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    • 17. 发明授权
    • Semiconductor device and process and apparatus of fabricating the same
    • 半导体装置及其制造方法及装置
    • US5880500A
    • 1999-03-09
    • US675595
    • 1996-07-03
    • Hiroshi IwataMasayuki NakanoSeizo Kakimoto
    • Hiroshi IwataMasayuki NakanoSeizo Kakimoto
    • H01L21/033H01L21/265H01L21/28H01L21/336H01L21/8238H01L27/092H01L29/10H01L29/78H01L29/76H01L29/94H01L31/062
    • H01L29/6659H01L21/0332H01L21/26586H01L21/28017H01L21/823807H01L27/0928H01L29/1083H01L29/665H01L29/7833
    • A semiconductor device having a gate electrode on a Si-substrate through a gate oxide film; a first impurity diffusion region having a conductivity type reversed to a well which will form a part of source and drain regions in the two opposing sides of the gate electrode through gate electrode sidewall dielectric films; a second impurity diffusion region having the same conductivity type as the first impurity diffusion region beneath the gate electrode sidewall dielectric film, touching a channel region directly below the gate electrode and being shallower than the first impurity diffusion region; a titanium silicide film on the gate electrode and the surface of the Si-substrate of the first impurity diffusion region in the two opposing sides of the gate electrode sidewall dielectric film; and a third impurity diffusion region, formed in the first impurity diffusion region, having a higher concentration than the first impurity diffusion region and the same conductivity type as the first and second impurity diffusion region. The above semiconductor device is able to suppress the short-channel effects, and reduce the source-drain parasitic resistance and the source-drain junction leakage current while maintaining a small source-drain capacity.
    • 一种通过栅极氧化膜在Si衬底上具有栅电极的半导体器件; 具有与阱相反的导电类型的第一杂质扩散区,其将通过栅电极侧壁电介质膜在栅电极的两个相对侧中形成源区和漏区的一部分; 第二杂质扩散区,与栅电极侧壁电介质膜下方的第一杂质扩散区具有相同的导电类型,与栅电极正下方的沟道区相比,比第一杂质扩散区浅; 所述栅极电极上的钛硅化物膜和所述栅电极侧壁电介质膜的两个相对侧中的所述第一杂质扩散区域的所述Si衬底的表面; 和形成在第一杂质扩散区中的第三杂质扩散区,其具有比第一杂质扩散区高的浓度和与第一和第二杂质扩散区相同的导电类型。 上述半导体器件能够抑制短沟道效应,并且在保持较小的源极 - 漏极容量的同时降低源极 - 漏极寄生电阻和源极 - 漏极结漏电流。
    • 20. 发明授权
    • Semiconductor device and method of manufacture thereof
    • 半导体装置及其制造方法
    • US06426532B1
    • 2002-07-30
    • US09720714
    • 2001-04-19
    • Hiroshi IwataSeizo KakimotoMasayuki NakanoKouichiro Adachi
    • Hiroshi IwataSeizo KakimotoMasayuki NakanoKouichiro Adachi
    • H01L31119
    • H01L29/783H01L21/84H01L29/66628H01L29/66772H01L29/78615H01L29/78618H01L29/78654
    • A semiconductor device according to the present invention includes a semiconductor substrate; device isolation regions provided in the semiconductor substrate; a first conductivity type semiconductor layer provided between the device isolation regions; a gate insulating layer provided on an active region of the first conductivity type semiconductor layer; a gate electrode provided on the gate insulating layer; gate electrode side wall insulating layers provided on side walls of the gate electrode; and second conductivity type semiconductor layers provided adjacent to the gate electrode side wall insulating layers so as to cover a portion of the corresponding device isolation region, the second conductivity type semiconductor layers acting as a source region and/or a drain region. The gate electrode and the first conductivity type semiconductor layer are electrically connected to each other. The second conductivity type semiconductor layers are provided above the first conductivity type semiconductor layer and have a thickness which gradually increases from the device isolation region toward the gate electrode.
    • 根据本发明的半导体器件包括半导体衬底; 设置在半导体衬底中的器件隔离区; 设置在所述器件隔离区之间的第一导电型半导体层; 设置在所述第一导电型半导体层的有源区上的栅极绝缘层; 设置在所述栅极绝缘层上的栅电极; 设置在栅电极的侧壁上的栅电极侧壁绝缘层; 以及与栅电极侧壁绝缘层相邻设置以覆盖对应的器件隔离区的一部分的第二导电类型半导体层,作为源区和/或漏区的第二导电类型半导体层。 栅电极和第一导电类型半导体层彼此电连接。 第二导电类型半导体层设置在第一导电类型半导体层之上,并且具有从器件隔离区朝向栅极电极逐渐增加的厚度。