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    • 11. 发明授权
    • Method of delta-channel in deep sub-micron process
    • 深亚微米工艺中δ沟道的方法
    • US06232160B1
    • 2001-05-15
    • US09396515
    • 1999-09-15
    • Jiaw-Ren ShihShui-Hung ChenJian-Hsing Lee
    • Jiaw-Ren ShihShui-Hung ChenJian-Hsing Lee
    • H01L21336
    • H01L29/66537H01L29/1045H01L29/66553H01L29/6659
    • A new method of suppressing short channel effect without increasing junction leakage and capacitance using a single self-aligning delta-channel implant is described. A pad oxide layer is formed over a semiconductor substrate. A silicon nitride layer is deposited overlying the pad oxide layer and patterned to leave an opening where a gate electrode will be formed. Dielectric spacers are formed on the sidewalls of the opening wherein a portion of the substrate is not covered by the spacers within the opening. A single delta-channel implant is made into the semiconductor substrate using the silicon nitride layer and the dielectric spacers as a mask. This delta-channel implant suppresses short channel effect without increasing junction leakage and capacitance. The dielectric spacers are removed. A polysilicon layer is deposited over the silicon nitride layer and within the opening and polished to leave the polysilicon layer only within the opening. The silicon nitride layer is removed to form a gate electrode wherein the delta-channel implant underlies the gate electrode. Thereafter, lightly doped regions and source and drain regions are formed within the semiconductor substrate associated with the gate electrode to complete fabrication of the integrated circuit device.
    • 描述了使用单个自对准delta通道植入物抑制短通道效应而不增加结漏电和电容的新方法。 衬垫氧化物层形成在半导体衬底上。 将氮化硅层沉积在衬垫氧化物层上并被图案化以留下将形成栅电极的开口。 电介质间隔物形成在开口的侧壁上,其中衬底的一部分未被开口内的间隔物覆盖。 使用氮化硅层和电介质间隔物作为掩模将单个Δ沟道注入制成半导体衬底。 该delta通道注入抑制短沟道效应,而不增加结漏电流。 去除电介质垫片。 多晶硅层沉积在氮化硅层之上并且在开口内被抛光,仅在开口内离开多晶硅层。 去除氮化硅层以形成栅电极,其中该三角沟道注入位于该栅电极下方。 此后,在与栅极电极相关联的半导体衬底内形成轻掺杂区域和源极和漏极区域,以完成集成电路器件的制造。
    • 13. 发明授权
    • Decoupling capacitor
    • 去耦电容
    • US07247543B2
    • 2007-07-24
    • US11072014
    • 2005-03-04
    • Jiaw-Ren ShihJian-Hsing LeeShui-Hung Chen
    • Jiaw-Ren ShihJian-Hsing LeeShui-Hung Chen
    • H01L23/62
    • H01L27/0251
    • A decoupling capacitor with increased resistance to electrostatic discharge (ESD) is provided on an integrated circuit (IC). The capacitor may be single or multi-fingered. In one example, the capacitor includes first and second electrodes separated by a dielectric material, a source positioned proximate to the first electrode, and a floating drain positioned proximate to the first electrode and separated from the source by the first electrode. A parasitic element, modeled as a bipolar junction transistor (BJT), is formed by current interactions between the source, the floating drain, and a doped area. The floating drain provides a constant potential region at the base of the BJT, which minimizes ESD damage to the IC.
    • 在集成电路(IC)上提供了具有增加的静电放电阻抗(ESD)的去耦电容器。 电容器可以是单指或多指。 在一个示例中,电容器包括由电介质材料隔开的第一和第二电极,靠近第一电极定位的源,以及靠近第一电极定位并与第一电极分离的浮动漏极。 通过源极,浮置漏极和掺杂区域之间的电流相互作用形成了被建模为双极结型晶体管(BJT)的寄生元件。 浮动漏极在BJT的基极处提供恒定的电位区域,从而最大程度降低对IC的ESD损坏。
    • 14. 发明授权
    • Decoupling capacitor
    • 去耦电容
    • US06937457B2
    • 2005-08-30
    • US10694129
    • 2003-10-27
    • Jiaw-Ren ShihJian-Hsing LeeShui-Hung Chen
    • Jiaw-Ren ShihJian-Hsing LeeShui-Hung Chen
    • H01G4/228H01G4/35H01L21/8234H01L23/60H02H9/00
    • H01L27/0251
    • A decoupling capacitor with increased resistance to electrostatic discharge (ESD) is provided on an integrated circuit (IC). The capacitor may be single or multi-fingered. In one example, the capacitor includes first and second electrodes separated by a dielectric material, a source positioned proximate to the first electrode, and a floating drain positioned proximate to the first electrode and separated from the source by the first electrode. A parasitic element, modeled as a bipolar junction transistor (BJT), is formed by current interactions between the source, the floating drain, and a doped area. The floating drain provides a constant potential region at the base of the BJT, which minimizes ESD damage to the IC.
