会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 13. 发明申请
    • Liquid crystal display device
    • 液晶显示装置
    • US20060215079A1
    • 2006-09-28
    • US11376289
    • 2006-03-16
    • Takato SuzukiKenichi Fukuda
    • Takato SuzukiKenichi Fukuda
    • G02F1/1335
    • G02F1/133502
    • A liquid crystal display device comprising: a first protective film; a first polarizing film; an optical compensation region; a liquid crystal cell comprising a liquid crystal layer and a pair of substrates sandwiching the liquid crystal layer; a second polarizing film; and a second protective layer, in this order, wherein at a black display, liquid crystal molecules in the liquid crystal layer are aligned in parallel with surfaces of said pair of substrates, an antiglare layer is provided to at least one of the first protective film and the second protective layer, and the antiglare layer has a haze value attributable to internal scattering of from 5 to 35%, and a haze value attributable to surface scattering of from 1 to 10%.
    • 一种液晶显示装置,包括:第一保护膜; 第一偏振片; 光学补偿区域; 液晶单元,其包含液晶层和夹着所述液晶层的一对基板; 第二偏光膜; 和第二保护层,其中在黑色显示器处,液晶层中的液晶分子与所述一对基板的表面平行排列,防眩层设置在第一保护膜中的至少一个上 第二保护层和防眩光层具有归因于内部散射的雾度值为5〜35%,归因于表面散射的雾度值为1〜10%。
    • 14. 发明申请
    • Primer composition for a fluorinated elastomer or a fluorinated gel
    • 含氟弹性体或氟化凝胶的底漆组合物
    • US20060178459A1
    • 2006-08-10
    • US11177304
    • 2005-07-11
    • Takashi MatsudaYasuhisa OsawaKenichi Fukuda
    • Takashi MatsudaYasuhisa OsawaKenichi Fukuda
    • C08K5/54
    • B05D5/083B05D7/544B05D7/546C08L71/02C09D171/02Y10T428/31663C08L83/00
    • A primer composition for a fluorinated elastomer or a fluorinated gel, said primer composition comprising: 100 parts by weight of (a) a linear perfluoro polyether compound having at least two alkenyl groups per molecule, a perfluoro polyether backbone having repeating units represented by the formula, —CaF2aO—, wherein a is an integer of from 1 to 6, and a weight average molecular weight of from 5,000 to 100,000, (b) an organosiloxane compound having one or more fluorine atom and at least two SiH bonds per molecule, in such an amount that a molar ratio of the SiH bond in the organosiloxane compound to the alkenyl group in Component (a) ranges from 0.8 to 5.0, a catalytic amount of (c) a hydrosilylation catalyst, 5 to 100 parts by weight of (d) an organosiloxane compound having, per molecule, at least one SiH bond and at least one epoxy group and/or trialkoxysilyl group bonded to a silicon atom of said organosiloxane via an organic group which may have an oxygen atom, and 100 to 10000 parts by weight, per total 100 parts by weight of said components (a), (b), (c) and (d), of (e) an organic solvent having a fluorine atom and a boiling point of not higher than 150° C. at atmospheric pressure.
    • 一种氟化弹性体或氟化凝胶的底漆组合物,所述底漆组合物包含:100重量份的(a)每分子具有至少两个烯基的直链全氟聚醚化合物,全氟聚醚主链具有由式 ,其中a为1至6的整数,重均分子量为5,000至100,000,(b)一种或多种 在分子中具有一个或多个氟原子和至少两个SiH键的有机硅氧烷化合物的量使得组分(a)中有机硅氧烷化合物中的SiH键与烯基的摩尔比为0.8-5.0,催化剂 (c)氢化硅烷化催化剂的量,5〜100重量份的(d)有机硅氧烷化合物,其每分子具有至少一个SiH键和至少一个环氧基和/或与所述卤素键的硅原子键合的环氧基和/或三烷氧基甲硅烷基 有机硅氧烷通过可能具有氧的有机基团 om,100〜10000重量份,相对于(e)具有氟原子和沸点的有机溶剂的总计100重量份组分(a),(b),(c)和(d)), 在大气压下不高于150℃。
    • 18. 发明授权
    • Feeder for electronic chip components
    • 馈线用于电子芯片组件
    • US06286711B1
    • 2001-09-11
    • US09237680
    • 1999-01-27
    • Kenichi FukudaKouichi Nakada
    • Kenichi FukudaKouichi Nakada
    • G07F1100
    • H05K13/028
    • An electronic chip component feeder is provided to prevent continued supply of electronic chip components for mounting which have surface discolorization, deteriorated electrode solderability, or cracks or chips produced by chip collisions. The electronic chip component feeder includes plural feeding units arranged in an array. Each feeding unit has a hopper for holding a plurality of components of a particular kind, and a guide path by which components are transferred from the hopper to a dispensing location. At the dispensing location, the components are picked up by a sucking chuck and then transferred to a substrate for mounting thereon. The plurality of feeding units are capable of being reciprocated in unison so that the dispensing location for the feeding units are successively moved to a fixed position. The electronic chip component feeder further includes a counting unit for counting the number of movements of the each feeding unit. This provides a measure of the degree of potential degradation of the electronic chip components in the hoppers caused by movement of their respective feeding unit. An alarm can be generated when the counted number reaches a predefined number, set individually for each feeding unit.
    • 提供一种电子芯片部件供给器,用于防止具有表面变色,劣化的电极可焊性或由芯片碰撞产生的裂纹或芯片的安装用电子部件的持续供给。 电子芯片部件供给器包括排列成阵列的多个供给部。 每个进料单元具有用于保持特定种类的多个部件的料斗以及组件从料斗传送到分配位置的引导通道。 在分配位置,组件由吸盘卡住,然后转移到基板上以便安装在其上。 多个供给单元能够一致地往复运动,使得供给单元的分配位置被连续地移动到固定位置。 电子芯片部件供给器还包括计数单元,用于对每个进给单元的运动次数进行计数。 这提供了由其各自的进给单元的运动引起的料斗中的电子芯片部件的潜在劣化程度的度量。 当计数的数量达到预定数量时,可以产生一个报警,为每个进给单元单独设置。
    • 19. 发明授权
    • Feeder for electronic chip components
    • 馈线用于电子芯片组件
    • US06234298B1
    • 2001-05-22
    • US09271320
    • 1999-03-18
    • Kiyoyuki NakagawaKenichi FukudaIsamu Utsunomiya
    • Kiyoyuki NakagawaKenichi FukudaIsamu Utsunomiya
    • B65G4744
    • H05K13/028B65G47/145B65G47/1457
    • A feeder for electronic chip components is provided having an aligning path forming member agitating electronic chip components which are to be discharged from a discharge opening of a hopper for accommodating a plurality of electronic chip components. The agitation is achieved by reciprocating the aligning path forming member in the axis direction of the discharge opening and forming a tubular aligning path which receives only the electronic chip components aligned in a predetermined direction therein. When the aligning path forming member reciprocates it also rotates around its axis. This results in an increased agitating effect on electronic chip components for guiding them into the aligning path.
    • 提供了一种用于电子芯片部件的馈线,具有对准路径形成部件,搅动将从用于容纳多个电子芯片部件的料斗的排出口排出的电子芯片部件。 搅拌是通过使排出路径形成构件在排出口的轴线方向上往复运动而形成一个管状排列路径来实现的,所述管状排列路径只接收沿预定方向排列的电子芯片部件。 当对准路径形成构件往复运动时,其也绕其轴线旋转。 这导致对电子芯片部件的搅拌效果增加,以将它们引导到对准路径中。