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    • 12. 发明授权
    • Device for mixing a flowable or pourable medium, especially a highly viscous medium
    • 用于混合可流动或可倾倒的介质,特别是高粘度介质的装置
    • US06921194B2
    • 2005-07-26
    • US10432046
    • 2001-11-15
    • Hans Weber
    • Hans Weber
    • B01F7/16B01F7/00B01F15/00B01F7/20
    • B01F7/00558B01F7/00591
    • A device for mixing a flowable or pourable medium has a container for receiving the medium and a rotatable shaft having radially projecting support arms and rotatable in a direction of rotation. Mixing elements are connected to the radially projecting support arms. The mixing elements are tubular and formed as coil-shaped spirals conically shaped at least across a partial length of the coil-shaped spirals. The coil-shaped spirals have a first end face and a second end face. The first end face points in the direction of rotation and has a cross-section greater than the cross-section of the second end face. The coil-shaped spirals have a central axis having a slant angle relative to a plane of rotation of the two mixing elements. The support arms and the coil-shaped spirals connected to the support arms, respectively, are formed of a single wire as a monolithic part, respectively.
    • 用于混合可流动或可流动的介质的装置具有用于接收介质的容器和具有径向突出的支撑臂并可沿旋转方向旋转的可旋转轴。 混合元件连接到径向突出的支撑臂。 混合元件是管状的,并且形成为至少跨越螺旋形螺旋的部分长度的圆锥形状的线圈形螺旋形。 线圈状螺旋具有第一端面和第二端面。 第一端面指向旋转方向,并且其横截面大于第二端面的横截面。 线圈形螺旋具有相对于两个混合元件的旋转平面具有倾斜角的中心轴线。 分别连接到支撑臂的支撑臂和线圈状螺旋分别由作为整体部件的单线形成。
    • 15. 发明授权
    • Charge compensation semiconductor device
    • 充电补偿半导体器件
    • US08742550B2
    • 2014-06-03
    • US13541884
    • 2012-07-05
    • Hans WeberFranz Hirler
    • Hans WeberFranz Hirler
    • H01L21/02
    • H01L29/7802H01L29/0634H01L29/0696H01L29/0878H01L29/1095H01L29/407H01L29/408H01L29/41766H01L29/66727H01L29/7816
    • A semiconductor device is provided. The semiconductor device includes a semiconductor body and a source metallization which is arranged on the semiconductor body. The semiconductor body includes in a cross-section a drift region of a first conductivity type, a first body region of a second conductivity type which adjoins the drift region, a first compensation region of the second conductivity type which adjoins the first body region, has a lower maximum doping concentration than the first body region and forms a first pn-junction with the drift region, and a first charge trap. The first charge trap adjoins the first compensation region and includes a field plate and an insulating region which adjoins the drift region and partly surrounds the field plate. The source metallization is arranged in resistive electric connection with the first body region. Further, a method for producing a semiconductor device is provided.
    • 提供半导体器件。 半导体器件包括半导体本体和布置在半导体本体上的源极金属化。 半导体本体包括第一导电类型的漂移区域,邻接漂移区域的第二导电类型的第一体区域,邻接第一体区域的第二导电类型的第一补偿区域具有 比第一体区低的最大掺杂浓度,并与漂移区形成第一pn结,以及第一电荷阱。 第一电荷陷波器与第一补偿区域相邻并且包括场板和与漂移区域相邻并部分地围绕场板的绝缘区域。 源极金属化被布置成与第一体区电阻电连接。 此外,提供了一种用于制造半导体器件的方法。
    • 17. 发明申请
    • METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE INCLUDING A DIELECTRIC LAYER
    • 用于生产包括介电层的半导体器件的方法
    • US20130005101A1
    • 2013-01-03
    • US13173872
    • 2011-06-30
    • Hans WeberFranz HirlerAndreas Peter Meiser
    • Hans WeberFranz HirlerAndreas Peter Meiser
    • H01L21/336
    • H01L29/7813H01L29/0653H01L29/407H01L29/66734
    • A method for producing a semiconductor device with a dielectric layer includes: providing a semiconductor body with a first trench extending into the semiconductor body, the first trench having a bottom and a sidewall; forming a first dielectric layer on the sidewall in a lower portion of the first trench; forming a first plug in the lower portion of the first trench so as to cover the first dielectric layer, the first plug leaving an upper portion of the sidewall uncovered; forming a sacrificial layer on the sidewall in the upper portion of the first trench; forming a second plug in the upper portion of the first trench; removing the sacrificial layer, so as to form a second trench having sidewalls and a bottom; and forming a second dielectric layer in the second trench and extending to the first dielectric layer.
    • 一种制造具有电介质层的半导体器件的方法包括:向半导体本体提供延伸到半导体本体中的第一沟槽,第一沟槽具有底部和侧壁; 在所述第一沟槽的下部的所述侧壁上形成第一电介质层; 在所述第一沟槽的下部形成第一插头以覆盖所述第一介电层,所述第一插头离开所述侧壁的上部未被覆盖; 在所述第一沟槽的上部的侧壁上形成牺牲层; 在所述第一沟槽的上部形成第二插头; 去除所述牺牲层,以便形成具有侧壁和底部的第二沟槽; 以及在所述第二沟槽中形成第二电介质层并延伸到所述第一电介质层。
    • 20. 发明申请
    • Flatbed Die-Cutting Press For Cutting Shapes In Sheets Of Foldable Paper Or Board Material
    • 平板式切割机用于在折叠纸或板材料的片材中切割形状
    • US20120085210A1
    • 2012-04-12
    • US13375936
    • 2010-06-17
    • Stephan WyssHans Weber
    • Stephan WyssHans Weber
    • B26D7/06
    • B26D7/1863B26F1/40B26F1/44Y10T83/0448Y10T83/2074
    • A flatbed die-cutting press (10) for cutting detailed shapes in sheets (20) of foldable paper or board material that are typically fed at a rate of 6000 to 14000 sheets/hour, comprises a cutting tool assembly (40) having an apertured female die part (42) with a series of apertures (44) defining typically a complex shape or shapes to be cut out. The female die part (42) is associated with a suction channel (46) arranged so that parts (22) that are cut out of the sheets (20) are removable by suction through the apertures (44). This enables the cutting of small shapes and complex shapes whose outline extends over an area of at least several square centimeters that contains a group of cut-outs comprising a plurality of straight or curved lines or strokes all having a section less than 2 mm, possibly less than 1 mm, along all or a substantial part of their length, for the mass production of blanks of paper or board material particularly cigarette packages, where the cut-outs form an emblem on the package.
    • 用于切割通常以6000-14000张/小时的速率进给的可折叠纸或板材的片材(20)中的详细形状的平板模切机(10)包括具有孔径的切割工具组件(40) 阴模部分(42)具有一系列通常形成待切割的形状或形状的孔(44)。 阴模部分(42)与吸入通道(46)相关联,所述抽吸通道(46)被布置成使得从所述片材(20)切出的部分(22)可通过所述孔(44)抽吸而被移除。 这使得能够切割小形状和复杂形状,其轮廓在至少几平方厘米的区域上延伸,该区域包含一组切口,所述切口包括多个直线或曲线或全部具有小于2mm的截面的切口 小于1毫米,长度大体上部分或大部分,用于大量生产纸张或纸板材料,特别是卷烟包装,其中切口在包装上形成标志。