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1. 发明申请

US20110299264A1 EMI NOISE SHIELD BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE 有权
标题翻译： EMI噪声屏蔽板包括电磁带结构
公开(公告)号：US20110299264A1
公开(公告)日：2011-12-08
申请号：US12984935
申请日：2011-01-05
申请人： Han KIM , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
发明人： Han KIM , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
IPC分类号： H05K9/00
CPC分类号： H05K1/0236 , H01L2224/16227 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/15313 , H01L2924/16251 , H01L2924/3025 , H05K3/4694
摘要： The present invention provides an EMI noise shield board in which an EBG structure is inserted. The EMI noise shield board in accordance with an embodiment of the present invention can include: a first board portion, an electronic part being mounted on an upper surface of the first board portion, a circuit for transferring a signal and power to the electronic part being in the first board portion; and a second board portion located on a lower surface of the first board portion, an electromagnetic bandgap structure being inserted into the second board portion, the electromagnetic bandgap structure having a band stop frequency property in such a way that an EMI noise transferred from the first board portion can be shielded from being radiated to the outside of a board.
摘要翻译：本发明提供一种其中插入有EBG结构的EMI噪声屏蔽板。根据本发明的实施例的EMI噪声屏蔽板可以包括：第一板部分，安装在第一板部分的上表面上的电子部件，用于将信号和电力传送到电子部件的电路，在第一板部分; 以及第二板部分，位于第一板部分的下表面上，电磁带隙结构插入到第二板部分中，电磁带隙结构具有带阻频率特性，使得从第一板部分转移的EMI噪声板部分可以被屏蔽以免被辐射到板的外部。

2. 发明申请

US20100134212A1 ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD 有权
标题翻译：电磁带结构和印刷电路板
公开(公告)号：US20100134212A1
公开(公告)日：2010-06-03
申请号：US12568324
申请日：2009-09-28
申请人： Han KIM , Kang-Wook Bong
发明人： Han KIM , Kang-Wook Bong
IPC分类号： H01P1/20
CPC分类号： H01P1/20 , H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09627
摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface; second conductive plates, placed on a second planar surface; a first conductive trace, electrically connecting any two adjacent first conductive plates with each other on the first planar surface, in which the two adjacent first conductive plates are in a first direction; a second conductive trace, electrically connecting any two adjacent second conductive plates with each other on the second planar surface, in which the two adjacent second conductive plates are in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions lined up in a direction different from the first direction on the first planar surface with each other; and a second stitching via, electrically connecting any two adjacent conductive portions lined up in a direction different from the first direction on the second planar surface with each other.
摘要翻译：电磁带隙结构包括：第一导电板，放置在第一平面上; 第二导电板，放置在第二平面上; 第一导电迹线，在第一平坦表面上电连接任何两个相邻的第一导电板，其中两个相邻的第一导电板处于第一方向; 第二导电迹线，在第二平坦表面上彼此相互连接任何两个相邻的第二导电板，其中两个相邻的第二导电板处于第一方向; 第一缝合通孔，将在第一平面上的与第一方向不同的方向排列的任何两个相邻的导电部彼此电连接; 以及第二缝合通孔，将在第二平坦表面上沿与第一方向不同的方向排列的任何两个相邻的导电部彼此电连接。

3. 发明申请

US20130048365A1 ELECTROMAGNETIC INTERFERENCE NOISE REDUCTION PACKAGE BOARD 有权
标题翻译：电磁干扰噪声减少包装板
公开(公告)号：US20130048365A1
公开(公告)日：2013-02-28
申请号：US13590760
申请日：2012-08-21
申请人： Han KIM , Dae-Hyun PARK , Young-Min Ban
发明人： Han KIM , Dae-Hyun PARK , Young-Min Ban
IPC分类号： H05K9/00
CPC分类号： H01L23/64 , H01L23/552 , H01L23/66 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K1/0224 , H05K1/0236 , H01L2924/00014
摘要： An EMI noise reduction package board, having a top layer and a bottom layer, one of which having a semiconductor device mounted thereon, can include: a first area having a signal layer arranged on one surface thereof; and a second area placed on a lateral side of the first area and having unit structures arranged repeatedly therein, the unit structures configured for inhibiting EMI noise from being radiated to an outside through the lateral side of the first area. The unit structure can include: a top conductive plate and a bottom conductive plate, formed, respectively, on the top layer and the bottom layer of the second area to face each other in a pair; and a via, connecting the top conductive plate with the bottom conductive plate.
摘要翻译：具有顶层和底层的EMI噪声降低封装板，其中一个具有安装在其上的半导体器件，其可以包括：具有布置在其一个表面上的信号层的第一区域; 以及放置在所述第一区域的横向侧上并具有重复排列的单元结构的第二区域，所述单元结构被配置为用于抑制EMI噪声通过第一区域的侧面辐射到外部。该单元结构可以包括：顶部导电板和底部导电板，分别形成在第一区域的顶层和底层上，以便成对地彼此面对; 以及将顶部导电板与底部导电板连接的通孔。

