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    • 11. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20110233623A1
    • 2011-09-29
    • US12965649
    • 2010-12-10
    • Ki Yeol PARKWoo Chul JeonYoung Hwan ParkJung Hee Lee
    • Ki Yeol PARKWoo Chul JeonYoung Hwan ParkJung Hee Lee
    • H01L29/778H01L21/336
    • H01L29/7786H01L29/0649H01L29/2003H01L29/365H01L29/4236H01L29/66462H01L29/78681
    • There is provided a semiconductor device and a method of manufacturing the same. The semiconductor device includes a base substrate; a semiconductor layer having a receiving groove, a protrusion part, a first carrier injection layer, at least two insulating patterns, and a second carrier injection layer provided on the base substrate, the insulating patterns being disposed to traverse the first carrier injection layer and the second carrier injection layer being spaced apart from the first carrier injection layer and disposed on a lower portion of the protrusion part; a source electrode and a drain electrode disposed to be spaced apart from each other on the semiconductor layer; and a gate electrode insulated from the source electrode and the drain electrode and having a recess part recessed into the receiving groove, wherein a lowest portion of the receiving groove contacts an uppermost layer of the first carrier injection layer or is disposed above the uppermost layer thereof, and an insulating pattern, disposed at an innermost portion of the semiconductor layer among the insulating patterns, traverses the first carrier injection layer and is disposed at the outside of both sides of the receiving groove in a thickness direction thereof.
    • 提供了一种半导体器件及其制造方法。 半导体器件包括:基底; 具有接收槽的半导体层,突起部分,第一载流子注入层,至少两个绝缘图案和设置在基底基板上的第二载流子注入层,绝缘图案设置成穿过第一载流子注入层和 第二载体注入层与第一载体注入层间隔开并设置在突出部分的下部; 源电极和漏电极,设置成在半导体层上彼此间隔开; 以及与源电极和漏电极绝缘的栅电极,并且具有凹入到所述接收槽中的凹部,其中所述接收槽的最下部接触所述第一载流子注入层的最上层,或者设置在所述第一载流子注入层的最上层 并且绝缘图案设置在绝缘图案中的半导体层的最内部,穿过第一载流子注入层,并且沿着其厚度方向设置在容纳槽的两侧的外侧。
    • 19. 发明申请
    • Nitride semicondutor device and manufacturing method thereof
    • 氮化物半导体器件及其制造方法
    • US20120267642A1
    • 2012-10-25
    • US13137311
    • 2011-08-04
    • Woo Chul JeonKi Yeol ParkYoung Hwan Park
    • Woo Chul JeonKi Yeol ParkYoung Hwan Park
    • H01L29/12H01L21/335H01L29/778
    • H01L29/7787H01L29/2003H01L29/402H01L29/42368H01L29/42376H01L29/475H01L29/66462
    • Provided is a nitride semiconductor device including: a nitride semiconductor layer over a substrate wherein the nitride semiconductor has a two-dimensional electron gas (2DEG) channel inside; a drain electrode in ohmic contact with the nitride semiconductor layer; a source electrode in Schottky contact with the nitride semiconductor layer wherein the source electrode is spaced apart from the drain electrode; a dielectric layer formed on the nitride semiconductor layer between the drain electrode and the source electrode and on at least a portion of the source electrode; and a gate electrode disposed on the dielectric layer to be spaced apart from the drain electrode, wherein a portion of the gate electrode is formed over a drain-side edge portion of the source electrode with the dielectric layer interposed therebetween, and a manufacturing method thereof.
    • 提供一种氮化物半导体器件,其包括:氮化物半导体层,其在氮化物半导体内部具有二维电子气体(2DEG)通道的衬底上; 与氮化物半导体层欧姆接触的漏电极; 与氮化物半导体层肖特基接触的源电极,其中源电极与漏电极间隔开; 形成在所述氮化物半导体层上的所述漏电极和所述源电极之间以及所述源电极的至少一部分上的电介质层; 以及设置在所述电介质层上以与所述漏极间隔开的栅电极,其中所述栅电极的一部分形成在所述源电极的漏极侧边缘部分之间,并且介电层插入其间;以及其制造方法 。
    • 20. 发明申请
    • NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • 氮化物半导体器件及其制造方法
    • US20130082277A1
    • 2013-04-04
    • US13442494
    • 2012-04-09
    • Young Hwan PARKWoo Chul JeonKi Yeol ParkSeok Yoon Hong
    • Young Hwan PARKWoo Chul JeonKi Yeol ParkSeok Yoon Hong
    • H01L29/20H01L21/335
    • H01L29/41725H01L29/2003H01L29/42316H01L29/66462H01L29/7787
    • The present invention relates to a nitride semiconductor device and a manufacturing method thereof. According to one aspect of the present invention, a nitride semiconductor device including: a nitride semiconductor layer having a 2DEG channel; a source electrode in ohmic contact with the nitride semiconductor layer; a drain electrode in ohmic contact with the nitride semiconductor layer; a plurality of p-type nitride semiconductor segments formed on the nitride semiconductor layer and each formed lengthways from a first sidewall thereof, which is spaced apart from the source electrode, to a drain side; and a gate electrode formed to be close to the source electrode and in contact with the nitride semiconductor layer between the plurality of p-type semiconductor segments and portions of the p-type semiconductor segments extending in the direction of a source-side sidewall of the gate electrode aligned with the first sidewalls of the p-type nitride semiconductor segments is provided.
    • 本发明涉及一种氮化物半导体器件及其制造方法。 根据本发明的一个方面,一种氮化物半导体器件包括:具有2DEG通道的氮化物半导体层; 与氮化物半导体层欧姆接触的源电极; 与氮化物半导体层欧姆接触的漏电极; 多个p型氮化物半导体段形成在氮化物半导体层上,并且每个从源极电极间隔开的第一侧壁纵向形成到漏极侧; 以及栅电极,其形成为靠近所述源电极并且与所述多个p型半导体区段之间的所述氮化物半导体层和所述p型半导体区段沿所述源极侧侧壁的方向延伸的部分接触 提供了与p型氮化物半导体段的第一侧壁对准的栅电极。