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11. 发明授权

US5716264A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5716264A
公开(公告)日：1998-02-10
申请号：US683424
申请日：1996-07-18
申请人： Norio Kimura , Ritsuo Kikuta , You Ishii , Masayoshi Hirose
发明人： Norio Kimura , Ritsuo Kikuta , You Ishii , Masayoshi Hirose
IPC分类号： B24B37/00 , B24B53/007 , B24B21/18
CPC分类号： B24B53/017
摘要： A polishing apparatus is employed to polish an object to be polished by urging the surface of the object to be polished against the surface of a polishing cloth and causing a relative movement therebetween, while supplying a polishing liquid into an area between the object to be polished and the polishing cloth. A plurality of nozzles spray respective fluid jets to strike against the surface of the cloth. The plurality of nozzles include more than one type of nozzle which vary flow velocity, flow rate, angle of spray, and cross-sectional configuration of a jet. The plurality of nozzles have axes positioned at a location at different distances from the rotation axis of the polishing cloth.
摘要翻译：抛光装置用于通过将待抛光物体的表面推压在抛光布的表面上并在其之间相对移动，同时将抛光液体提供到待抛光对象之间的区域中来抛光待抛光物体和抛光布。多个喷嘴喷射相应的流体射流以抵靠布的表面。多个喷嘴包括不止一种类型的喷嘴，其改变流速，流速，喷射角度和射流的横截面构造。多个喷嘴具有位于与抛光布的旋转轴线不同的距离处的轴线。

12. 发明授权

US5476414A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5476414A
公开(公告)日：1995-12-19
申请号：US124550
申请日：1993-09-22
申请人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
发明人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
IPC分类号： B24B37/10 , B24B37/30 , H01L21/304 , B24B7/22
CPC分类号： H01L21/02024 , B24B37/107 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.
摘要翻译：诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。

13. 发明授权

US07367873B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07367873B2
公开(公告)日：2008-05-06
申请号：US10364359
申请日：2003-02-12
申请人： You Ishii , Masayuki Nakanishi , Kenro Nakamura
发明人： You Ishii , Masayuki Nakanishi , Kenro Nakamura
IPC分类号： B24B5/00 , B24B9/00 , B24B49/00
CPC分类号： B24B9/065 , B24B21/002
摘要： A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.
摘要翻译：基板处理装置具有研磨带和用于将研磨带压靠在半导体晶片的周边部分上的研磨头。基板处理装置由于研磨带和晶片的滑动接触而抛光晶片。抛光头具有用于支撑研磨带的弹性体。基板处理装置具有用于按压抛光头的气缸，使得抛光头的弹性体以恒定的力将抛光带压在晶片的预定部分上。

14. 发明授权

US07066787B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07066787B2
公开(公告)日：2006-06-27
申请号：US10765147
申请日：2004-01-28
申请人： Masayuki Nakanishi , You Ishii , Kenro Nakamura
发明人： Masayuki Nakanishi , You Ishii , Kenro Nakamura
IPC分类号： B24B49/00 , B24B51/00 , B24B7/00
CPC分类号： B24B9/065 , B24B21/002
摘要： A substrate processing apparatus is used for removing surface irregularities occurring on a peripheral portion (a bevel portion, an edge portion, and a notch) of a substrate, such as a semiconductor wafer, and films deposited as a contaminant on the peripheral portion of such a substrate. The substrate processing apparatus includes an edge-portion polisher for pressing a polishing tape against an edge portion of a substrate and causing relative movement between the polishing tape and the substrate to polish the edge portion of the substrate, and a bevel-portion polisher for pressing a polishing tape against a bevel portion of the substrate and causing relative movement between this polishing tape and the substrate to polish the bevel portion of the substrate.
摘要翻译：基板处理装置用于去除诸如半导体晶片的基板的外围部分（斜面部分，边缘部分和凹口）上出现的表面凹凸，以及作为污染物沉积在其周边部分上的薄膜底物。基板处理装置包括：边缘部分抛光机，用于将研磨带压靠在基板的边缘部分上，并引起研磨带与基板之间的相对运动以抛光基板的边缘部分;以及斜面部分抛光机，用于按压抛光带抵靠基板的斜面部分，并引起该抛光带与基板之间的相对移动以抛光基板的斜面部分。

15. 发明申请

US20050260933A1 Polishing apparatus and method 有权
标题翻译：抛光设备和方法
公开(公告)号：US20050260933A1
公开(公告)日：2005-11-24
申请号：US11187944
申请日：2005-07-25
申请人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
发明人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
IPC分类号： B24B9/06 , B24B37/12 , B24B37/34 , H01L21/00 , B24B49/00
CPC分类号： B24B37/345 , B24B9/065 , B24B37/12 , H01L21/67046
摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.
摘要翻译：抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属电影。抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光用于抛光衬底的外周部分的机构。

