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11. 发明授权

US07125264B2 Connector 有权
标题翻译：连接器
公开(公告)号：US07125264B2
公开(公告)日：2006-10-24
申请号：US10971437
申请日：2004-10-22
申请人： Shigeru Murayama , Masanori Kaneko , Shigeru Matsumura , Takashi Sekizuka , Hiroyuki Hama
发明人： Shigeru Murayama , Masanori Kaneko , Shigeru Matsumura , Takashi Sekizuka , Hiroyuki Hama
IPC分类号： H01R13/648
CPC分类号： H01R24/52 , H01R12/716 , H01R12/721 , H01R12/725 , H01R13/6581 , H01R13/6585 , H01R31/06 , H01R2103/00 , H01R2201/20
摘要： A connector mounted on a board having a plurality of board signal lines for transmitting a signal and a board ground line grounded. Each of the plurality of board signal lines includes a plurality of signal terminals formed in correspondence to each of the signal lines. Each of the signal terminals comprises: a signal core line formed of conductor by extension in the shape of a line; a shield for core line formed of conductor insulated from the signal core line electrically so as to extend in an axis direction of the signal core line and enclose the signal core line; a signal electrode formed by extension from the signal core line for connecting the signal core line with the board signal line corresponding to the signal terminal; and a plurality of ground electrodes extended from the shield for core line and opposed to each other by intervention of the signal electrode for connecting the shield for core line with the board ground line respectively.
摘要翻译：安装在板上的连接器，其具有用于传输信号的多个板信号线和接地的板接地线。多个板信号线中的每一个包括与每个信号线相对应地形成的多个信号端。每个信号端子包括：由导线形成的以线形延伸的信号芯线; 用于芯线的屏蔽，由与信号芯线绝缘的导线形成，以沿信号芯线的轴线方向延伸并包围信号芯线; 由信号芯线延伸形成的信号电极，用于将信号芯线与对应于信号端子的电路板信号线相连; 以及从用于芯线的屏蔽件延伸的多个接地电极，并且分别通过用于将芯线的屏蔽与板接地线连接的信号电极彼此相对。

12. 发明申请

US20050159034A1 Connector, electronic component fixing device, and tester 失效
标题翻译：连接器，电子部件固定装置和测试仪
公开(公告)号：US20050159034A1
公开(公告)日：2005-07-21
申请号：US11009261
申请日：2004-12-09
申请人： Shigeru Murayama , Masanori Kaneko , Fumio Kurotori , Shigeru Matsumura
发明人： Shigeru Murayama , Masanori Kaneko , Fumio Kurotori , Shigeru Matsumura
IPC分类号： G01R31/26 , G01R1/04 , G01R1/073 , G01R31/28 , H01R13/629 , H01R13/631 , H01R13/62
CPC分类号： G01R1/0408 , H01R13/62916
摘要： A connector comprising a plug and a socket being fitted with the plug and further provided with a driving section for fitting the plug and the socket by moving in a first direction substantially perpendicular to the fitting direction of the socket and the plug. The driving section has a first groove part provided in the first direction, and a second groove part provided substantially perpendicular to the first direction. The plug has a first protruding portion engaging with the first groove part, and the socket has a second protruding portion engaging with the first groove part. When the driving section moves in the first direction, the driving section depresses the second protruding portion in the fitting direction at the second groove part to move the socket in the fitting direction, thus fitting the plug in the socket.
摘要翻译：一种连接器，包括插头和插座，所述插头和插座配有所述插头，并且还设置有驱动部分，用于通过沿着与所述插座和所述插头的装配方向大致垂直的第一方向移动来插入所述插头和所述插座。驱动部具有沿第一方向设置的第一槽部和与第一方向大致垂直地设置的第二槽部。插头具有与第一槽部接合的第一突出部，插座具有与第一槽部接合的第二突出部。当驱动部沿第一方向移动时，驱动部在第二槽部处按照嵌合方向按压第二突出部，以使插座沿嵌合方向移动，将插头嵌入插座。

