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11. 发明申请

US20080173398A1 LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD 有权
标题翻译：低温接合材料和粘接方法
公开(公告)号：US20080173398A1
公开(公告)日：2008-07-24
申请号：US11964827
申请日：2007-12-27
申请人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
发明人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
IPC分类号： B32B5/16 , B29C65/02
CPC分类号： H05K3/321 , B22F1/0014 , B22F1/0062 , B22F3/14 , B22F2003/145 , B23K35/22 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/40 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/83 , H01L25/072 , H01L2224/29007 , H01L2224/29101 , H01L2224/2919 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/32225 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/2076 , H05K2201/0224 , H05K2201/0257 , H05K2201/0266 , Y10T428/12028 , Y10T428/12181 , Y10T428/2991 , Y10T428/8305 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2224/83205 , H01L2924/00012
摘要： A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
摘要翻译：包含涂覆有碳原子数为2〜8的有机物质的金属粒子的接合材料，其中所述金属粒子包含100nm以下的第一部分，大于100nm但不大于100μm的第二部分，基于体积基数具有至少峰值分布的部分。本公开还涉及使用接合材料的接合方法。

12. 发明申请

US20130119322A1 CONDUCTIVE SINTERED LAYER FORMING COMPOSITION 审中-公开
标题翻译：导电烧结成型组合物
公开(公告)号：US20130119322A1
公开(公告)日：2013-05-16
申请号：US13737300
申请日：2013-01-09
申请人： Eiichi Ide , Toshiaki Morita , Yusuke Yasuda , Hiroshi Hozoji
发明人： Eiichi Ide , Toshiaki Morita , Yusuke Yasuda , Hiroshi Hozoji
IPC分类号： H01B1/02
CPC分类号： H01B1/02 , B22F7/04 , H01B1/08 , H01L23/3735 , H01L23/3737 , H01L24/29 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/91 , H01L2224/27334 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/32225 , H01L2224/32245 , H01L2224/37147 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45147 , H01L2224/48247 , H01L2224/49175 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/8484 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/13091 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/2076 , H05K1/097 , H05K3/321 , H05K2201/0224 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2224/83205 , H01L2924/00012
摘要： There is provided a conductive sintered layer forming composition and a conductive sintered layer forming method that can lower heating temperature and shorten heating time for a process of accelerating sintering or bonding by sintering of metal nano-particles coated with an organic substance. The conductive sintered layer forming composition may be obtained by utilizing a phenomenon that particles may be sintered at low temperature by mixing silver oxide with metal particles coated with the organic substance and having a grain size of 1 nm to 5 μm as compared to sintering each simple substance. The conductive sintered layer forming composition of the invention is characterized in that it contains the metal particles whose surface is coated with the organic substance and whose grain size is 1 nm to 5 μm and the silver oxide particles.
摘要翻译：提供一种导电烧结层形成组合物和导电烧结层形成方法，其可以通过烧结具有有机物质的金属纳米颗粒的烧结来加速烧结或接合的过程，从而降低加热温度并缩短加热时间。形成导电烧结层的组合物可以通过利用颗粒可以通过将氧化银与涂覆有机物质的金属颗粒混合并且与烧结相比具有1nm至5μm的颗粒尺寸而在低温下烧结的现象获得物质。本发明的导电性烧结层形成用组合物的特征在于，其含有表面被有机物质覆盖，粒径为1nm〜5μm的金属粒子和氧化银粒子。

13. 发明授权

US07955411B2 Low temperature bonding material comprising metal particles and bonding method 有权
标题翻译：包含金属颗粒的低温粘合材料和粘合方法
公开(公告)号：US07955411B2
公开(公告)日：2011-06-07
申请号：US11964827
申请日：2007-12-27
申请人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
发明人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
IPC分类号： B32B5/16 , B22F1/02
CPC分类号： H05K3/321 , B22F1/0014 , B22F1/0062 , B22F3/14 , B22F2003/145 , B23K35/22 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/40 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/83 , H01L25/072 , H01L2224/29007 , H01L2224/29101 , H01L2224/2919 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/32225 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/2076 , H05K2201/0224 , H05K2201/0257 , H05K2201/0266 , Y10T428/12028 , Y10T428/12181 , Y10T428/2991 , Y10T428/8305 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2224/83205 , H01L2924/00012
摘要： A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
摘要翻译：一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分，基于体积基数具有至少峰值分布的部分。本公开还涉及使用接合材料的接合方法。

