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11. 发明申请

US20140123493A1 SECTIONED MANIFOLDS FACILITATING PUMPED IMMERSION-COOLING OF ELECTRONIC COMPONENTS 有权
标题翻译：电子元器件的分散式冷却
公开(公告)号：US20140123493A1
公开(公告)日：2014-05-08
申请号：US13788919
申请日：2013-03-07
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： B23P15/26
CPC分类号： B23P15/26 , F28D15/02 , F28F3/048 , F28F3/12 , F28F2250/06 , H05K7/20809 , Y10T29/4935
摘要： Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.
摘要翻译：提供冷却方法以便于电子部件的抽吸浸没冷却。冷却方法包括：提供围绕一个或多个部件形成隔室的壳体，以及提供供应歧管，回流歧管以及联接冷却剂回路联接器以使供应和返回歧管与壳体流体连通。流过冷却剂回路的冷却剂流过壳体的隔室，并且至少部分地通过流动沸腾来冷却部件。泵有利于循环内的冷却剂循环，并且冷却剂旁通管线连接在供应和返回歧管之间。回流歧管包括混合相歧管部分，并且旁路管线将冷却剂从供应歧管直接提供给混合相歧管部分。冷却剂从冷却剂旁通管路流向与该歧管部分内任何冷却剂蒸气流的方向相反的方向流入混合相歧管部分。

12. 发明申请

US20140096386A1 HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING 有权
标题翻译：具有用于两相冷却的蒸汽渗透膜的热沉结构
公开(公告)号：US20140096386A1
公开(公告)日：2014-04-10
申请号：US14105691
申请日：2013-12-13
申请人： International Business Machines Corporation
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： B23P15/26
CPC分类号： B23P15/26 , F28D15/0266 , F28F3/00 , F28F3/12 , F28F13/00 , G06F1/20 , H05K7/20254 , H05K7/20272 , H05K7/2029 , H05K7/20772 , Y10T29/4935
摘要： A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
摘要翻译：提供散热器，冷却电子结构和利用散热器的冷却电子设备。散热器由导热结构制成，该导热结构包括一个或多个冷却剂承载通道，其联接以便于冷却剂流过冷却剂输送通道。散热器还包括与冷却剂输送通道相关联的膜。该膜包括至少一个透气区域，其覆盖着一部分冷却剂输送通道，并且有助于从冷却剂输送通道中除去蒸气，以及至少一个孔口，其连接以将冷却剂注入到在一个或多个通道的相对端之间的冷却剂承载通道的至少一个表面。

13. 发明申请

US20140068942A1 VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE 有权
标题翻译：具有三维折叠结构的蒸汽冷凝器
公开(公告)号：US20140068942A1
公开(公告)日：2014-03-13
申请号：US13788722
申请日：2013-03-07
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： B23P15/26
CPC分类号： H05K7/20309 , B23P15/26 , F28D9/0025 , F28D15/02 , F28F3/046 , F28F3/12 , F28F9/02 , H05K7/203 , H05K7/20809 , Y10T29/4935 , Y10T29/49359 , Y10T29/49396
摘要： A method of fabricating a vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.
摘要翻译：提供一种制造蒸汽冷凝器的方法，其包括三维折叠结构，该三维折叠结构至少部分限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与平行于蒸气冷凝通道延伸。折叠结构包括在片材中具有多个折叠的导热片。片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触冷却液承载通道。蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带频道

14. 发明申请

US20140064320A1 CALIBRATED AIRFLOW SENSOR FACILTIATING MONITORING OF ELECTRONIC SYSTEM COOLING 有权
标题翻译：电子系统冷却的校准气流传感器辅助监测
公开(公告)号：US20140064320A1
公开(公告)日：2014-03-06
申请号：US13667375
申请日：2012-11-02
申请人： International Business Machines Corporation
发明人： Levi A. CAMPBELL , Thomas C. LONG , Robert B. SCHLAK , Peter A. WENDLING, JR.
IPC分类号： G01K15/00
CPC分类号： G01K15/005 , G01F1/684 , G01F1/6965 , G01F25/0007 , G01K7/425 , G06F1/20 , G06F1/206 , H05K7/20836
摘要： A calibrated airflow monitoring method is provided. The monitoring method which includes: providing an airflow sensor positioned within an electronic system to be at least partially air-cooled, the airflow sensor including at least one temperature sensor and a heater associated with one temperature sensor of the at least one temperature sensor; calibrating, with the airflow sensor positioned within the electronic system, a duty cycle for use in powering the heater associated with the one temperature sensor; and providing a controller configured to use the calibrated duty cycle in powering the heater of the temperature sensor during airflow monitoring of the electronic system, and to obtain a hot temperature (Thot) reading from the one temperature sensor having the associated heater, and to determine, based at least in part on the hot temperature (Thot) reading, whether to issue an airflow warning.
摘要翻译：提供校准的气流监测方法。该监测方法包括：提供定位在电子系统内至少部分空气冷却的气流传感器，所述气流传感器包括至少一个温度传感器和与所述至少一个温度传感器的一个温度传感器相关联的加热器; 校准，气流传感器定位在电子系统内，用于为与一个温度传感器相关联的加热器供电的占空比; 以及提供控制器，其被配置为在电子系统的气流监测期间使用校准的占空比来为温度传感器的加热器供电，并且从具有相关联的加热器的一个温度传感器获得热温度（Thot）读数，并且确定，至少部分地基于热温度（Thot）读数，是否发出气流警告。