13. 发明授权

US5799502A Absorption type refrigerating apparatus 失效
标题翻译：吸收式制冷装置
公开(公告)号：US5799502A
公开(公告)日：1998-09-01
申请号：US688711
申请日：1996-07-31
申请人： Kazuo Nomura , Tomohiko Kato , Tomonori Tamura , Shigeru Murayama
发明人： Kazuo Nomura , Tomohiko Kato , Tomonori Tamura , Shigeru Murayama
IPC分类号： F25B15/02 , F25B29/00 , F25B37/00
CPC分类号： F25B37/00 , F25B15/02 , F25B29/006 , F25B2315/002 , F25B2315/006 , Y02B30/62
摘要： An absorption type refrigerating apparatus which has a high performance coefficient as an entire apparatus by improving the cooling capacities of the condensation function portion and the absorption function portion and can be reduced in size is constituted such that the cooling function portion 1 for cooling the absorption function portion (absorber) 1 by means of the first heat operation fluid (cooling water) 35a is divided into a plurality of sub-portions such as the cooling pipe 201A, cooling pipe 201H and absorption/heat exchanger 234, the flow passages of the first heat operation fluid 35a are connected to these cooling function sub-portions 201A, 201H and 234 in parallel/series like a route formed by the pipe lines 20, 20A, 20D and 21 and a route formed by the pipe lines 20, 20B, 20C and 21, and the cooling capacity of the cooling pipe 201H is increased by forming a continuous irregular surface 1C on the inner wall of the outer shell 1A of the absorber 1. The above apparatus may be modified such that the cooling pipe 201H is provided inside the absorber 1 and a cooling pipe is replaced for the absorption/heat exchanger 234 and installed inside the absorber 1.
摘要翻译：通过改善冷凝功能部分和吸收功能部分的冷却能力并可以减小尺寸的具有作为整个装置的整个装置的高性能系数的吸收式制冷装置被构成为使得用于冷却吸收功能的冷却功能部分1 通过第一热作用流体（冷却水）35a的部分（吸收体）1被分成多个子部分，例如冷却管201A，冷却管201H和吸收/热交换器234，第一热作业流体35a与管路20,20A，20D，21D所形成的路径并行/串联连接到这些冷却功能子部201A，201H，234以及由管路20,20B，20C形成的路径并且冷却管201H的冷却能力通过在吸收器1的外壳1A的内壁上形成连续的不规则表面1C来增加。上述装置可以将冷却管201H设置在吸收体1的内部，冷却管更换为吸收/热交换器234并安装在吸收体1的内部。

14. 发明授权

US06398570B1 Semiconductor component mounting apparatus 失效
标题翻译：半导体元件安装装置
公开(公告)号：US06398570B1
公开(公告)日：2002-06-04
申请号：US09709553
申请日：2000-11-13
申请人： Kenji Yoshida , Takashi Naito , Shigeru Murayama , Katsuhiko Sakamoto , Takashi Masaki
发明人： Kenji Yoshida , Takashi Naito , Shigeru Murayama , Katsuhiko Sakamoto , Takashi Masaki
IPC分类号： H01R1315
CPC分类号： H05K7/1007 , G01R1/0416 , H01R12/88
摘要： A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor 20 with which the semiconductor component contacts; a substrate 30 which supplies an electric signal to the contactor 20; a plurality of connection components 40, each of which has an electric terminal 48 for supplying the electric signal to the substrate 30 and which is fixed to the substrate 30; a plurality of connectors 50 which has a contact pin 70 including a contact part 74 for contacting with the electric terminal 48 of the connection component 40, a housing 68 for holding the contact pin 70, a pushing part 78 for pushing the contact pin 70 to the electric terminal 48, and which is freely-detachably connected to one of the plurality of the connection components 40; a holder 80 which holds the plurality of the connectors 50, and a fixing part 86 which fixes the holder 80 to the substrate 30, wherein the contact part 74 slides along the electric terminal 48, while contacting with the electric terminal 40, when the pushing part 78 pushes the contact pin 70.
摘要翻译：一种用于安装半导体部件以测试半导体部件的电特性的半导体部件安装装置，包括：半导体部件与其接触的接触器20; 将电信号提供给接触器20的基板30; 多个连接部件40，每个连接部件40具有用于将电信号提供到基板30并且固定到基板30的电端子48; 多个连接器50具有接触销70，该接触销70包括用于与连接部件40的电端子48接触的接触部分74，用于保持接触销70的壳体68，用于将接触销70推到的推动部分78 电气端子48，并且可自由拆卸地连接到多个连接部件40之一; 保持多个连接器50的保持器80和将保持器80固定到基板30的固定部86，其中接触部74在与电端子40接触的同时沿着电端子48滑动，当推动部分78推动接触销70。

15. 发明授权

US06184698B2 Semiconductor component mounting apparatus 有权
标题翻译：半导体元件安装装置
公开(公告)号：US06184698B2
公开(公告)日：2001-02-06
申请号：US09347867
申请日：1999-07-09
申请人： Kenji Yoshida , Takashi Naito , Shigeru Murayama , Katsuhiko Sakamoto , Takashi Masaki
发明人： Kenji Yoshida , Takashi Naito , Shigeru Murayama , Katsuhiko Sakamoto , Takashi Masaki
IPC分类号： G01R3102
CPC分类号： H05K7/1007 , G01R1/0416 , H01R12/88
摘要： A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor 20 with which the semiconductor component contacts; a substrate 30 which supplies an electric signal to the contactor 20; a plurality of connection components 40, each of which has an electric terminal 48 for supplying the electric signal to the substrate 30 and which is fixed to the substrate 30; a plurality of connectors 50 which has a contact pin 70 including a contact part 74 for contacting with the electric terminal 48 of the connection component 40, a housing 68 for holding the contact pin 70, a pushing part 78 for pushing the contact pin 70 to the electric terminal 48, and which is freely-detachably connected to one of the plurality of the connection components 40; a holder 80 which holds the plurality of the connectors 50; and a fixing part 86 which fixes the holder 80 to the substrate 30, wherein the contact part 74 slides along the electric terminal 48, while contacting with the electric terminal 48, when the pushing part 78 pushes the contact pin 70.
摘要翻译：一种用于安装半导体部件以测试半导体部件的电特性的半导体部件安装装置，包括：半导体部件与其接触的接触器20; 将电信号提供给接触器20的基板30; 多个连接部件40，每个连接部件40具有用于将电信号提供到基板30并且固定到基板30的电端子48; 多个连接器50具有接触销70，该接触销70包括用于与连接部件40的电端子48接触的接触部分74，用于保持接触销70的壳体68，用于将接触销70推到的推动部分78 电气端子48，并且可自由拆卸地连接到多个连接部件40之一; 保持多个连接器50的保持器80; 以及固定部分86，其将保持器80固定到基板30，其中当推动部分78推动接触销70时，接触部分74在与电端子48接触的同时沿着电端子48滑动。

