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11. 发明申请

US20100132996A1 ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD 审中-公开
标题翻译：电磁带结构和印刷电路板
公开(公告)号：US20100132996A1
公开(公告)日：2010-06-03
申请号：US12466677
申请日：2009-05-15
申请人： Mi-Ja Han , Han Kim , Dae-Hyun Park , Kang-Wook Bong
发明人： Mi-Ja Han , Han Kim , Dae-Hyun Park , Kang-Wook Bong
IPC分类号： H05K1/11
CPC分类号： H05K1/0236 , H05K1/0237 , H05K2201/09309 , H05K2201/09627 , H05K2201/09663 , H05K2201/09681
摘要： In accordance with an embodiment of the present invention, an electromagnetic bandgap structure includes a plurality of conductive plates, and a multi-via connection part, which electrically connects any two of the plurality of conductive plates with each other. Here, the multi-via connection part includes: a first multi-via, including a first via, having one end part connected to one of the two conductive plates, and at least one other via connected in serial to the first via through a conductive trace; a second multi-via, including a second via, having one end part connected to the other of the two conductive plates, and at least one other via connected in serial to the second via through a conductive trace; and a conductive connection pattern, connecting any one of the vias included in the first multi-via and any one of the vias included in the second multi-via with each other.
摘要翻译：根据本发明的实施例，电磁带隙结构包括多个导电板，以及多通孔连接部，其将多个导电板中的任何两个彼此电连接。这里，多通孔连接部件包括：包括第一通孔的第一多通孔，其具有连接到两个导电板中的一个的一个端部，以及至少一个其它通孔，其连接到第一通孔，通过导电跟踪; 包括连接到所述两个导电板中的另一个的一个端部的第二多通孔，以及至少一个通过导电迹线串联连接到所述第二通孔的另一通孔; 以及导电连接图案，其将包括在第一多通孔中的任何一个通孔和包括在第二多通孔中的任何一个通孔彼此连接。

12. 发明申请

US20110069470A1 Electromagnetic interference noise reduction board using electromagnetic bandgap structure 审中-公开
标题翻译：电磁干扰降噪板采用电磁带隙结构
公开(公告)号：US20110069470A1
公开(公告)日：2011-03-24
申请号：US12654371
申请日：2009-12-17
申请人： Kang-Wook Bong , Han Kim , Mi-Ja Han
发明人： Kang-Wook Bong , Han Kim , Mi-Ja Han
IPC分类号： H05K9/00
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627
摘要： An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes a first area having a ground layer and a power layer, a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes a plurality of first conductive plates placed along the side portion of the first area, a plurality of second conductive plates placed on a planar surface that is different from the first conductive plates so as to overlap with the first conductive plates, and a via configured to connect the first conductive plate and the second conductive plate.
摘要翻译：公开了一种EMI降噪板。具有用于屏蔽噪声的电磁带隙结构的电磁干扰（EMI）降噪板包括具有接地层和功率层的第一区域，放置在其中具有电磁带隙结构的第一区域的侧部中的第二区域。电磁带隙结构包括沿着第一区域的侧面部分放置的多个第一导电板，多个第二导电板，放置在与第一导电板不同的平面上，以与第一导电板重叠，以及经配置以连接第一导电板和第二导电板的通孔。

13. 发明申请

US20110067917A1 Printed circuit board having electromagnetic bandgap structure 有权
标题翻译：具有电磁带隙结构的印刷电路板
公开(公告)号：US20110067917A1
公开(公告)日：2011-03-24
申请号：US12654526
申请日：2009-12-22
申请人： Dae-Hyun Park , Han Kim , Kang-Wook Bong
发明人： Dae-Hyun Park , Han Kim , Kang-Wook Bong
IPC分类号： H05K9/00
CPC分类号： H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K1/0231 , H05K1/024 , H05K2201/0187 , H05K2201/09627 , H05K2201/09881 , H01L2924/00014
摘要： Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a same planar surface as the first conductive plate, and a stitching via unit configured to connect the first conductive plate and the third conductive plate through the planar surface on which the second conductive plate is arranged. A second dielectric material having a permittivity that is different from that of the first dielectric material is interposed between any two of the first conductive plate, the second conductive plate, and the third conductive plate.
摘要翻译：公开了一种包括电磁带隙结构的印刷电路板。包括用于层间绝缘并用于阻挡噪声的第一介电材料的电磁带隙结构被插入到印刷电路板中。电磁带隙结构可以包括第一导电板，布置在与第一导电板不同的平面上的第二导电板，布置在与第一导电板相同的平坦表面上的第三导电板，以及缝合通孔单元被配置为通过其上布置有第二导电板的平面连接第一导电板和第三导电板。具有不同于第一介电材料的介电常数的第二介电材料插入在第一导电板，第二导电板和第三导电板中的任何两个之间。

