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    • 12. 发明授权
    • High molecular weight silicone compounds, resist compositions, and patterning method
    • 高分子量硅氧烷化合物,抗蚀剂组合物和图案化方法
    • US06730453B2
    • 2004-05-04
    • US09887320
    • 2001-06-25
    • Mutsuo NakashimaIchiro KanekoToshinobu IshiharaJunji TsuchiyaJun HatakeyamaShigehiro Nagura
    • Mutsuo NakashimaIchiro KanekoToshinobu IshiharaJunji TsuchiyaJun HatakeyamaShigehiro Nagura
    • G03F7075
    • G03F7/0045C08G77/14C08G77/38C08G77/388C08G77/50G03F7/0392G03F7/0757
    • The invention provides a high molecular weight silicone compound comprising recurring units of formula (1) and having a weight average molecular weight of 1,000-50,000. Some or all of the hydrogen atoms of carboxyl groups or carboxyl and hydroxyl groups in the silicone compound may be replaced by acid labile groups. Z is a di- to hexavalent, non-aromatic, monocyclic or polycyclic hydrocarbon or bridged cyclic hydrocarbon group; Z is a di- to hexavalent, normal or branched hydrocarbon group or non-aromatic, monocyclic or polycyclic hydrocarbon or bridged cyclic hydrocarbon group; x, y and z are integers of 1-5 corresponding to the valence of Z and Z′; R1 is —OCHR—R′—OH or —NHCHR—R′—OH; R2 is alkyl or alkenyl or a monovalent, non-aromatic, polycyclic hydrocarbon or bridged cyclic hydrocarbon group; p1, p2, p3 and p4 are 0 or positive numbers. A resist composition comprising the high molecular weight silicone compound as a base resin is sensitive to actinic radiation and has a high sensitivity and resolution so that it is suitable for microfabrication with electron beams or deep UV. Since the composition has low absorption at the exposure wavelength of an ArF or KrF excimer laser, a finely defined pattern having walls perpendicular to the substrate can be readily formed.
    • 本发明提供了包含式(1)的重复单元并且具有1,000-50,000重均分子量的高分子量硅氧烷化合物。 硅氧烷化合物中的羧基或羧基和羟基的一些或全部氢原子可被酸不稳定基团取代.Z为二价至六价,非芳香族,单环或多环烃或桥环状烃基; Z是二价至六价,正或支链烃基或非芳香族单环或多环烃或桥环状烃基; x,y和z是对应于Z和Z'的化合价的1-5的整数; R 1是-OCHR-R'-OH或-NHCHR-R'-OH; R 2是烷基或烯基或单价,非芳族,多环烃或桥连环烃基; p1,p2,p3和p4为0或正数。 包含作为基础树脂的高分子量硅氧烷化合物的抗蚀剂组合物对光化辐射敏感,并且具有高灵敏度和分辨率,使得它适合于用电子束或深紫外线的微细加工。 由于组成在ArF或KrF准分子激光器的曝光波长处具有低吸收,因此可以容易地形成具有垂直于衬底的壁的精细限定图案。
    • 13. 发明授权
    • High molecular weight silicone compounds resist compositions, and patterning method
    • 高分子量硅氧烷化合物抵抗组合物和图案化方法
    • US06309796B1
    • 2001-10-30
    • US09129950
    • 1998-08-06
    • Mutsuo NakashimaIchiro KanekoToshinobu IshiharaJunji TsuchiyaJun HatakeyamaShigehiro Nagura
    • Mutsuo NakashimaIchiro KanekoToshinobu IshiharaJunji TsuchiyaJun HatakeyamaShigehiro Nagura
    • G03F7075
    • G03F7/0045C08G77/14C08G77/38C08G77/388C08G77/50G03F7/0392G03F7/0757
    • The invention provides a high molecular weight silicone compound comprising recurring units of formula (1) and having a weight average molecular weight of 1,000-50,000. Some or all of the hydrogen atoms of carboxyl groups or carboxyl and hydroxyl groups in the silicone compound may be replaced by acid labile groups. Z is di- to hexavalent, non-aromatic, monocyclic or polycyclic hydrocarbon or bridged cyclic hydrocarbon group; Z′ is a di- to hexavalent, normal or branched hydrocarbon group or non-aromatic, monocyclic or polycyclic hydrocarbon or bridged cyclic hydrocarbon group; x, y and z are integers of 1-5 corresponding to the valence of Z and Z′; R1 is —OCHR—R′ —OH or —NHCHR—R′ —OH; R2 is alkyl or alkenyl or a monovalent, non-aromatic, polycyclic hydrocarbon or bridged cyclic hydrocarbon group; p1, p2, p3 and p4 are 0 or positive numbers. A resist composition comprising the high molecular weight silicone compound as a base resin is sensitive to actinic radiation and has a high sensitivity and resolution so that it is suitable for microfabrication with electron beams or deep UV. Since the composition has low absorption at the exposure wavelength of an ArF or KrF excimer laser, a finely defined pattern having walls perpendicular to the substrate can be readily formed.