16. 发明授权

US4442371A Cooling device for rotary electric machine 失效
标题翻译：旋转电机冷却装置
公开(公告)号：US4442371A
公开(公告)日：1984-04-10
申请号：US436652
申请日：1982-10-25
申请人： Yumiteru Utsunomiya , Shigeru Murayama
发明人： Yumiteru Utsunomiya , Shigeru Murayama
IPC分类号： H02K9/06 , H02K9/00 , H02K3/46
CPC分类号： H02K9/00
摘要： The present invention improves the construction of a cooling ventilation flue for the coil end portion of the stator of a rotary electric machine so as to enhance the cooling effect. That is, the invention provides a cooling device for a rotary electric machine characterized by comprising a ventilation guide which is disposed at the coil end portion of the stator of the rotary electric machine, which divides the stator coil end portion in an axial direction of the rotor of the rotary electric machine into a first ventilating section for advancing cooling air onto an inner peripheral side of the coil end portion and a second ventilating section for advancing the cooling air, having passed through the first ventilating section, onto an outer peripheral side of the coil end portion and which guides the cooling air, having passed through the second ventilating section, into a space surrounding the stator.
摘要翻译：本发明改进了旋转电机的定子的线圈端部的冷却通风烟道的结构，以提高冷却效果。也就是说，本发明提供了一种旋转电机的冷却装置，其特征在于包括：通风引导件，其布置在所述旋转电机的定子的线圈端部处，所述通风引导件沿所述旋转电机的轴向方向分割所述定子线圈端部; 旋转电机的转子转入用于将冷却空气推进到线圈端部的内周侧的第一通风部分和用于将已经通过第一通风部分的冷却空气推进到第二通风部分的外周侧的第二通风部分所述线圈端部将已经穿过所述第二通气部的冷却空气引导到围绕所述定子的空间。

17. 发明授权

US06478596B2 Semiconductor component mounting apparatus 失效
标题翻译：半导体元件安装装置
公开(公告)号：US06478596B2
公开(公告)日：2002-11-12
申请号：US10051825
申请日：2002-01-16
申请人： Kenji Yoshida , Takashi Naito , Shigeru Murayama , Katsuhiko Sakamoto , Takashi Masaki
发明人： Kenji Yoshida , Takashi Naito , Shigeru Murayama , Katsuhiko Sakamoto , Takashi Masaki
IPC分类号： H01R1315
CPC分类号： H05K7/1007
摘要： A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor 20 with which the semiconductor component contacts; a substrate 30 which supplies an electric signal to the contractor 20; a plurality of connection components 40, each of which has an electric terminal 48 for supplying the electric signal to the substrate 30 and which is fixed to the substrate 30; a plurality of connectors 50 which has a contact pin 70 including a contact part 74 for contacting with the electric terminal 48 of the connection component 40, a housing 68 for holding the contact pin 70, a pushing apart 78 for pushing the contact pin 70 to the electric terminal 48, and which is freely-detachably connected to one of the plurality of the connection components 40; a holder 80 which holds the plurality of the connectors 50; and a fixing part 86 which fixes the holder 80 to the substrate 30, wherein the contact part 74 slides along the electric terminal 48, while contacting with the electric terminal 40, when the pushing part 78 pushes the contact pin 70.
摘要翻译：一种用于安装半导体部件以测试半导体部件的电特性的半导体部件安装装置，包括：半导体部件与其接触的接触器20; 向承包商20提供电信号的基板30; 多个连接部件40，每个连接部件40具有用于将电信号提供到基板30并且固定到基板30的电端子48; 多个连接器50具有接触销70，该接触销70包括用于与连接部件40的电端子48接触的接触部分74，用于保持接触销70的壳体68，用于将接触销70推到的推动部分78 电气端子48，并且可自由拆卸地连接到多个连接部件40之一; 保持多个连接器50的保持器80; 以及固定部分86，其将保持器80固定到基板30上，其中当推动部分78推动接触销70时，接触部分74在与电端子40接触的同时沿着电端子48滑动。

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