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11. 发明申请

US20100244979A1 DUPLEXER, SUBSTRATE FOR DUPLEXER, AND ELECTRONIC APPARATUS 有权
标题翻译：双工器，双工器基板和电子设备
公开(公告)号：US20100244979A1
公开(公告)日：2010-09-30
申请号：US12564648
申请日：2009-09-22
申请人： Takashi MATSUDA , Kazunori Inoue , Shogo Inoue
发明人： Takashi MATSUDA , Kazunori Inoue , Shogo Inoue
IPC分类号： H01P5/12
CPC分类号： H03H9/706 , H03H9/0571 , H03H9/0576 , H03H9/725
摘要： A duplexer includes a transmit filter connected between a common terminal and a transmission terminal, a receive filter connected between the common terminal and a reception terminal, a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal, and the reception terminal, and a package. The package includes an insulating layer, foot pads that include the common terminal, the transmission terminal and the reception terminal and are formed on one surface of the insulating layer, and interconnections formed on another surface opposite to the one surface of the insulating layer. The capacitor is composed of two capacitor forming units that are connected in parallel with each other and are formed with at least one foot pad of the foot pads and two of the interconnections that overlap with two opposing sides of the at least one food pad respectively.
摘要翻译：双工器包括连接在公共端子和发送端子之间的发送滤波器，连接在公共端子和接收端子之间的接收滤波器，与发射滤波器和接收滤波器之一并联连接的电容器，公共终端，发送终端和接收终端，以及包。封装包括绝缘层，包括公共端子，发送端子和接收端子并且形成在绝缘层的一个表面上的脚垫以及形成在与绝缘层的一个表面相对的另一表面上的互连。电容器由两个电容器形成单元组成，两个电容器形成单元彼此并联连接并且形成有足垫的至少一个脚垫和分别与至少一个食物垫的两个相对侧重叠的两个互连。

12. 发明申请

US20100148890A1 ACOUSTIC WAVE ELEMENT, DUPLEXER, COMMUNICATION MODULE, AND COMMUNICATION APPARATUS 有权
标题翻译：声波元件，双工器，通信模块和通信设备
公开(公告)号：US20100148890A1
公开(公告)日：2010-06-17
申请号：US12712144
申请日：2010-02-24
申请人： Kazunori Inoue , Takashi Matsuda , Michio Miura , Suguru Warashina
发明人： Kazunori Inoue , Takashi Matsuda , Michio Miura , Suguru Warashina
IPC分类号： H01P5/12 , H01P7/08 , H04R31/00
CPC分类号： H03H9/0222 , H03H9/02897 , H03H9/02929 , H03H9/02937 , H03H9/02984 , H03H9/02992 , Y10T29/49005
摘要： An acoustic wave element includes: resonators 2 each including an electrode to excite acoustic waves; a power supply wiring portion 3 that is disposed so as to connect the resonators 2 electrically; a piezoelectric substrate 4 on which the resonators 2 and the power supply wiring portion 3 are formed; a second medium 5 that is formed on the piezoelectric substrate 4 so as to cover the resonators 2; and a third medium 6 that is formed on the piezoelectric substrate 4 so as to cover at least the second medium 5 and the power supply wiring portion 3. A side surface 34 of the power supply wiring portion 3 that is in contact with a surface of the piezoelectric substrate 4 forms an obtuse first angle θ with respect to the surface 4a of the piezoelectric substrate 4.
摘要翻译：声波元件包括：各自包括用于激发声波的电极的谐振器2; 设置为电连接谐振器2的电源配线部3; 形成有谐振器2和电源配线部3的压电基板4; 形成在压电基板4上以覆盖谐振器2的第二介质5; 以及形成在压电基板4上以至少覆盖第二介质5和电源配线部3的第三介质6.电源配线部3的与表面接触的侧面34 压电基板4形成钝角的第一角度＆amp; 相对于压电基板4的表面4a。

13. 发明申请

US20090267707A1 ELASTIC WAVE DEVICE 有权
标题翻译：弹性波装置
公开(公告)号：US20090267707A1
公开(公告)日：2009-10-29
申请号：US12408188
申请日：2009-03-20
申请人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
发明人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
IPC分类号： H01L41/047 , H03H9/64
CPC分类号： H03H9/1452 , H03H9/1457
摘要： An elastic wave device is described which includes a piezoelectric substrate, comb-shaped electrodes having teeth electrodes that are disposed so as to face each other on the piezoelectric substrate, a non-overlapping area in which the teeth electrodes of the comb-shaped electrodes do not overlap each other, and a overlapping area in which the teeth electrodes overlap each other and the velocity of sound is higher than that in the non-overlapping area.
摘要翻译：描述了一种弹性波装置，其包括压电基片，具有在压电基片上彼此相对配置的齿电极的梳状电极，梳状电极的齿电极的非重叠区域齿不重叠，齿电极重叠的重叠区域，声速比非重叠区域高。