15. 发明申请

US20140047702A1 THERMAL EXPANSION-ENHANCED HEAT SINK FOR AN ELECTRONIC ASSEMBLY 有权
标题翻译：用于电子组件的热膨胀增强型散热器
公开(公告)号：US20140047702A1
公开(公告)日：2014-02-20
申请号：US14063162
申请日：2013-10-25
申请人： International Business Machines Corporation
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS , Prabjit SINGH
IPC分类号： H01L23/367
CPC分类号： H05K7/20 , H01L23/367 , H01L23/373 , H01L23/3736 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2023/4087 , H01L2224/16 , Y10T29/49002 , Y10T29/4935 , Y10T29/49353
摘要： A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.
摘要翻译：散热器和制造方法被提供用于从电子部件去除热量。散热器包括散热器底座和框架。基座具有第一热膨胀系数（CTE），并且包括配置成耦合到电子部件以便于去除热量的基面。框架具有第二CTE，并且被配置为以与电子部件相对的关系约束基面，其中第一CTE大于第二CTE。散热器基座或框架中的至少一个被构造成使得散热器基座的加热导致散热器基座的基面朝向电子部件的压缩力，其有助于从电子部件的热传递。热界面材料设置在基底表面和电子部件之间。

16. 发明申请

US20130105116A1 COOLANT MANIFOLD WITH SEPARATELY ROTATABLE MANIFOLD SECTION(S) 有权
标题翻译：具有单独可旋转的节气门部分的冷却液喷射（S）
公开(公告)号：US20130105116A1
公开(公告)日：2013-05-02
申请号：US13705283
申请日：2012-12-05
申请人： International Business Machines Corporation
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Eric J. McKEEVER , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20272 , H05K7/2079 , Y10T29/4935 , Y10T29/49389
摘要： A cooling method is provided which includes providing a cooling apparatus that includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.
摘要翻译：提供了一种冷却方法，其包括提供冷却装置，冷却装置包括连接到一个或多个电子部件，一个或多个冷却剂管道和一个或多个冷却剂歧管的一个或多个冷却剂冷却结构。冷却剂冷却结构包括一个或多个冷却剂输送通道，并且冷却剂歧管包括一个或多个可旋转的歧管段。一个冷却剂管道将相应的可旋转歧管部分和相应冷却剂冷却结构的冷却剂输送通道流体连通地连接。相应的可旋转歧管部分可相对于冷却剂歧管的另一部分旋转，以便于将冷却剂冷却结构与其相关联的电子部件分离，同时保持冷却剂冷却结构与相应的可旋转歧管部分流体连通，通过一个冷却剂管道，其在一个实施例中是基本刚性的冷却剂导管。

17. 发明申请

US20180295754A1 EFFECTIVENESS-WEIGHTED CONTROL OF COOLING SYSTEM COMPONENTS 审中-公开
公开(公告)号：US20180295754A1
公开(公告)日：2018-10-11
申请号：US16005823
申请日：2018-06-12
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20 , G05B15/02 , G05D23/19
CPC分类号： H05K7/20836 , G05B15/02 , G05D23/1932 , H05K7/2079
摘要： Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

18. 发明申请

US20180077824A1 THERMOELECTRIC-ENHANCED, INLET AIR-COOLED THERMAL CONDUCTORS 审中-公开
公开(公告)号：US20180077824A1
公开(公告)日：2018-03-15
申请号：US15819487
申请日：2017-11-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Michael J. ELLSWORTH, JR. , Milnes P. DAVID , Dustin W. DEMETRIOU , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20436 , H05K7/20545 , H05K7/20709 , H05K7/20727 , H05K7/20754 , H05K7/20818
摘要： A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.

19. 发明申请

US20170127576A1 DRAWER-LEVEL IMMERSION-COOLING WITH HINGED, LIQUID-COOLED HEAT SINK 审中-公开
公开(公告)号：US20170127576A1
公开(公告)日：2017-05-04
申请号：US15175331
申请日：2016-06-07
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H05K7/20127 , H05K7/20236 , H05K7/203 , H05K7/20318 , H05K7/2039 , H05K7/20772 , H05K7/20809
摘要： Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a drawer-level enclosure sized to reside within an electronics rack. The drawer-level enclosure includes a compartment which accommodates one or more electronic components to be cooled. A dielectric fluid is disposed within the compartment. The dielectric fluid includes a liquid dielectric which at least partially immerses the electronic component(s) within the compartment(s). A hinged, liquid-cooled heat sink is also disposed within the compartment of the enclosure. The heat sink operatively facilitates cooling the one or more electronic components via the dielectric fluid within the compartment, and is rotatable between an operational position overlying the electronic component(s), and a service position which allows access to the electronic component(s).

20. 发明申请

US20170049010A1 THERMOELECTRIC-ENHANCED, INLET AIR-COOLED THERMAL CONDUCTORS 有权
标题翻译：热电增强型入口空气冷却导热体
公开(公告)号：US20170049010A1
公开(公告)日：2017-02-16
申请号：US14922324
申请日：2015-10-26
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20436 , H05K7/20545 , H05K7/20709 , H05K7/20727 , H05K7/20754 , H05K7/20818
摘要： A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.
摘要翻译：提供用于冷却电子外壳的散热部件的冷却装置的方法包括：提供热导体以耦合到散热部件，所述热导体包括耦合到所述散热部件的第一导体部分散热部件和第二导体部分，以沿着电子外壳的空气入口侧定位，使得在操作中，第一导体部分将热量从部件传递到第二导体部分; 将至少一个风冷散热器耦合到所述第二导体部分以便于将热量传递到进入所述外壳的气流; 提供耦合到所述第一或第二导体部分的至少一个热电装置，以便于向所述热导体提供主动辅助冷却; 以及提供控制器以控制热电装置的操作并且选择性地切换冷却装置在主动和被动冷却模式之间的操作。

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