    • 在集成电路(IC)上提供了具有增加的静电放电阻抗(ESD)的去耦电容器。 电容器可以是单指或多指。 在一个示例中,电容器包括由电介质材料隔开的第一和第二电极,靠近第一电极定位的源,以及靠近第一电极定位并与第一电极分离的浮动漏极。 通过源极,浮置漏极和掺杂区域之间的电流相互作用形成了被建模为双极结型晶体管(BJT)的寄生元件。 浮动漏极在BJT的基极处提供恒定的电位区域,从而最大程度降低对IC的ESD损坏。
    • 16. 发明申请
    • DECOUPLING CAPACITOR
    • 解除电容器
    • US20050088801A1
    • 2005-04-28
    • US10694129
    • 2003-10-27
    • Jiaw-Ren ShihJian-Hsing LeeShui-Hung Chen
    • Jiaw-Ren ShihJian-Hsing LeeShui-Hung Chen
    • H01G4/228H01G4/35H01L21/8234H01L23/60H02H9/00
    • H01L27/0251
    • A decoupling capacitor with increased resistance to electrostatic discharge (ESD) is provided on an integrated circuit (IC). The capacitor may be single or multi-fingered. In one example, the capacitor includes first and second electrodes separated by a dielectric material, a source positioned proximate to the first electrode, and a floating drain positioned proximate to the first electrode and separated from the source by the first electrode. A parasitic element, modeled as a bipolar junction transistor (BJT), is formed by current interactions between the source, the floating drain, and a doped area. The floating drain provides a constant potential region at the base of the BJT, which minimizes ESD damage to the IC.
    • 在集成电路(IC)上提供了具有增加的静电放电阻抗(ESD)的去耦电容器。 电容器可以是单指或多指。 在一个示例中,电容器包括由电介质材料隔开的第一和第二电极,靠近第一电极定位的源,以及靠近第一电极定位并与第一电极分离的浮动漏极。 通过源极,浮置漏极和掺杂区域之间的电流相互作用形成了被建模为双极结型晶体管(BJT)的寄生元件。 浮动漏极在BJT的基极处提供恒定的电位区域,从而最大程度降低对IC的ESD损坏。
    • 20. 发明授权
    • ESD protection component
    • ESD保护元件
    • US06876041B2
    • 2005-04-05
    • US09974056
    • 2001-10-11
    • Jian-Hsing LeeKuo-Reay PengShui-Hung Chen
    • Jian-Hsing LeeKuo-Reay PengShui-Hung Chen
    • H01L27/02H01L23/62
    • H01L27/0266H01L29/87H01L2924/0002H01L2924/00
    • The present invention provides an ESD protection component, comprising at least two MOS field effect transistors (FETs) of a first conductivity type and a first well having a first conductivity type. The two MOS FETs have two parallel gates formed on a first semiconductive layer having a second conductivity type. The first well formed on the first semiconductive layer is comprised of a connecting area formed between the MOS FETs, two parallel extension areas formed perpendicular to the gates of the MOS FETs, and a first doping area of the second conductivity type formed in the connecting area. Two SCR are formed with drains of the MOS FETs, the first semiconductive layer, the first well and the first doping region. With the combination of the SCR and NMOS FET, ESD protection efficiency can be substantially enhanced.
    • 本发明提供一种ESD保护元件,包括至少两个具有第一导电类型的MOS场效应晶体管(FET)和具有第一导电类型的第一阱。 两个MOS FET具有形成在具有第二导电类型的第一半导体层上的两个平行栅极。 形成在第一半导体层上的第一阱包括形成在MOS FET之间的连接区域,垂直于MOS FET的栅极形成的两个平行延伸区域和形成在连接区域中的第二导电类型的第一掺杂区域 。 两个SCR形成有MOS FET的漏极,第一半导体层,第一阱和第一掺杂区。 通过SCR和NMOS FET的组合,可以显着提高ESD保护效率。