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    • 12. 发明授权
    • Facsimile recording system using photosensitive microcapsule recording
medium
    • 传真录音系统采用光敏微胶囊记录介质
    • US4918536A
    • 1990-04-17
    • US263264
    • 1988-10-27
    • Kenji SakakibaraJun SakaiShigeyuki HayashiMichitoshi AkaoSatoshi FurukawaEiji Fujii
    • Kenji SakakibaraJun SakaiShigeyuki HayashiMichitoshi AkaoSatoshi FurukawaEiji Fujii
    • G03F7/00H04N1/50G01D9/42
    • H04N1/502G03F7/0022H04N1/504G03B2227/325
    • An image recording system including a photosensitive medium having a layer of microcapsules formed on a substrate, each of the microcapsules having a photosensitive resin which is curable upon exposure to a radiation, and a colorless chromogenic material or color former which is capable of chemically reacting with a developer material, to form a visible image. The system further includes an exposing device for forming a latent image on the photosensitive medium according to image signals, by exposure of the medium to the radiation. The latent image is developed into a visible image. A communication device is provided for translating facsimile signals into corresponding picture signals. The facsimile signals are received from a remote facsimile transmitter through a communication channel and represent an image of a subject copy. Control means are connected to the communication device and the exposing device, for applying to the exposing device the picture signals received from the communication device as the image signals, to thereby form on the photosensitive medium the latent image represented by the picture signals.
    • 一种图像记录系统,包括具有在基板上形成的微胶囊层的感光介质,每个微胶囊具有在暴露于辐射时可固化的感光性树脂,以及能够化学反应的无色发色材料或着色剂 一种显影剂材料,以形成可见的图像。 该系统还包括曝光装置,用于通过将介质暴露于辐射,根据图像信号在感光介质上形成潜像。 潜像被发展成可见的图像。 提供一种用于将传真信号转换成对应的图像信号的通信设备。 通过通信信道从远程传真发送器接收传真信号,并表示主体副本的图像。 控制装置连接到通信装置和曝光装置,用于将从通信装置接收的图像信号作为图像信号施加到曝光装置,从而在光敏介质上形成由图像信号表示的潜像。
    • 13. 发明申请
    • CIRCUIT SUBSTRATE HAVING NOISE SUPPRESSION STRUCTURE
    • 具有噪声抑制结构的电路基板
    • US20140049343A1
    • 2014-02-20
    • US14113187
    • 2012-04-25
    • Jun Sakai
    • Jun Sakai
    • H01P7/08
    • H01P7/08H01P1/20345H01P7/082H05K1/0225H05K1/0243H05K1/0253H05K1/165H05K2201/09263H05K2201/09336H05K2201/09781
    • A circuit substrate has three wiring layers, wherein a signal line is formed in a first wiring layer; a ground plane is formed in a second wiring layer; a resonant line is formed in a third wiring layer. A circumferential slit is formed in the ground plane, wherein an island electrode separated from the ground plane is formed inside the slit. The left end of the resonant line is connected to the island electrode through an interlayer-connecting via, while the right end of the resonant line is connected to the ground plane through an interlayer-connecting via. A transmission line (or a microstrip line) is formed using the signal line and the ground plane, and therefore a complex resonator is formed to embrace the transmission line. This achieves band elimination with regard to a signal component of a resonance frequency among signals propagating through the microstrip line. Thus, it is possible to form a noise suppression structure without mounting additional parts on the circuit substrate, and therefore it is possible to effectively eliminate power distribution noise and noise propagating through the signal line with a small and simple configuration.
    • 电路基板具有三个布线层,其中信号线形成在第一布线层中; 在第二布线层中形成接地平面; 在第三布线层中形成谐振线。 在接地平面内形成有周向狭缝,在狭缝内部形成有与接地面分离的岛状电极。 谐振线路的左端通过层间连接通孔连接到岛状电极,而谐振线路的右端通过层间连接通孔连接到接地层。 使用信号线和接地层形成传输线(或微带线),因此形成复数谐振器以包围传输线。 这实现了通过微带线传播的信号中的谐振频率的信号分量的频带消除。 因此,可以形成噪声抑制结构而不在电路基板上安装附加部件,因此可以以简单的结构有效地消除通过信号线传播的功率分配噪声和噪声。
    • 18. 发明申请
    • Analysis method and analysis apparatus
    • 分析方法和分析仪器
    • US20070033564A1
    • 2007-02-08
    • US11473345
    • 2006-06-23
    • Hirobumi InoueDaisuke OhshimaJun SakaiMitsuru Furuya
    • Hirobumi InoueDaisuke OhshimaJun SakaiMitsuru Furuya
    • G06F17/50
    • G06F17/5036G06F2217/40
    • An analysis method of designing transmission lines of an integrated circuit packaging board including an integrated circuit chip, a printed circuit board, and an interposer disposed between the integrated circuit chip and the printed circuit board. A reference data file having information for dividing a series of transmission lines into connecting sections and/or continuous sections and a division model file having information on analysis models of a connecting section and a continuous section is prepared. The connecting sections are extracted from the series of transmission lines with reference to connection information. Boundaries for dividing the series of transmission lines into sections is determined with reference to the reference data file to generate division models. The division models are synthesized to form a synthesized model of the series of transmission lines to analyze electrical characteristics of the series of transmission lines.
    • 包括设置在集成电路芯片和印刷电路板之间的集成电路芯片,印刷电路板和插入器的集成电路封装板的传输线的分析方法。 准备具有用于将一系列传输线分成连接部分和/或连续部分的信息的参考数据文件和具有关于连接部分和连续部分的分析模型的信息的分割模型文件。 参考连接信息,从一系列传输线中提取连接部分。 参考参考数据文件确定将一系列传输线划分为多个部分的边界,以生成分割模型。 合成分割模型以形成一系列传输线的合成模型,以分析一系列传输线的电气特性。