14. 发明申请

US20090244868A1 Semiconductor device and bonding material 失效
标题翻译：半导体器件和接合材料
公开(公告)号：US20090244868A1
公开(公告)日：2009-10-01
申请号：US12379644
申请日：2009-02-26
申请人： Toshiaki Morita , Yusuke Yasuda , Eiichi Ide
发明人： Toshiaki Morita , Yusuke Yasuda , Eiichi Ide
IPC分类号： H05K7/00 , H01B1/08 , H05K1/09 , H01L23/522
CPC分类号： H01L23/488 , C04B37/026 , C04B2237/06 , C04B2237/124 , C04B2237/125 , C04B2237/368 , H01L23/047 , H01L23/24 , H01L24/29 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/73 , H01L24/83 , H01L24/84 , H01L25/072 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/29347 , H01L2224/32225 , H01L2224/325 , H01L2224/371 , H01L2224/37147 , H01L2224/37599 , H01L2224/40091 , H01L2224/40225 , H01L2224/45124 , H01L2224/48227 , H01L2224/49113 , H01L2224/49175 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83205 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19107 , H01L2924/351 , H05K1/09 , H05K3/321 , H05K2203/1131 , H01L2924/00 , H01L2924/00012
摘要： The present invention is directed to enhancing the bonding reliability of a bonding portion between an Al electrode of a semiconductor device and a bonding material having metal particles as a main bonding agent. In the semiconductor device, a semiconductor element and an Al electrode are connected to each other with a bonding layer made of Ag or Cu interposed therebetween, and the bonding layer and the Al electrode are bonded to each other with an amorphous layer interposed therebetween. It is possible to obtain excellent bonding strength to the Al electrode by performing a bonding process in atmospheric air by using a bonding material including a metal oxide particle with an average diameter of 1 nm to 50 μm, an acetic acid- or formic acid-based compound, and a reducing agent made of an organic material.
摘要翻译：本发明旨在提高半导体器件的Al电极和具有金属粒子的接合材料作为主要粘合剂的接合部分的接合可靠性。在半导体器件中，半导体元件和Al电极通过其间插入有Ag或Cu的接合层彼此连接，并且接合层和Al电极通过非晶层彼此接合。通过使用包含平均直径为1nm〜50μm的金属氧化物粒子的接合材料，以乙酸或甲酸为基准的粘合剂，通过在大气中进行接合处理，能够对Al电极获得优异的接合强度化合物和由有机材料制成的还原剂。

15. 发明授权

US06812969B2 Digital camera 失效
标题翻译：数码相机
公开(公告)号：US06812969B2
公开(公告)日：2004-11-02
申请号：US10355255
申请日：2003-01-31
申请人： Eiichi Ide , Mutsuhiro Yamanaka
发明人： Eiichi Ide , Mutsuhiro Yamanaka
IPC分类号： H04N5222
CPC分类号： G02B7/28 , H04N5/23209 , H04N5/23212
摘要： Provided is a digital camera in which the user can easily recognize that an image is out of focus by viewing a display image. At the time of live view display, image capturing is performed every predetermined time in an image capturing unit 3 and images for live view display are successively recorded on an image memory 209. An evaluation value computing unit 230 in an overall control unit 211 obtains an image stored in the image memory 209 and calculates an evaluation value indicative of the focus state of the image. A display image control unit 240 obtains the evaluation value, determines a focus state of the image, and controls a process to be performed by a display image processing unit 250 in accordance with the result of determination. When the image is out of focus, an image quality degrading process is performed in the display image processing unit 250 and an image of low image quality is displayed on a display 10.
摘要翻译：提供了一种数字照相机，其中用户可以通过观看显示图像来容易地识别图像失焦。在实时取景显示时，在图像捕获单元3中每隔预定时间执行图像捕获，并且图像存储器209连续地记录用于实况显示的图像。总体控制单元211中的评估值计算单元230获得存储在图像存储器209中的图像，并计算表示图像的聚焦状态的评价值。显示图像控制单元240获得评估值，确定图像的聚焦状态，并且根据确定结果控制由显示图像处理单元250执行的处理。当图像失焦时，在显示图像处理单元250中执行图像质量降级处理，并且在显示器10上显示低图像质量的图像。

