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    • 11. 发明授权
    • Apparatus for bevelling wafer-edge
    • 倾斜晶圆边缘装置
    • US5538463A
    • 1996-07-23
    • US156829
    • 1993-11-24
    • Fumihiko HasegawaTatsuo OhtaniYasuyoshi Kuroda
    • Fumihiko HasegawaTatsuo OhtaniYasuyoshi Kuroda
    • B24B9/06B24B49/16B24B5/00
    • B24B9/065B24B49/16
    • An apparatus for bevelling the edge of a wafer, comprising a framework, a table rotatably mounted to the framework and capable of holding down the wafer, a buff rotatably mounted to the framework opposite the table and having a formed groove for bevelling the wafer edge, an air cylinder assembly mounted to the framework and pressing the buff by different forces on the orientation flat, the circular edge and the round joints of the wafer held down by the table, a sensor sensing the orientation flat, the circular edge and the round joints of the wafer held down by the table and producing corresponding signals, and a control controlling the air cylinder assembly to select between the forces in response to the signals. The apparatus may comprise a grooving cutter assembly removably held by the table, a lock locking the rotation of the table when the apparatus produces the formed groove in the buff, and a stopper stopping the air cylinder assembly and positioning the cutter assembly relative to the buff.
    • 一种用于斜切晶片边缘的装置,包括框架,可旋转地安装到框架并能够保持晶片的台子,可旋转地安装到与桌子相对的框架上的抛光轮,并具有用于斜切晶片边缘的形成的凹槽, 安装到框架上的气缸组件,并且通过由定位平面,圆形边缘和由桌子压下的晶片的圆形接头上的不同的力来挤压凸轮,感测定向平面,圆形边缘和圆形接头的传感器 并且产生对应的信号,以及控制气缸组件以响应于信号在力之间进行选择的控制。 该设备可以包括可移动地由工作台保持的切槽刀具组件,当设备在抛光器中产生形成的凹槽时锁定桌子的旋转,并且止动器阻止气缸组件并且相对于凸轮定位刀具组件 。