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11. 发明申请

US20110226415A1 Pressure-Sensitive Adhesive Mass 审中-公开
标题翻译：压敏粘合剂质量
公开(公告)号：US20110226415A1
公开(公告)日：2011-09-22
申请号：US12995393
申请日：2009-12-04
申请人： Marc Husemann , Thorsten Krawinkel , Daniel Klier
发明人： Marc Husemann , Thorsten Krawinkel , Daniel Klier
IPC分类号： C09J151/06 , C08K5/07
CPC分类号： C09J153/005 , B32B17/10 , B32B2367/00 , C08L57/02 , C08L2205/02 , C08L2312/00 , C08L2666/02 , C09J151/006 , C09J153/025
摘要： The present invention relates to the use of an adhesive mass at least containing an acid-anhydride-modified vinyl aromatic block copolymer, a metal chelate, and an adhesive resin for bonding optical components, particularly optical films, wherein the adhesive mass has a transmittance greater than 86% and a haze less than 5%.
摘要翻译：本发明涉及至少含有酸酐改性的乙烯基芳族嵌段共聚物，金属螯合物和粘合剂树脂粘合光学组件，特别是光学膜的粘合剂的用途，其中粘合剂质量具有更大的透射率超过86％，雾度小于5％。

12. 发明申请

US20100000653A1 HEAT-ACTIVABLE ADHESIVE TAPE PARTICULARLY FOR BONDING ELECTRONIC COMPONENTS AND CONDUCTOR TRACKS 审中-公开
标题翻译：特殊用于粘合电子元件和导体轨道的热活性胶带
公开(公告)号：US20100000653A1
公开(公告)日：2010-01-07
申请号：US12440408
申请日：2007-09-24
申请人： Thorsten Krawinkel , Christian Ring , Sevil Ece
发明人： Thorsten Krawinkel , Christian Ring , Sevil Ece
IPC分类号： B32B37/02 , C08L77/00 , C08K5/12 , C08K3/32
CPC分类号： H05K3/386 , C09J7/10 , C09J2463/00 , C09J2477/00 , H05K1/0393 , Y10T156/10
摘要： Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of a) a polyamide having terminal amino and/or acid groups, b) an epoxy resin, c) if desired, a plasticizer, the polyamide reacting with the epoxy resin at temperatures of at least 150° C., and the ratio in weight fractions of a) to b) lying between 50:50 to 99:1.
摘要翻译：特别是用于制造和进一步加工电子部件和导体轨道的热固性胶带，其中至少具有a）具有末端氨基和/或酸基的聚酰胺的粘合剂，b）环氧树脂，c）如果需要，增塑剂，聚酰胺在至少150℃的温度下与环氧树脂反应，a）至b）的重量比例在50:50至99:1之间。

13. 发明申请

US20090277561A1 PRESSURE-SENSITIVE ADHESIVE TAPES FOR BONDING PRINTING PLATES AND METHODS OF PROVIDING THEM 审中-公开
标题翻译：用于粘合印刷板的压敏粘合带及其提供方法
公开(公告)号：US20090277561A1
公开(公告)日：2009-11-12
申请号：US12434707
申请日：2009-05-04
申请人： Kai Ellringmann , Christian Ring , Thorsten Krawinkel , Jochen Fiencke
发明人： Kai Ellringmann , Christian Ring , Thorsten Krawinkel , Jochen Fiencke
IPC分类号： B32B37/12 , B32B7/12 , C09J7/02
CPC分类号： B41N6/02 , B32B5/145 , B32B5/147 , B32B5/18 , B32B7/12 , B32B27/065 , B32B27/08 , B32B27/10 , B32B27/16 , B32B27/304 , B32B27/32 , B32B27/36 , B32B29/007 , B32B2255/10 , B32B2255/12 , B32B2255/26 , B32B2266/0235 , B32B2266/025 , B32B2266/0278 , B32B2305/022 , B32B2307/308 , B32B2307/31 , B32B2307/51 , B32B2307/518 , B32B2405/00 , C09J7/29 , C09J7/387 , C09J2201/128 , C09J2400/243 , C09J2453/00 , C09J2493/00 , C09J2499/00 , Y10T156/10 , Y10T428/249983
摘要： The invention relates to the use of a pressure-sensitive adhesive comprising at least one resin-polymer blend of at least 50% by weight of one or more block copolymers comprising polymer blocks based on vinylaromatics and comprising polymer blocks based on 1,3-dienes and not more than 50% by weight of at least one tackifier resin for an adhesive tape for bonding flexible printing plates to printing cylinders or printing sleeves.
摘要翻译：本发明涉及使用包含至少一种树脂 - 聚合物共混物的至少一种树脂 - 聚合物共混物，至少50重量％的一种或多种嵌段共聚物包含基于乙烯基芳烃的聚合物嵌段，并包含基于1,3-二烯的聚合物嵌段和至多50重量％的至少一种用于将柔性印版接合到印刷滚筒或印刷套筒的粘合带的增粘树脂。