14. 发明授权

US08227704B2 Printed circuit board having electromagnetic bandgap structure 有权
标题翻译：具有电磁带隙结构的印刷电路板
公开(公告)号：US08227704B2
公开(公告)日：2012-07-24
申请号：US12654526
申请日：2009-12-22
申请人： Dae-Hyun Park , Han Kim , Kang-Wook Bong
发明人： Dae-Hyun Park , Han Kim , Kang-Wook Bong
IPC分类号： H05K9/00
CPC分类号： H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K1/0231 , H05K1/024 , H05K2201/0187 , H05K2201/09627 , H05K2201/09881 , H01L2924/00014
摘要： Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a same planar surface as the first conductive plate, and a stitching via unit configured to connect the first conductive plate and the third conductive plate through the planar surface on which the second conductive plate is arranged. A second dielectric material having a permittivity that is different from that of the first dielectric material is interposed between any two of the first conductive plate, the second conductive plate, and the third conductive plate.
摘要翻译：公开了一种包括电磁带隙结构的印刷电路板。包括用于层间绝缘并用于阻挡噪声的第一介电材料的电磁带隙结构被插入到印刷电路板中。电磁带隙结构可以包括第一导电板，布置在与第一导电板不同的平面上的第二导电板，布置在与第一导电板相同的平坦表面上的第三导电板，以及缝合通孔单元被配置为通过其上布置有第二导电板的平面连接第一导电板和第三导电板。具有不同于第一介电材料的介电常数的第二介电材料插入在第一导电板，第二导电板和第三导电板中的任何两个之间。

15. 发明授权

US08076998B2 Electromagnetic bandgap structure and printed circuit board 失效
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US08076998B2
公开(公告)日：2011-12-13
申请号：US12466704
申请日：2009-05-15
申请人： Kang-Wook Bong , Han Kim , Dae-Hyun Park
发明人： Kang-Wook Bong , Han Kim , Dae-Hyun Park
IPC分类号： H03H7/00
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09681
摘要： An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure that blocks a noise of a certain frequency band can include 4 or more conductive plates, a first stitching via, which electrically connects any two of the conductive plates with each other by having a part of the first stitching via pass through a planar surface that is different from a planar surface of the conductive plates, a second stitching via, which electrically connects another two of the conductive plates with each other by having a part of the second stitching via pass through a planar surface that is different from a planar surface of the conductive plates, and a stitching via chain, which electrically connects the first stitching via and the second stitching via with each other.
摘要翻译：公开了电磁带隙结构。根据本发明的实施例，阻挡一定频带噪声的电磁带隙结构可以包括4个或更多个导电板，第一缝合通孔，其通过以下方式将任何两个导电板彼此电连接：第一缝合线的一部分穿过不同于导电板的平坦表面的平面表面;第二缝合通孔，其通过具有第二缝合通孔的一部分将另外两个导电板彼此电连接穿过不同于导电板的平坦表面的平坦表面，以及缝合通孔链，其将第一缝合通孔和第二缝合通孔彼此电连接。