16. 发明授权

US06411918B1 Method and apparatus for inputting three-dimensional data 失效
标题翻译：用于输入三维数据的方法和装置
公开(公告)号：US06411918B1
公开(公告)日：2002-06-25
申请号：US09455536
申请日：1999-12-07
申请人： Eiichi Ide , Hiroshi Uchino
发明人： Eiichi Ide , Hiroshi Uchino
IPC分类号： G01B1100
CPC分类号： G01B11/2545
摘要： A three-dimensional data input apparatus has a first and a second modes. In the first mode, images of an object are taken from two view points being apart from each other, the position of the object is calculated with high accuracy in accordance with the distance between the view points and the directions from each view point to the irradiated part of the object by the method of triangulation, and the calculated data or the data for calculation is output. In the second mode, the position of a part of the object is calculated in accordance with the irradiation angle and the reception angle in the same way as the conventional method of triangulation. In the first mode that does not use the irradiation angle information for calculating the position.
摘要翻译：三维数据输入装置具有第一和第二模式。在第一模式中，从彼此分离的两个视点中取出对象的图像，根据观察点与从每个视点到被照射的方向之间的距离，高精度地计算物体的位置通过三角测量方法对象的一部分，并输出计算的数据或计算数据。在第二模式中，以与现有的三角测量方法相同的方式，根据照射角度和接收角度来计算物体的一部分的位置。在不使用照射角度信息来计算位置的第一模式中。

17. 发明授权

US6049385A Three dimensional measurement system and pickup apparatus 失效
标题翻译：三维测量系统和拾取装置
公开(公告)号：US6049385A
公开(公告)日：2000-04-11
申请号：US867877
申请日：1997-06-04
申请人： Toshio Norita , Hiroshi Uchino , Takuto Joko , Eiichi Ide
发明人： Toshio Norita , Hiroshi Uchino , Takuto Joko , Eiichi Ide
IPC分类号： G01S7/487 , G01S7/491 , G01S17/42 , G01S17/89 , G01B11/24
CPC分类号： G01S7/487 , G01S17/42 , G01S17/48 , G01S17/89 , G01S7/4918
摘要： In a three dimensional measurement system, a three dimensional pickup apparatus picks up an object repeatedly to generate image information including a shape of the object, and an information processor receives image frame signals and digital signals from the pickup apparatus to process the image information. Image information is sent as image frame signals through a first output terminal, and digital signals are sent through a second output terminal in correspondence to output of the image information through the first output terminal. In the information processor, an input controller receives the digital signals from the first output terminal and receives the image frame signals suitable for transmission of moving images in correspondence to the received digital signals from the second output terminal. For example, the pickup conditions for a next period are set based on the pickup information obtained in a current period. For example, a distance sensor is provided further to adjust the pickup conditions in various ways in continuous pickup mode.
摘要翻译：在三维测量系统中，三维拾取装置重复地拾取对象以产生包括对象的形状的图像信息，并且信息处理器从拾取装置接收图像帧信号和数字信号以处理图像信息。图像信息通过第一输出端子作为图像帧信号发送，并且通过第一输出端子对应于图像信息的输出，通过第二输出端子发送数字信号。在信息处理器中，输入控制器接收来自第一输出端的数字信号，并根据来自第二输出端的接收到的数字信号接收适于传输运动图像的图像帧信号。例如，基于在当前周期中获得的拾取信息来设定下一个周期的拾取条件。例如，距离传感器被进一步设置以在连续拾取模式下以各种方式调节拾取条件。

18. 发明授权

US08952525B2 Semiconductor module and method for manufacturing semiconductor module 有权
标题翻译：半导体模块及半导体模块制造方法
公开(公告)号：US08952525B2
公开(公告)日：2015-02-10
申请号：US13983291
申请日：2011-03-04
申请人： Eiichi Ide , Takeshi Tokuyama , Nobutake Tsuyuno , Kinya Nakatsu , Tokihito Suwa , Yuujiro Kaneko
发明人： Eiichi Ide , Takeshi Tokuyama , Nobutake Tsuyuno , Kinya Nakatsu , Tokihito Suwa , Yuujiro Kaneko
IPC分类号： H01L23/367 , H01L21/52 , H01L23/36 , H01L23/42 , H01L23/495 , H01L23/433 , H01L23/31 , H01L23/00 , H01L23/373
CPC分类号： H01L23/3675 , H01L21/52 , H01L23/3107 , H01L23/36 , H01L23/3735 , H01L23/42 , H01L23/433 , H01L23/473 , H01L23/49575 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/33 , H01L2224/33181 , H01L2224/40137 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2224/73265 , H01L2924/014 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K7/20927 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions.
摘要翻译：半导体模块包括壳体，该壳体包括由框架部分形成的容纳空间以及设置成彼此面对的壁对部分。壁部包括散热部和在框架部分处支撑散热部的支撑壁，壁部包括散热部和支撑壁，该支撑壁在框架部分处支撑散热部。设置在壁部的散热部分别设置成面对多个半导体器件块。多个单独的散热部被支撑壁包围，支撑壁变形为通过壳体内部的分离的散热部从框架部分凹陷，使得多个绝缘片紧密接合到多个引线框架和多个散热部分。