14. 发明申请

US20080018414A1 Elastic wave device and manufacturing method of the same 失效
标题翻译：弹性波装置及其制造方法相同
公开(公告)号：US20080018414A1
公开(公告)日：2008-01-24
申请号：US11730961
申请日：2007-04-05
申请人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
发明人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
IPC分类号： H03H9/72
CPC分类号： H03H9/72 , H03H3/08 , H03H9/0576 , H03H2250/00
摘要： An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.
摘要翻译：公开了一种通过在其间填充树脂来粘合至少两个表面声波装置而形成的弹性波装置。每个表面声波（SAW）器件包括衬底; 配置在所述基板上的功能部; 形成操作功能部分所需的空间部分的凹部和覆盖基板表面的封装以及至少两个SAW器件的封装的侧面，对应于通过填充树脂粘合的部分在至少两个SAW器件之间，包括至少一个切口，并且第一树脂覆盖所述至少两个SAW器件的基板的每个侧面，背面和前表面的一部分，并且第一树脂树脂填充在包装的侧面上的至少一个切口中。

15. 发明授权

US08729776B2 Electronic component with metal ceiling 有权
标题翻译：带金属天花板的电子元件
公开(公告)号：US08729776B2
公开(公告)日：2014-05-20
申请号：US13556897
申请日：2012-07-24
申请人： Takashi Matsuda , Kazunori Inoue
发明人： Takashi Matsuda , Kazunori Inoue
IPC分类号： H01L41/08 , H03H9/10
CPC分类号： H03H9/1071 , H03H9/6483
摘要： An electronic component includes: a substrate; a functional element located on the substrate; a wiring located on the substrate and electrically connected to the functional element; a metal ceiling located above the functional element so that a space is formed between the metal ceiling and the functional element; and a sealing portion located on the metal ceiling, wherein the metal ceiling is electrically connected to a signal wiring that is included in the wiring and transmits a high-frequency signal.
摘要翻译：电子部件包括：基板; 位于所述基板上的功能元件; 布线，位于所述基板上并电连接到所述功能元件; 位于所述功能元件上方的金属天花板，使得在所述金属天花板和所述功能元件之间形成空间; 以及位于所述金属天花板上的密封部，其中所述金属顶板电连接到包括在所述布线中的信号布线，并且发送高频信号。

16. 发明授权

US08222972B2 Acoustic wave element, duplexer, communication module, and communication apparatus 有权
标题翻译：声波元件，双工器，通信模块和通信设备
公开(公告)号：US08222972B2
公开(公告)日：2012-07-17
申请号：US12712144
申请日：2010-02-24
申请人： Kazunori Inoue , Takashi Matsuda , Michio Miura , Suguru Warashina
发明人： Kazunori Inoue , Takashi Matsuda , Michio Miura , Suguru Warashina
IPC分类号： H03H9/46
CPC分类号： H03H9/0222 , H03H9/02897 , H03H9/02929 , H03H9/02937 , H03H9/02984 , H03H9/02992 , Y10T29/49005
摘要： An acoustic wave element includes: resonators 2 each including an electrode to excite acoustic waves; a power supply wiring portion 3 that is disposed so as to connect the resonators 2 electrically; a piezoelectric substrate 4 on which the resonators 2 and the power supply wiring portion 3 are formed; a second medium 5 that is formed on the piezoelectric substrate 4 so as to cover the resonators 2; and a third medium 6 that is formed on the piezoelectric substrate 4 so as to cover at least the second medium 5 and the power supply wiring portion 3. A side surface 34 of the power supply wiring portion 3 that is in contact with a surface of the piezoelectric substrate 4 forms an obtuse first angle θ with respect to the surface 4a of the piezoelectric substrate 4.
摘要翻译：声波元件包括：各自包括用于激发声波的电极的谐振器2; 设置为电连接谐振器2的电源配线部3; 形成有谐振器2和电源配线部3的压电基板4; 形成在压电基板4上以覆盖谐振器2的第二介质5; 以及形成在压电基板4上以至少覆盖第二介质5和电源配线部3的第三介质6.电源配线部3的与表面接触的侧面34 压电基板4形成钝角的第一角度＆amp; 相对于压电基板4的表面4a。

17. 发明授权

US07602262B2 Elastic wave device and manufacturing method of the same 失效
标题翻译：弹性波装置及其制造方法相同
公开(公告)号：US07602262B2
公开(公告)日：2009-10-13
申请号：US11730961
申请日：2007-04-05
申请人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
发明人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
IPC分类号： H03H9/00 , H03H9/10
CPC分类号： H03H9/72 , H03H3/08 , H03H9/0576 , H03H2250/00
摘要： An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.
摘要翻译：公开了一种通过在其间填充树脂来粘合至少两个表面声波装置而形成的弹性波装置。每个表面声波（SAW）器件包括衬底; 配置在所述基板上的功能部; 形成操作功能部分所需的空间部分的凹部和覆盖基板表面的封装以及至少两个SAW器件的封装的侧面，对应于通过填充树脂粘合的部分在至少两个SAW器件之间，包括至少一个切口，并且第一树脂覆盖所述至少两个SAW器件的基板的每个侧面，背面和前表面的一部分，并且第一树脂树脂填充在包装的侧面上的至少一个切口中。