14. 发明申请

US20070270553A1 MASKING OF WINDOW FLANGES WITH AN ADHESIVE TAPE COMPRISING A SELF-ADHESIVE COMPOSITION BASED ON CROSSLINKED VINYLAROMATIC BLOCK COPOLYMERS 审中-公开
标题翻译：具有包含基于交联的乙烯基嵌段共聚物的自粘组合物的粘合带的窗口法兰
公开(公告)号：US20070270553A1
公开(公告)日：2007-11-22
申请号：US11750585
申请日：2007-05-18
申请人： Nicolai Bohm , Thorsten Krawinkel
发明人： Nicolai Bohm , Thorsten Krawinkel
IPC分类号： C08L53/00 , C08F297/00
CPC分类号： C08L53/02 , C08L51/006 , C08L2666/02 , C09J7/387 , C09J151/006 , C09J153/02
摘要： Use of an adhesive tape for masking substrates, especially substrates coated with cathodic electrocoat (CED) material, more preferably window flanges, with a single-layer or multi-layer backing and applied to one side thereof a self-adhesive composition comprising metal chelate-crosslinkable vinylaromatic block copolymers, preferably styrene block copolymers, which are blended at least with one or more tackifier resins, the vinylaromatic block copolymers being at least partly acid-modified or acid anhydride-modified.
摘要翻译：使用粘合带用于掩蔽基材，特别是用阴极电泳涂层（CED）材料涂覆的基材，更优选窗玻璃凸缘，其具有单层或多层背衬，并将一层包含金属螯合物的自粘合组合物施加到其一侧，可交联乙烯基芳族嵌段共聚物，优选苯乙烯嵌段共聚物，其至少与一种或多种增粘树脂共混，所述乙烯基芳族嵌段共聚物至少部分地被酸改性或酸酐改性。

15. 发明授权

US07121515B2 Redetachable device 有权
标题翻译：可重新装置
公开(公告)号：US07121515B2
公开(公告)日：2006-10-17
申请号：US10014484
申请日：2001-12-11
申请人： Achim Franck , Andreas Junghans , Bernd Lühmann , Thorsten Krawinkel
发明人： Achim Franck , Andreas Junghans , Bernd Lühmann , Thorsten Krawinkel
IPC分类号： C09J7/02
CPC分类号： A47G1/175 , C09J7/20 , C09J2201/128 , C09J2201/618 , C09J2201/622 , Y10T428/14 , Y10T428/1452 , Y10T428/1476 , Y10T428/1486 , Y10T428/24017 , Y10T428/24793 , Y10T428/28
摘要： A redetachable self-adhesive device a) whose reverse face is bonded with a strip of a double-sidedly adhering adhesive sheet in such a way that one end of the adhesive sheet projects beyond the device as a grip tab, b) the adhesive sheet is such that the bond made with it is redetachable by stretching pulling on the grip tab of the strip in the direction of the bond plane, wherein c) on its reverse face (2) the device (1), in the region (3A, 3B) situated against the grip tab (6) of the adhesive sheet strip (5) or and also partly against the free adhesive composition, has an average roughness Ra of 0.4–25 μm.
摘要翻译：一种可重新切割的自粘装置a），其反面与双面粘合粘合片的条带粘合，使得粘合片的一端突出超过装置作为夹紧片，b）粘合片是使得与其形成的接合可以通过在接合平面的方向上拉伸在带的夹持片上来重新进行，其中c）在其反面（2）上的装置（1）中，在区域（3A， 3）位于粘合片条（5）的夹紧片（6）上，或部分地抵靠游离粘合剂组合物的平均粗糙度R a a为0.4〜25μm。

16. 发明授权

US09688886B2 Heat-activable and crosslinkable adhesive tape for bonding electronic components and conductor tracks 有权
公开(公告)号：US09688886B2
公开(公告)日：2017-06-27
申请号：US11169124
申请日：2005-06-28
申请人： Christian Ring , Thorsten Krawinkel
发明人： Christian Ring , Thorsten Krawinkel
IPC分类号： C09J7/00 , C09J153/02
CPC分类号： C09J7/00 , C08L2666/24 , C09J7/10 , C09J153/025 , C09J2453/00
摘要： Heat-activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composed at least of: a) an acid-modified or acid-anhydride-modified vinylaromatic block copolymer and b) an epoxidized vinylaromatic block copolymer.