19. 发明授权

US08847374B2 Power semiconductor module and manufacturing method thereof 有权
标题翻译：功率半导体模块及其制造方法
公开(公告)号：US08847374B2
公开(公告)日：2014-09-30
申请号：US13818490
申请日：2011-09-05
申请人： Eiichi Ide , Shinji Hiramitsu , Hiroshi Hozoji , Nobutake Tsuyuno , Kinya Nakatsu , Takeshi Tokuyama , Akira Matsushita , Yusuke Takagi
发明人： Eiichi Ide , Shinji Hiramitsu , Hiroshi Hozoji , Nobutake Tsuyuno , Kinya Nakatsu , Takeshi Tokuyama , Akira Matsushita , Yusuke Takagi
IPC分类号： H01L23/06 , H01L21/48 , H01L23/495 , H01L23/36 , H01L23/34 , H01L23/00 , H01L23/433 , H01L23/492 , H01L25/18 , H01L25/07
CPC分类号： H01L23/34 , H01L21/4825 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/492 , H01L23/49524 , H01L23/49575 , H01L24/29 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L25/072 , H01L25/18 , H01L2224/29111 , H01L2224/32245 , H01L2224/32503 , H01L2224/33 , H01L2224/33181 , H01L2224/3521 , H01L2224/37013 , H01L2224/37124 , H01L2224/37147 , H01L2224/37639 , H01L2224/37644 , H01L2224/37655 , H01L2224/40137 , H01L2224/48091 , H01L2224/4847 , H01L2224/48472 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/1306 , H01L2924/1305 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/01047 , H01L2924/01029
摘要： A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes. If there is an projection from a perpendicular direction by one of the main surfaces of the power semiconductor element, the second protrusion section is formed so that the projecting section on a specified side of the second protrusion surface overlaps the projecting section of the step section formed between the base section of the first conductor plate and the first protrusion section. The plural control electrodes on the power semiconductor element are formed along the specified side of the second protrusion surface.
摘要翻译：功率半导体模块包括在一个主表面上形成有多个控制电极的功率半导体元件，通过第一焊料材料连接到功率半导体元件的主表面之一的第一导体板和第二导体板通过第二焊料材料在功率半导体元件的另一个主表面上接合。在第一导体板上形成有从可应用的第一导体板的基部突出并且包括形成在上侧的第一突起表面的第一突出部。第二突起部分，包括形成在与功率半导体元件的主表面相对的一个表面上的第二突起表面。第一焊料材料插入在功率半导体元件和第一导体板之间，同时避免多个控制电极。如果通过功率半导体元件的一个主面从垂直方向突出，则第二突起部形成为使得第二突起表面的特定侧的突出部与形成的台阶部的突出部重叠在第一导体板的基部与第一突起部之间。功率半导体元件上的多个控制电极沿第二突出面的规定侧形成。

20. 发明授权

US08821676B2 Low temperature bonding material comprising coated metal nanoparticles, and bonding method 有权
标题翻译：包含金属纳米颗粒的低温粘合材料和粘合方法
公开(公告)号：US08821676B2
公开(公告)日：2014-09-02
申请号：US13099394
申请日：2011-05-03
申请人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
发明人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
IPC分类号： B29C65/02 , B32B5/02 , B32B5/16
CPC分类号： H05K3/321 , B22F1/0014 , B22F1/0062 , B22F3/14 , B22F2003/145 , B23K35/22 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/40 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/83 , H01L25/072 , H01L2224/29007 , H01L2224/29101 , H01L2224/2919 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/32225 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/2076 , H05K2201/0224 , H05K2201/0257 , H05K2201/0266 , Y10T428/12028 , Y10T428/12181 , Y10T428/2991 , Y10T428/8305 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2224/83205 , H01L2924/00012
摘要： A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
摘要翻译：一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分，基于体积基数具有至少峰值分布的部分。本公开还涉及使用接合材料的接合方法。

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