18. 发明授权

US07541721B2 Acoustic wave device 失效
标题翻译：声波装置
公开(公告)号：US07541721B2
公开(公告)日：2009-06-02
申请号：US11941522
申请日：2007-11-16
申请人： Kazunori Inoue , Takashi Matsuda , Jyouji Kimura
发明人： Kazunori Inoue , Takashi Matsuda , Jyouji Kimura
IPC分类号： H01L21/00 , H01L41/047 , H03H9/25
CPC分类号： H03H9/059 , H01L2224/10126 , H01L2224/13565 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： An acoustic wave device includes an acoustic wave element formed on a piezoelectric substrate, and a terminal that makes an electric connection with an outside of the acoustic wave device. The terminal has a protrusion electrode having a side surface coated with a coating film having a non-coating portion.
摘要翻译：声波装置包括形成在压电基板上的声波元件和与声波装置的外部电连接的端子。端子具有突出电极，其具有涂覆有具有非涂覆部分的涂膜的侧表面。

19. 发明授权

US08222970B2 Resonant device, communication module, communication device, and method for manufacturing resonant device 失效
标题翻译：共振装置，通信模块，通信装置及谐振装置的制造方法
公开(公告)号：US08222970B2
公开(公告)日：2012-07-17
申请号：US12503558
申请日：2009-07-15
申请人： Kazunori Inoue , Tokihiro Nishihara , Takashi Matsuda , Shinji Taniguchi
发明人： Kazunori Inoue , Tokihiro Nishihara , Takashi Matsuda , Shinji Taniguchi
IPC分类号： H03H9/54 , H03H9/70
CPC分类号： H03H3/04 , H03H9/02133 , H03H9/583 , H03H9/588 , H03H2003/023
摘要： A resonant device includes first and second piezoelectric thin film resonators. The first piezoelectric thin film resonator includes a substrate, a first lower electrode formed on the substrate, a first piezoelectric film formed over the first lower electrode, and a first upper electrode formed on the piezoelectric film and opposed to the first lower electrode. The second piezoelectric thin film resonator includes a second lower electrode formed above the first upper electrode, a second piezoelectric film formed over the second lower electrode, and a second upper electrode formed on the piezoelectric film and opposed to the second lower electrode. The first membrane region in which the first lower electrode opposes to the first upper electrode through the first piezoelectric film and a second membrane region in which the second lower electrode opposes to the second upper electrode through the second piezoelectric film are laminated through a second cavity.
摘要翻译：谐振装置包括第一和第二压电薄膜谐振器。第一压电薄膜谐振器包括基板，形成在基板上的第一下电极，形成在第一下电极上的第一压电膜，以及形成在压电膜上并与第一下电极相对的第一上电极。第二压电薄膜谐振器包括形成在第一上电极上的第二下电极，形成在第二下电极上的第二压电薄膜和形成在压电薄膜上并与第二下电极相对的第二上电极。其中第一下部电极通过第一压电膜与第一上部电极相对的第一膜区域和通过第二压电膜将第二下部电极与第二上部电极相对的第二膜区域通过第二腔层叠。

20. 发明申请

US20100219906A1 ACOUSTIC WAVE DEVICE, DUPLEXER, COMMUNICATION MODULE, COMMUNICATION APPARATUS, AND MANUFACTURING METHOD FOR ACOUSTIC WAVE DEVICE 有权
标题翻译：声波设备，双工器，通信模块，通信设备和声波设备的制造方法
公开(公告)号：US20100219906A1
公开(公告)日：2010-09-02
申请号：US12608397
申请日：2009-10-29
申请人： Michio MIURA , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
发明人： Michio MIURA , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
IPC分类号： H03H9/72 , H01L41/22
CPC分类号： H03H3/10 , H03H9/0222 , H03H9/25 , Y10T29/42 , Y10T29/49005
摘要： An acoustic wave device includes a piezoelectric substrate, interdigital electrodes arranged on the piezoelectric substrate, a first dielectric element arranged between the interdigital electrodes, a second dielectric element that covers the interdigital electrodes and the first dielectric element, and an adjustment element that has been formed on the first dielectric element. The adjustment element has been formed from a material whose specific gravity is greater than that of the first dielectric element and that of the second dielectric element.
摘要翻译：声波装置包括：压电基板，布置在压电基板上的叉指电极，布置在叉指电极之间的第一电介质元件，覆盖指状电极和第一电介质元件的第二电介质元件和已形成的调节元件在第一电介质元件上。调整元件由比重大于第一电介质元件和第二电介质元件的比重的材料形成。

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