17. 发明授权

US08932396B2 Solution, in particular for pretreating a hydrophilic subsurface in order to improve an adhesive bond under humid and wet conditions 有权
标题翻译：解决方案，特别是用于预处理亲水的表面，以改善在湿润和潮湿条件下的粘结
公开(公告)号：US08932396B2
公开(公告)日：2015-01-13
申请号：US13148109
申请日：2010-01-22
申请人： Thorsten Krawinkel
发明人： Thorsten Krawinkel
IPC分类号： C09J5/02 , C09K3/18
CPC分类号： C09J5/02 , C09J2483/003 , C09K3/18
摘要： The invention relates to a solution, in particular for pre-treating a hydrophilic surface for hydrophobization, comprising: I. at least one silane of the formula (1) where R1, R2, R3 independently of one another are selected from the group consisting of methyl, ethyl, 2-methoxyethyl, propyl and i-propyl, butyl, benzyl m=0 or 1, n=3 to 12, p=1 or 2, and, for p=1, Y=a functional group selected from the group consisting of (meth)alkyl, (meth)acryloxy, mercapto, ureido, —NH—CH2—CH2-NR4R5 and —NR4R5 (where R4 and R5 independently of one another are selected from the group consisting of H, alkyl, phenyl, benzyl, cycloalkyl), or, for p=2, Y=NH; and II. at least one second silane increasing the aging stability having no more than two carbon atoms bound to the silicon in a chain.
摘要翻译：本发明涉及一种特别是用于预处理亲水表面以进行疏水化的溶液，其包括：I.至少一种式（1）的硅烷，其中R 1，R 2，R 3彼此独立地选自甲基，乙基，2-甲氧基乙基，丙基和异丙基，丁基，苄基，m = 0或1，n = 3〜12，p = 1或2，对于p = 1，Y =选自由（甲基）烷基，（甲基）丙烯酰氧基，巯基，脲基，-NH-CH2-CH2-NR4R5和-NR4R5（其中R4和R5彼此独立地选自H，烷基，苯基，苄基，环烷基），或对于p = 2，Y = NH; 和II。至少一个第二硅烷增加具有不超过两个与链中的硅结合的碳原子的老化稳定性。

18. 发明授权

US08460969B2 Method for encapsulating an electronic arrangement 有权
标题翻译：封装电子装置的方法
公开(公告)号：US08460969B2
公开(公告)日：2013-06-11
申请号：US12996716
申请日：2009-11-18
申请人： Thorsten Krawinkel , Klaus Keite-Telgenbüscher , Jan Ellinger , Alexander Steen
发明人： Thorsten Krawinkel , Klaus Keite-Telgenbüscher , Jan Ellinger , Alexander Steen
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L51/5246 , C03C27/10 , C08L2666/02 , C09J153/00 , C09J153/005 , C09J153/02 , C09J153/025 , Y10T428/28 , Y10T428/2852
摘要： Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.
摘要翻译：用于将电子装置封装在渗透物中的方法，其中将基于丁烯嵌段共聚物的压敏粘合剂物质施加到待包封的电子装置的区域周围。

19. 发明申请

US20110120615A1 RADIATION-CROSSLINKABLE FOAMED SELF-ADHESIVE BASED ON VINYLAROMATIC BLOCK COPOLYMERS 审中-公开
标题翻译：基于乙烯基嵌段共聚物的辐射可交联泡沫自粘胶
公开(公告)号：US20110120615A1
公开(公告)日：2011-05-26
申请号：US12994503
申请日：2009-11-02
申请人： Franziska Zmarsly , Thorsten Krawinkel , Axel Burmeister , Sabine Thormeier
发明人： Franziska Zmarsly , Thorsten Krawinkel , Axel Burmeister , Sabine Thormeier
IPC分类号： B29C65/52
CPC分类号： C09J153/02 , C08K7/22 , C08L7/00 , C08L9/00 , C08L23/0853 , C08L57/02 , C08L2203/14 , C08L2205/20 , C08L2666/02 , Y10T156/10
摘要： Self-adhesive consisting of a mixture having at least one tackifier resin, expanded polymeric microbeads and a polymer blend made up of thermoplastic and/or non-thermoplastic elastomers with at least one vinylaromatic block copolymer containing a fraction of more than 30% by weight of 1,2-linked diene in the elastomer block.
摘要翻译：由具有至少一种增粘树脂的混合物，膨胀聚合物微珠和由热塑性和/或非热塑性弹性体组成的聚合物共混物与至少一种乙烯基芳族嵌段共聚物组成的自粘合剂，所述乙烯基芳族嵌段共聚物含有大于30重量％弹性体嵌段中的1,2-连接二烯。

20. 发明申请

US20100068514A1 METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT 有权
标题翻译：封装电子装置的方法
公开(公告)号：US20100068514A1
公开(公告)日：2010-03-18
申请号：US12549767
申请日：2009-08-28
申请人： Jan Ellinger , Thorsten Krawinkel , Klaus Keite-Telgenbüscher , Anja Staiger
发明人： Jan Ellinger , Thorsten Krawinkel , Klaus Keite-Telgenbüscher , Anja Staiger
IPC分类号： B32B27/06 , B32B37/14 , C09J153/00 , B05D5/12
CPC分类号： H01L51/5246 , C08L2666/02 , C09J153/02 , C09J153/025 , Y10T428/2835
摘要： The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.
摘要翻译：本发明涉及一种用于将电子装置封装在透气体中的方法，其中提供了基于乙烯基芳族嵌段共聚物的压敏粘合剂组合物，其中将压敏粘合剂组合物施加到和/ 要封装的电子装置。

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