrinsic base has an opening to a portion of the base layer. An emitter is located in the opening and extending on a portion of the patterned raised extrinsic base; the emitter is spaced apart and isolated from the raised extrinsic base. Moreover, and in addition to the first STI region, a second shallow trench isolation (STI) region is present in the semiconductor substrate which extends inward from each pair of said first shallow trench isolation regions towards said collector. The second STI region has an inner sidewall surface that is sloped. In some embodiments, the base is completely monocrystalline.
    • 提供了具有双浅沟槽隔离的改进的双极晶体管,用于减小基极与集电极电容Ccb和基极电阻Rb的寄生分量。 该结构包括具有设置在其中的至少一对相邻的第一浅沟槽隔离(STI)区域的半导体衬底。 该对相邻的第一STI区域限定衬底中的有源区域。 该结构还包括设置在半导体衬底的有源区域中的集电体,设置在有源区域中的半导体衬底的表面上的基极层和设置在基极层上的凸起的非本征基极。 根据本发明,凸起的外在基部具有对基底层的一部分的开口。 发射器位于开口中并在图案化的凸起的外基极的一部分上延伸; 发射极间隔开并与凸起的外基极隔离。 而且,除了第一STI区之外,第二浅沟槽隔离(STI)区域存在于从每对所述第一浅沟槽隔离区向内朝向所述集电极延伸的半导体衬底中。 第二STI区域具有倾斜的内侧壁表面。 在一些实施方案中,碱是完全单晶的。
    • 16. 发明授权
    • Self-aligned mask formed utilizing differential oxidation rates of materials
    • 使用材料的不同氧化速率形成的自对准掩模
    • US07288827B2
    • 2007-10-30
    • US10969718
    • 2004-10-20
    • Huajie ChenKathryn T. SchonenbergGregory G. FreemanAndreas D. StrickerJae-Sung Rieh
    • Huajie ChenKathryn T. SchonenbergGregory G. FreemanAndreas D. StrickerJae-Sung Rieh
    • H01L27/082H01L27/102
    • H01L29/66242H01L21/32105Y10S438/911
    • A self-aligned oxide mask is formed utilizing differential oxidation rates of different materials. The self-aligned oxide mask is formed on a CVD grown base NPN base layer which compromises single crystal Si (or Si/SiGe) at active area and polycrystal Si (or Si/SiGe) on the field. The self-aligned mask is fabricated by taking advantage of the fact that poly Si (or Si/SiGe) oxidizes faster than single crystal Si (or Si/SiGe). An oxide film is formed over both the poly Si (or Si/siGe) and the single crystal Si (or Si/siGe) by using an thermal oxidation process to form a thick oxidation layer over the poly Si (or Si/siGe) and a thin oxidation layer over the single crystal Si (or Si/siGe), followed by a controlled oxide etch to remove the thin oxidation layer over the single crystal Si (or Si/siGe) while leaving the self-aligned oxide mask layer over the poly Si (or Si/siGe). A raised extrinsic base is then formed following the self-aligned mask formation. This self-aligned oxide mask blocks B diffusion from the raised extrinsic base to the corner of collector.
    • 使用不同材料的不同氧化速率形成自对准氧化物掩模。 自对准氧化物掩模形成在CVD生长的基底NPN基层上,其牺牲了场上的活性区域上的单晶Si(或Si / SiGe)和多晶Si(或Si / SiGe)。 通过利用多晶硅(或Si / SiGe)比单晶Si(或Si / SiGe)更快地氧化的事实来制造自对准掩模。 通过使用热氧化工艺在多晶硅(或Si / siGe)和单晶Si(或Si / siGe)上形成氧化膜,以在多晶硅(或Si / SiGe)上形成厚的氧化层,以及 在单晶Si(或Si / siGe)上方的薄氧化层,随后进行受控氧化物蚀刻以除去单晶Si(或Si / siGe)上的薄氧化层,同时将自对准氧化物掩模层留在 多晶硅(或Si / siGe)。 然后在自对准掩模形成之后形成隆起的外在基体。 该自对准氧化物掩模阻挡从扩展的外在碱基到收集器角的扩散。