16. 发明申请

US20100127790A1 ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD 失效
标题翻译：电磁带结构和印刷电路板
公开(公告)号：US20100127790A1
公开(公告)日：2010-05-27
申请号：US12466704
申请日：2009-05-15
申请人： Kang-Wook Bong , Han Kim , Dae-Hyun Park
发明人： Kang-Wook Bong , Han Kim , Dae-Hyun Park
IPC分类号： H04B3/28
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09681
摘要： An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure that blocks a noise of a certain frequency band can include 4 or more conductive plates, a first stitching via, which electrically connects any two of the conductive plates with each other by having a part of the first stitching via pass through a planar surface that is different from a planar surface of the conductive plates, a second stitching via, which electrically connects another two of the conductive plates with each other by having a part of the second stitching via pass through a planar surface that is different from a planar surface of the conductive plates, and a stitching via chain, which electrically connects the first stitching via and the second stitching via with each other.
摘要翻译：公开了电磁带隙结构。根据本发明的实施例，阻挡一定频带噪声的电磁带隙结构可以包括4个或更多个导电板，第一缝合通孔，其通过以下方式将任何两个导电板彼此电连接：第一缝合线的一部分穿过不同于导电板的平坦表面的平面表面;第二缝合通孔，其通过具有第二缝合通孔的一部分将另外两个导电板彼此电连接穿过不同于导电板的平坦表面的平坦表面，以及缝合通孔链，其将第一缝合通孔和第二缝合通孔彼此电连接。

17. 发明授权

US08319572B2 Electromagnetic bandgap structure and printed circuit board 有权
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US08319572B2
公开(公告)日：2012-11-27
申请号：US12568324
申请日：2009-09-28
申请人： Han Kim , Kang-Wook Bong
发明人： Han Kim , Kang-Wook Bong
IPC分类号： H04B3/30
CPC分类号： H01P1/20 , H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09627
摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface; second conductive plates, placed on a second planar surface; a first conductive trace, electrically connecting any two adjacent first conductive plates with each other on the first planar surface, in which the two adjacent first conductive plates are in a first direction; a second conductive trace, electrically connecting any two adjacent second conductive plates with each other on the second planar surface, in which the two adjacent second conductive plates are in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions lined up in a direction different from the first direction on the first planar surface with each other; and a second stitching via, electrically connecting any two adjacent conductive portions lined up in a direction different from the first direction on the second planar surface with each other.
摘要翻译：电磁带隙结构包括：第一导电板，放置在第一平面上; 第二导电板，放置在第二平面上; 第一导电迹线，在第一平坦表面上电连接任何两个相邻的第一导电板，其中两个相邻的第一导电板处于第一方向; 第二导电迹线，在第二平坦表面上彼此相互连接任何两个相邻的第二导电板，其中两个相邻的第二导电板处于第一方向; 第一缝合通孔，将在第一平面上的与第一方向不同的方向排列的任何两个相邻的导电部彼此电连接; 以及第二缝合通孔，将在第二平坦表面上沿与第一方向不同的方向排列的任何两个相邻的导电部彼此电连接。

18. 发明申请

US20100134212A1 ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD 有权
标题翻译：电磁带结构和印刷电路板
公开(公告)号：US20100134212A1
公开(公告)日：2010-06-03
申请号：US12568324
申请日：2009-09-28
申请人： Han KIM , Kang-Wook Bong
发明人： Han KIM , Kang-Wook Bong
IPC分类号： H01P1/20
CPC分类号： H01P1/20 , H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09627
摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface; second conductive plates, placed on a second planar surface; a first conductive trace, electrically connecting any two adjacent first conductive plates with each other on the first planar surface, in which the two adjacent first conductive plates are in a first direction; a second conductive trace, electrically connecting any two adjacent second conductive plates with each other on the second planar surface, in which the two adjacent second conductive plates are in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions lined up in a direction different from the first direction on the first planar surface with each other; and a second stitching via, electrically connecting any two adjacent conductive portions lined up in a direction different from the first direction on the second planar surface with each other.
摘要翻译：电磁带隙结构包括：第一导电板，放置在第一平面上; 第二导电板，放置在第二平面上; 第一导电迹线，在第一平坦表面上电连接任何两个相邻的第一导电板，其中两个相邻的第一导电板处于第一方向; 第二导电迹线，在第二平坦表面上彼此相互连接任何两个相邻的第二导电板，其中两个相邻的第二导电板处于第一方向; 第一缝合通孔，将在第一平面上的与第一方向不同的方向排列的任何两个相邻的导电部彼此电连接; 以及第二缝合通孔，将在第二平坦表面上沿与第一方向不同的方向排列的任何两个相邻的导电部彼此电连接。

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