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    • 11. 发明授权
    • Automatic actuator for normally manually operable selector elements
    • 用于常规手动操作的选择器元件的自动执行器
    • US4078484A
    • 1978-03-14
    • US684642
    • 1976-05-10
    • John J. HorbalWilliam J. Casey
    • John J. HorbalWilliam J. Casey
    • G01G19/00G07B17/00B41J1/22
    • G01G19/005G07B17/00314G07B2017/00233
    • Apparatus for automatically actuating manually operable selector elements, such as the type which normally are found on a manually operable postage meter. A carriage is provided and is movable between an initial, start position and an end position. Plural actuator elements are coupled to and movable with the carriage. These actuator elements are positioned in operable relation with the selector elements and are selectively energized while the carriage moves between its start and end positions to correspondingly activate the selector elements. When used in the environment of a postage meter, the selective energization of the actuator elements thereby conditions the postage meter to provide a corresponding indication of postage. Reset apparatus resets the carriage following the selective energization of the actuator elements. With minor changes in the structure of the actuator elements, the automatic actuator can be used in conjunction with, for example, postage meters of the type having movable levers selectively positioned to establish corresponding monetary units of postage, or an array of columns of depressible keys, each key corresponding to any one of the possible monetary units of postage.
    • 用于自动启动手动操作的选择器元件的装置,例如通常在手动操作的邮资计费器上找到的类型。 提供了一个滑架,并且可以在初始位置,起始位置和结束位置之间移动。 多个致动器元件联接到滑架并且可与滑架一起移动。 这些致动器元件位于与选择器元件可操作的关系中,并且当托架在其起始位置和终止位置之间移动时选择性地激励,以相应地激活选择器元件。 当在邮资计费器的环境中使用时,致动器元件的选择性通电从而调节邮资计费器以提供相应的邮资指示。 复位装置在致动器元件的选择性通电之后重置滑架。 由于致动器元件结构的微小变化,自动致动器可以与例如具有选择性地定位以便建立相应的邮资货币单位的可移动杠杆的类型的邮资计量表相结合使用,或者一组可按压的键 ,每个密钥对应于任何一个可能的货币单位的邮资。
    • 16. 发明授权
    • Device and method for attaching and soldering pre-formed solder spheres to the ball grid array (BGA) integrated circuit package attachment sites in high volume
    • 用于将预形成的焊球附着并焊接到球栅阵列(BGA)的大容量集成电路封装附件位置的装置和方法
    • US06229210B1
    • 2001-05-08
    • US09206197
    • 1998-12-04
    • William J. Casey
    • William J. Casey
    • H01L2348
    • H05K3/3478H01L21/4853H05K2203/041H05K2203/0557
    • A device and method for high volume solder sphere alignment and placement including the high volume solder sphere alignment and placement for BGA and CSP packages including a pre-form stencil having a pattern of apertures formed through its cross-section, that corresponds to the pattern of the exposed conductive lands of a circuit requiring sphere alignment and placement. The apertures may be formed having diameters that are approximately 5% larger in diameter than the solder spheres. The method for high volume solder sphere alignment and placement may include the steps of prepping the workpiece, applying a thin layer of flux to the conductive lands. Aligning the pre-form stencil with the part to which the solder balls are to be aligned with and placed upon. Applying the solder spheres through the pattern of apertures onto the conductive lands. Application may take place either by brushing or by spreading the spheres with a generally U-shaped blade wherein the solder spheres are contained between the legs of the U-shaped blade during application.
    • 一种用于大体积焊球对准和放置的装置和方法,包括用于BGA和CSP封装的高体积焊球对准和放置,包括具有通过其横截面形成的孔的图案的预成型模版,其对应于 需要球体对准和放置的电路的暴露导电焊盘。 孔可以形成为直径大于焊料球的直径大约5%的直径。 用于大体积焊球对准和放置的方法可以包括准备工件,将薄层的助焊剂施加到导电焊盘的步骤。 将预成型模板与焊球对准并放置在其上的部件对齐。 将焊球通过孔的图案施加到导电焊盘上。 应用可以通过刷涂或通过用普通U形刀片撒布球体来进行,其中在应用期间焊料球体被容纳在U形刀片的腿之间。