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11. 发明申请

US20070189451A1 Apparatus for inspecting a semiconductor device 审中-公开
标题翻译：用于检查半导体器件的装置
公开(公告)号：US20070189451A1
公开(公告)日：2007-08-16
申请号：US11703249
申请日：2007-02-07
申请人： Young-Soo Lee , Dong-Chun Lee , Seong-Chan Han
发明人： Young-Soo Lee , Dong-Chun Lee , Seong-Chan Han
IPC分类号： G01N23/06 , G01F1/66
CPC分类号： G01N21/95607 , H01L2224/16225
摘要： An apparatus for inspecting a semiconductor device may include an external image detector to acquire an exterior image of the semiconductor device, an internal image detector to acquire an interior image of the semiconductor device, and a controller to compare the acquired images with respective references. The apparatus may both inspect the exterior and the interior of the semiconductor device.
摘要翻译：用于检查半导体器件的装置可以包括：外部图像检测器，用于获取半导体器件的外部图像;内部图像检测器，用于获取半导体器件的内部图像;以及控制器，用于将获取的图像与各自的参考值进行比较。该装置可以检查半导体器件的外部和内部。

12. 发明授权

US06449156B1 Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof 有权
标题翻译：配有耦合装置的散热器，附有散热器的存储模块及其制造方法
公开(公告)号：US06449156B1
公开(公告)日：2002-09-10
申请号：US09952303
申请日：2001-09-12
申请人： Seong-Chan Han , Dong-Woo Shin , Dong-Chun Lee , Wang-Jae Lee
发明人： Seong-Chan Han , Dong-Woo Shin , Dong-Chun Lee , Wang-Jae Lee
IPC分类号： H05K720
CPC分类号： G11C5/04
摘要： A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.
摘要翻译：公开了一种新颖的散热器结构，用于安装到模块板，半导体芯片被附着到模块板上，并用于散发或扩散从半导体芯片产生的热量。散热器包括散热器基座和用于将散热器基座耦合到模块板的耦合装置。联接装置通过散热器底座。联接装置包括一体形成的上主体部分和至少穿过下主体部分的孔口，以及与下主体部分一体形成的凸缘基部。带凸缘的底座将联接装置固定在散热器底座上。上身部的外部尺寸小于下主体部的内部尺寸。结果，许多散热器可以稳定堆叠。

13. 发明授权

US08189342B2 Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly 有权
标题翻译：内存模块印制电路板，制造方法及内存模块/插座组件
公开(公告)号：US08189342B2
公开(公告)日：2012-05-29
申请号：US11500960
申请日：2006-08-09
申请人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
发明人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
IPC分类号： H05K1/14
CPC分类号： H05K3/403 , H01L2224/48091 , H01L2224/4824 , H05K3/0052 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K2201/0355 , H05K2201/0919 , H05K2203/1189 , H01L2924/00014
摘要： Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.
摘要翻译：本发明的示例性实施例可以包括印刷电路板，制造印刷电路板的方法和存储器模块/插座组件。本发明的示例实施例可以增加存储器模块上的接触抽头的数量，此外，可以减少将存储器模块插入模块插座所需的力。

14. 发明授权

US07906423B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07906423B2
公开(公告)日：2011-03-15
申请号：US12650093
申请日：2009-12-30
申请人： Hyo-Jae Bang , Heui-Seog Kim , Dong-Chun Lee , Seong-Chan Han , Jung-Hyeon Kim
发明人： Hyo-Jae Bang , Heui-Seog Kim , Dong-Chun Lee , Seong-Chan Han , Jung-Hyeon Kim
IPC分类号： H01L21/44
CPC分类号： H05K3/303 , H05K2201/0305 , H05K2201/09781 , H05K2201/10689 , H05K2201/2036 , Y02P70/613
摘要： A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.
摘要翻译：半导体器件包括半导体封装，电路板和间隔保持元件。半导体封装具有从主体突出的主体和引线。电路板具有与引线电连接的第一焊盘。间隔保持构件插入在电路板和主体之间。间隔保持构件保持引线与第一焊盘之间的间隔。因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

15. 发明申请

US20090056979A1 Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module 有权
标题翻译：印刷电路板，制造印刷电路板的方法，具有印刷电路板的存储模块和制造存储器模块的方法
公开(公告)号：US20090056979A1
公开(公告)日：2009-03-05
申请号：US12231196
申请日：2008-08-29
申请人： Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
发明人： Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K1/0272 , H05K1/0203 , H05K2201/064 , Y10T29/49124
摘要： A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.
摘要翻译： PCB可以包括绝缘构件，冷却构件和电路图案。冷却构件可以内置在绝缘构件中。冷却部件可以具有冷却流体可以流过的冷却通道。电路图案可以形成在绝缘构件上。因此，流经冷却通道的冷却流体可快速消散电路图形中的高热。