4. 发明申请

US20120234591A1 ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD 失效
标题翻译：电磁带结构和印刷电路板
公开(公告)号：US20120234591A1
公开(公告)日：2012-09-20
申请号：US13437254
申请日：2012-04-02
申请人： Han KIM , Mi-Ja Han , Hyo-Jic Jung
发明人： Han KIM , Mi-Ja Han , Hyo-Jic Jung
IPC分类号： H05K1/11
CPC分类号： H01P1/2005 , H01L2224/16 , H01P1/203 , H05K1/0236 , H05K1/0237 , H05K2201/09309 , H05K2201/09518 , H05K2201/096 , H05K2201/09627 , H05K2201/09663 , H05K2201/09681
摘要： An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate, wherein the first stitching via electrically connects the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above or below the one conductive plate, and the second stitching via electrically connects the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface that is different from the planar surface through which the part of the first stitching via is connected, the two planar surfaces being placed in a same direction based on the conductive plates.
摘要翻译：一种电磁带隙结构，包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板，其中所述第一缝合通孔将所述第一缝合通孔的一部分通过平面表面在一个导电板的上方或下方，并且第二缝合通孔通过允许第二缝合通孔的一部分通过不同于平面的平面表面连接一个导电板到另一个导电板，通过该平面第一缝合通孔的部分被连接，两个平面被放置在相同的方向上，基于导电板。

5. 发明申请

US20120138338A1 PRINTED CIRCUIT BOARD HAVING STEPPED CONDUCTION LAYER 审中-公开
标题翻译：具有阶梯式导电层的印刷电路板
公开(公告)号：US20120138338A1
公开(公告)日：2012-06-07
申请号：US13365755
申请日：2012-02-03
申请人： Han KIM , Hyung-Sik Choi , Dae-Hyun Park
发明人： Han KIM , Hyung-Sik Choi , Dae-Hyun Park
IPC分类号： H05K1/00
CPC分类号： H05K1/0236 , H05K1/0237 , H05K2201/09309 , H05K2201/09663 , H05K2201/09681 , H05K2201/09736 , H05K2201/09745
摘要： A printed circuit board having stepped conduction layer includes at least one conduction layer configured for use as a signal transmission layer, the at least one conduction layer being divided into at least two base regions and at least one connecting region connecting any adjacent two of the base regions, and the connecting region being stepped to a lower height than those of the base regions. A lower surface of the connecting region lies on a same plane as a lower surface of the base region, or an upper surface of the connecting region lies on a same plane as an upper surface of the base region. A bridge connecting structure between the connecting regions and the base regions is disposed in possible noise transfer paths between a noise source and a noise attenuation target positioned on the printed circuit board.
摘要翻译：具有阶梯式导电层的印刷电路板包括被配置为用作信号传输层的至少一个导电层，所述至少一个导电层被分成至少两个基极区域和至少一个连接区域，区域，并且连接区域被阶梯到比基部区域低的高度。连接区域的下表面位于与基底区域的下表面相同的平面上，或者连接区域的上表面位于与基底区域的上表面相同的平面上。在连接区域和基极区域之间的桥连接结构设置在位于印刷电路板上的噪声源和噪声衰减目标之间的可能的噪声传递路径中。

6. 发明申请

US20100134213A1 ELECTROMAGNETIC BANDGAP STRUCTURE AND CIRCUIT BOARD 有权
标题翻译：电磁带结构与电路板
公开(公告)号：US20100134213A1
公开(公告)日：2010-06-03
申请号：US12568362
申请日：2009-09-28
申请人： Han KIM , Ja-Bu Koo , Dae-Hyun Park
发明人： Han KIM , Ja-Bu Koo , Dae-Hyun Park
IPC分类号： H01P1/20
CPC分类号： H01P1/2005 , H01P1/203 , H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09681
摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface, in which the first conductive plates are lined up in a first direction; second conductive plates, placed on a second planar surface and arranged at an area corresponding to an area in which the first conductive plates are disposed, in which the second conductive plates are lined up in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the first planar surface; and a second stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the second planar surface.
摘要翻译：电磁带隙结构包括：第一导电板，放置在第一平面上，第一导电板沿第一方向排列; 第二导电板，放置在第二平坦表面上并且布置在与设置有第一导电板的区域相对应的区域中，其中第二导电板沿第一方向排列; 第一缝合通孔，将任何两个相邻的导电部分彼此电连接，并且其中两个相邻的导电部分沿与第一平坦表面上的第一方向不同的方向排列; 以及第二缝合通孔，将任何两个相邻的导电部彼此电连接，并且其中两个相邻的导电部分在与第二平面上的第一方向不同的方向上排列。

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