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    • 16. 发明授权
    • Pattern forming method and manufacturing method of magnetic recording medium
    • 磁记录介质的图案形成方法和制造方法
    • US09412405B2
    • 2016-08-09
    • US14455058
    • 2014-08-08
    • Kabushiki Kaisha Toshiba
    • Kaori KimuraAkira FujimotoAkira Watanabe
    • G11B5/84G11B5/855
    • G11B5/855
    • According to one embodiment, disclosed is a pattern forming method including preparing a second dispersion by adding a second protective group and second solvent to fine particles including a first protective group whose surface polarity is close to that of the substrate, the fine particles containing, at least on the surface thereof, a material selected from Al, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Y, Zr, Sn, Mo, Ta, W, Au, Ag, Pd, Cu, Pt, and an oxide thereof, modifying the fine particles including the first protective group with the second protective group, adding a viscosity adjustment agent to the dispersion containing the fine particles to prepare a coating solution, and applying the coating solution on the substrate to form a fine particle layer thereon.
    • 根据一个实施方案,公开了一种图案形成方法,包括通过向其表面极性接近于底物的第一保护基的细颗粒添加第二保护基和第二溶剂来制备第二分散体,所述第一保护基的微粒含有 最少在其表面上选自Al,Ti,V,Cr,Mn,Fe,Co,Ni,Zn,Y,Zr,Sn,Mo,Ta,W,Au,Ag,Pd,Cu,Pt, 和其氧化物,用第二保护基改性包括第一保护基的细颗粒,向含有微粒的分散体中加入粘度调节剂以制备涂布溶液,并将涂布溶液涂布在基材上以形成微细 颗粒层。
    • 17. 发明授权
    • Semiconductor light emitting device and method for manufacturing the same
    • 半导体发光器件及其制造方法
    • US09331248B2
    • 2016-05-03
    • US14543942
    • 2014-11-18
    • Kabushiki Kaisha Toshiba
    • Kumi MasunagaRyota KitagawaAkira FujimotoKoji AsakawaTakanobu KamakuraShinji Nunotani
    • H01L21/00H01L33/40H01L33/38
    • H01L33/405H01L33/38H01L2933/0016H01L2933/0083
    • According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The device also includes a first electrode layer having electrical continuity with the first semiconductor layer and a second electrode layer provided on the second semiconductor layer, the second electrode layer including a metal portion having a thickness not less than 10 nanometers and not more than 100 nanometers along a direction from the first semiconductor layer to the second semiconductor layer. A plurality of apertures penetrates the metal portion along the direction, each of the apertures viewed along the direction having equivalent circle diameters of not less than 10 nanometers and not more than 5 micrometers, and a Schottky barrier is provided between the second semiconductor layer and the metal portion.
    • 根据一个实施例,半导体发光器件包括第一导电类型的第一半导体层,第二导电类型的第二半导体层和设置在第一半导体层和第二半导体层之间的发光层。 该器件还包括与第一半导体层具有电连续性的第一电极层和设置在第二半导体层上的第二电极层,第二电极层包括厚度不小于10纳米且不大于100纳米的金属部分 沿着从第一半导体层到第二半导体层的方向。 多个孔沿着该方向穿过金属部分,沿着具有等于10纳米且不超过5微米的等效圆直径的方向观察每个孔,并且在第二半导体层和第二半导体层之间设置肖特基势垒 金属部分。