16. 发明授权

US06767504B2 Heat treatment furnace 有权
标题翻译：热处理炉
公开(公告)号：US06767504B2
公开(公告)日：2004-07-27
申请号：US10122144
申请日：2002-04-15
申请人： Kiyoyuki Hattori , You Ishii , Toshiyuki Harada
发明人： Kiyoyuki Hattori , You Ishii , Toshiyuki Harada
IPC分类号： C21B724
CPC分类号： F27B9/38 , C21D1/74 , C21D1/773 , C21D9/0006 , F27B9/04 , F27D7/06 , F27D2019/0009
摘要： In a heat treating method and furnace used in this method which can prevent disturbance of an atmosphere gas inside a heat chamber, and can prevent deterioration of the processing quality and efficiency of work, a control section 4 first operates a vacuum pump VP to reduce the inner pressure of a purge chamber 3 to a predetermined pressure level, then manipulates a large and small caliber operating valve (13a, 13b) to supply the atmosphere from the interior of the heat chamber 1 to that of the purge chamber 3, and the control section 4 actuates transporting means 5 to transport the work W between the purge chamber 3 and the heat chamber 1 in a state wherein the inner pressures of the purge chamber 3 and the heat chamber 1 have been rendered substantially equal on the basis of detected values from first and second pressure sensors PS1, PS2.
摘要翻译：在该方法中使用的热处理方法和炉子中，能够防止加热室内的气氛气体的干扰，能够防止加工质量的劣化和加工效率的降低，控制部4首先对真空泵VP进行动作，净化室3的内部压力达到预定压力水平，然后操作大口径和小口径的操作阀（13a，13b）以将气体从加热室1的内部供应到净化室3的气体，并且控制基于检测值的检测值，在清洗室3和加热室1的内部压力基本相等的状态下，第4部分致动输送装置5，以将清洗室3和加热室1之间的工件W输送到第一和第二压力传感器PS1，PS2。

17. 发明授权

US5921852A Polishing apparatus having a cloth cartridge 失效
标题翻译：具有布料盒的抛光装置
公开(公告)号：US5921852A
公开(公告)日：1999-07-13
申请号：US880639
申请日：1997-06-23
申请人： Norio Kimura , You Ishii
发明人： Norio Kimura , You Ishii
IPC分类号： B24B37/20 , B24B37/22 , B24B37/24 , B24B5/00 , B24B29/00
CPC分类号： B24B37/26 , B24B37/12 , B24B37/20
摘要： A polishing apparatus such as a semiconductor wafer. The polishing apparatus has a turntable, a cloth cartridge detachably exchangeably mounted on the turntable, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth. The cloth cartridge includes a cartridge base member and a polishing cloth bonded to an upper surface of the cartridge base member. The cartridge base member comprises a plurality of base member segments, and the polishing cloth comprises a plurality of polishing cloth segments bonded to upper surfaces of respective of the base member segments.
摘要翻译：诸如半导体晶片的抛光装置。抛光装置具有可转动地安装在转盘上的转盘，可拆卸地布置的布料盒，以及用于保持工件并将工件压靠在抛光布上的顶环。该布料盒包括一个与基座部件的上表面接合的墨盒底座部件和抛光布。所述盒底部构件包括多个基部构件段，并且所述抛光布包括多个结合到所述基部构件段的上表面的抛光布段。

18. 发明授权

US07108589B2 Polishing apparatus and method 有权
标题翻译：抛光设备和方法
公开(公告)号：US07108589B2
公开(公告)日：2006-09-19
申请号：US11187944
申请日：2005-07-25
申请人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
发明人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
IPC分类号： B24B7/00
CPC分类号： B24B37/345 , B24B9/065 , B24B37/12 , H01L21/67046
摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.
摘要翻译：抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属电影。抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光用于抛光衬底的外周部分的机构。

19. 再颁专利

USRE38228E1 Polishing apparatus 失效
标题翻译：抛光设备和方法
公开(公告)号：USRE38228E1
公开(公告)日：2003-08-19
申请号：US08789304
申请日：1997-01-30
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereto for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.

20. 发明授权

US06364752B1 Method and apparatus for dressing polishing cloth 失效
标题翻译：抛光布修整方法和装置
公开(公告)号：US06364752B1
公开(公告)日：2002-04-02
申请号：US08881616
申请日：1997-06-25
申请人： Norio Kimura , You Ishii , Toyomi Nishi , Takayoshi Kawamoto , Takeshi Sakurai
发明人： Norio Kimura , You Ishii , Toyomi Nishi , Takayoshi Kawamoto , Takeshi Sakurai
IPC分类号： B24B722
CPC分类号： B24B53/017 , B24B37/005 , B24B49/00
摘要： A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof, determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser against the polishing cloth while the turntable and the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.
摘要翻译：通过使修整器与抛光布接触来修整安装在转台上的抛光布，以恢复抛光布的抛光能力。通过在抛光布的径向方向的径向位置处测量抛光布的表面的高度来进行修整，根据测量的高度确定修整器相对于转盘的旋转速度的转速并且在转台和修整器旋转的同时通过将修整器压靠抛光布来修整抛光布。修整器具有环形金刚石颗粒层或环形SiC层。

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