16. 发明申请

US20070109758A1 Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
标题翻译：半导体封装的印刷电路板和使用其的半导体封装的安装方法
公开(公告)号：US20070109758A1
公开(公告)日：2007-05-17
申请号：US11598755
申请日：2006-11-14
申请人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
发明人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
IPC分类号： H05K7/00
CPC分类号： H05K3/3421 , H05K3/243 , H05K3/282 , H05K3/3452 , H05K2201/0989 , H05K2201/099 , H05K2201/10689 , H05K2203/046 , Y02P70/613
摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.
摘要翻译：示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。半导体封装的引线可以安装在绝缘基板上。连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊锡涂层移动到半导体封装引线的肩部。

17. 发明申请

US20120244726A1 DATA STORAGE DEVICE 有权
标题翻译：数据存储设备
公开(公告)号：US20120244726A1
公开(公告)日：2012-09-27
申请号：US13424858
申请日：2012-03-20
申请人： Young-Hoon Kim , Dong-Chun Lee , Jae-Hoon Choi , Hyung-Mo Hwang
发明人： Young-Hoon Kim , Dong-Chun Lee , Jae-Hoon Choi , Hyung-Mo Hwang
IPC分类号： H01R12/00
CPC分类号： H01R12/7005 , H01R12/718
摘要： A data storage device includes a printed circuit board (PCB), a connection tab, a dummy tab and a guiding member. A memory chip is mounted on the PCB. The connection tab is formed on a first surface of the PCB to electrically connect the PCB with a first cable. The dummy tab is formed on the first surface of the PCB. The guiding member is formed on the dummy tab to guide an insertion direction of the first cable. Thus, the data storage device without a separate connector may be manufactured by a relatively simple process at a lower cost.
摘要翻译：数据存储装置包括印刷电路板（PCB），连接片，虚拟片和引导件。存储芯片安装在PCB上。连接片形成在PCB的第一表面上，以将PCB与第一电缆电连接。虚设凸片形成在PCB的第一表面上。引导构件形成在虚拟翼片上以引导第一缆线的插入方向。因此，没有单独的连接器的数据存储装置可以通过相对简单的过程以较低的成本制造。

18. 发明申请

US20070181993A1 Printed circuit board including reinforced copper plated film and method of fabricating the same 审中-公开
标题翻译：包括增强镀铜膜的印刷电路板及其制造方法
公开(公告)号：US20070181993A1
公开(公告)日：2007-08-09
申请号：US11699498
申请日：2007-01-30
申请人： Jae-Hoon Choi , Kwang-Su Yu , Hyo-Jae Bang , Dong-Chun Lee
发明人： Jae-Hoon Choi , Kwang-Su Yu , Hyo-Jae Bang , Dong-Chun Lee
IPC分类号： H01L23/04
CPC分类号： H05K1/09 , H05K3/241 , H05K3/282 , H05K3/428 , H05K2201/0209 , H05K2201/0215
摘要： A printed circuit board (PCB) may include a substrate. A copper layer may be formed over a portion of the substrate, the copper layer including at least one of a metallic powder and a ceramic powder.
摘要翻译：印刷电路板（PCB）可以包括基板。可以在基板的一部分上形成铜层，铜层包括金属粉末和陶瓷粉末中的至少一种。

19. 发明授权

US08902596B2 Data storage device 有权
标题翻译：数据存储设备
公开(公告)号：US08902596B2
公开(公告)日：2014-12-02
申请号：US13424858
申请日：2012-03-20
申请人： Young-Hoon Kim , Dong-Chun Lee , Jae-Hoon Choi , Hyung-Mo Hwang
发明人： Young-Hoon Kim , Dong-Chun Lee , Jae-Hoon Choi , Hyung-Mo Hwang
IPC分类号： H05K1/14 , H01R12/70 , H01R12/71
CPC分类号： H01R12/7005 , H01R12/718
摘要： A data storage device includes a printed circuit board (PCB), a connection tab, a dummy tab and a guiding member. A memory chip is mounted on the PCB. The connection tab is formed on a first surface of the PCB to electrically connect the PCB with a first cable. The dummy tab is formed on the first surface of the PCB. The guiding member is formed on the dummy tab to guide an insertion direction of the first cable. Thus, the data storage device without a separate connector may be manufactured by a relatively simple process at a lower cost.
摘要翻译：数据存储装置包括印刷电路板（PCB），连接片，虚拟片和引导件。存储芯片安装在PCB上。连接片形成在PCB的第一表面上，以将PCB与第一电缆电连接。虚设凸片形成在PCB的第一表面上。引导构件形成在虚拟翼片上以引导第一缆线的插入方向。因此，没有单独的连接器的数据存储装置可以通过相对简单的过程以较低的成本制造。

20. 发明申请

US20070161224A1 Semiconductor module and method of forming a semiconductor module 审中-公开
公开(公告)号：US20070161224A1
公开(公告)日：2007-07-12
申请号：US11723086
申请日：2007-03-16
申请人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
发明人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
IPC分类号： H01L21/44
CPC分类号： H05K3/303 , H01L2224/13 , H01L2224/16225 , H05K3/3457 , H05K2201/09781 , H05K2201/10734 , H05K2201/2036 , Y02P70/613
摘要： In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

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