    • 本发明提供了包含式(1)的重复单元并且具有1,000-50,000重均分子量的高分子量硅氧烷化合物。 硅烷化合物中的羧基或羧基和羟基的一部分或全部氢原子可被酸不稳定基团取代.Z为二价至六价,非芳香族,单环或多环烃基或桥环状烃基; Z'是二价至六价,正或支链烃基或非芳香族单环或多环烃或桥连环烃基; x,y和z是对应于Z和Z'的化合价的1-5的整数; R 1是-OCHR-R'-OH或-NHCHR-R'-OH; R2是烷基或链烯基或单价,非芳族,多环烃或桥连环烃基; p1,p2,p3和p4为0或正数。 包含作为基础树脂的高分子量硅氧烷化合物的抗蚀剂组合物对光化辐射敏感,并且具有高灵敏度和分辨率,使得它适合于用电子束或深紫外线的微细加工。 由于组成在ArF或KrF准分子激光器的曝光波长处具有低吸收,因此可以容易地形成具有垂直于衬底的壁的精细限定图案。
    • 17. 发明授权
    • Polymeric compounds, chemically amplified positive type resist materials
and process for pattern formation
    • 聚合化合物,化学放大正型抗蚀剂材料和图案形成工艺
    • US6048661A
    • 2000-04-11
    • US33147
    • 1998-03-02
    • Tsunehiro NishiJun HatakeyamaShigehiro NaguraToshinobu Ishihara
    • Tsunehiro NishiJun HatakeyamaShigehiro NaguraToshinobu Ishihara
    • G03F7/004G03F7/039
    • G03F7/0045G03F7/039Y10S430/106Y10S430/11Y10S430/111
    • Provided are polymeric compounds which, when used as base resins in resist materials, can yield chemical resist materials having high sensitivity, high resolution, a high exposure latitude, and good process adaptability, exhibiting excellent resistance to plasma etching, and giving resist patterns having high thermal resistance, as well as chemically amplified positive type resist materials using such polymeric compounds as base resins. These chemically amplified positive type resist materials use a base resin comprising a polymeric compound having a weight-average molecular weight of 1,000 to 500,000 and having one or more hydroxyl and/or carboxyl groups in the molecule, part or all of the hydrogen atoms of the hydroxyl and/or carboxyl groups being replaced by groups of the following general formula ##STR1## and additionally contain an acid generator, a dissolution inhibitor, a basic compound, and an aromatic compound having a group of the formula .tbd.C--COOH.
    • 提供了当作为抗蚀剂材料中的基础树脂使用时,可以产生具有高灵敏度,高分辨率,高曝光宽容度和良好的工艺适应性的化学抗蚀剂材料,表现出优异的等离子体蚀刻性,并且具有高抗蚀剂图案的抗蚀剂图案 耐热性以及使用这种聚合物作为基础树脂的化学放大正型抗蚀剂材料。 这些化学放大正型抗蚀剂材料使用包含重均分子量为1,000至500,000并且在分子中具有一个或多个羟基和/或羧基的聚合化合物的基础树脂,部分或全部氢原子 羟基和/或羧基被下列通式的基团取代,另外含有酸产生剂,溶解抑制剂,碱性化合物和具有式3BOND C-COOH基团的芳族化合物。
    • 20. 发明授权
    • Method for forming resist pattern with enhanced contrast film
    • 用增强的对比膜形成抗蚀剂图案的方法
    • US5795700A
    • 1998-08-18
    • US604369
    • 1996-02-21
    • Jun HatakeyamaMitsuo UmemuraToshinobu IshiharaSatoshi Watanabe
    • Jun HatakeyamaMitsuo UmemuraToshinobu IshiharaSatoshi Watanabe
    • G03F7/26G03F7/09H01L21/027H01L21/30H01L21/47G03C5/00
    • G03F7/091
    • A resist pattern is formed on a substrate by forming a water-soluble resist film on the substrate, forming a contrast enhancing film on the resist film from a contrast enhancing composition comprising a specific arylnitrone compound of formula (1), pre-baking the resist film before or after formation of the contrast enhancing film, exposing the resist film to light through the contrast enhancing film, baking the films after exposure, removing the contrast enhancing film after the baking step, and developing the resist film. The process forms a resist pattern having a fully rectangular profile and an improved focus margin. The conventional apparatus can be utilized without substantial modification, achieving a cost reduction. ##STR1## wherein R.sup.1, R.sup.2, and R.sup.3 are independently an alkyl radical, an aryl radical or a hydrogen atom, R.sup.4 to R.sup.8 are independently an alkyl radical, a hydrogen atom or a carboxyl radical, at least one of R.sup.4 to R.sup.8 being a carboxyl radical, X is a hydrogen atom, an alkoxy radical represented by R.sup.9 O--, or a dialkylamino radical represented by R.sup.10 R.sup.11 N-- wherein R.sup.9 is an alkyl radical, R.sup.10 and R.sup.11 are independently an alkyl radical, and letter n ha a value of 0, 1 or 2.
    • 通过在基板上形成水溶性抗蚀剂膜,在抗蚀剂膜上形成对比度增强膜,从包含特定的式(1)的芳基硝酮化合物的对比度增强组合物形成抗蚀剂图案,预烘烤抗蚀剂 形成对比度增强膜之前或之后的膜,通过对比度增强膜将抗蚀剂膜曝光,在曝光后烘烤膜,在烘烤步骤之后除去对比度增强膜,并显影抗蚀剂膜。 该工艺形成具有完全矩形轮廓和改进的聚焦余量的抗蚀剂图案。 可以在不进行实质性修改的情况下利用传统的装置,从而实现成本降低。 (1)其中R1,R2和R3独立地是烷基,芳基或氢原子,R4至R8独立地是烷基,氢原子或羧基,R4至 R8是羧基,X是氢原子,由R9O-表示的烷氧基或由R10R11N-表示的二烷基氨基,其中R9是烷基,R10和R11独立地是烷基,并且字母n是一个值 为0,1或2。