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11. 发明授权

US07143644B2 Device for collecting statistical data for maintenance of small-arms 失效
标题翻译：用于收集维持小型武器的统计数据的装置
公开(公告)号：US07143644B2
公开(公告)日：2006-12-05
申请号：US10999181
申请日：2004-11-29
申请人： Eric Arthur Johnson , Joseph Duane Kulesza , Eric VanEvery
发明人： Eric Arthur Johnson , Joseph Duane Kulesza , Eric VanEvery
IPC分类号： G01L5/14
CPC分类号： F41A19/01
摘要： A system and method for collecting data on small-arms usage in the form of a device which is mounted to the firearm so as to be able to sense at least an impulse in the firearm due to firing. The device is mounted to the gun so as to detect impulses due to firing. A processor accepts impulse signals from the sensor, and uses either a hold-off delay or a windowing time to determine and store information related to the firing of the firearm. This information may be any combination of temperature, firing rate, firing intervals and time data for subsequent analysis, and, optionally, information identifying the weapon to which the device is attached. The device preferably has an interface to transfer data from the device to a computer or other data collection device.
摘要翻译：一种用于以装置形式收集关于小型武器使用的数据的系统和方法，所述装置安装在枪支上，以便能够至少感测由于射击而在枪支中的脉冲。该装置安装到枪上以便检测由于点火而产生的脉冲。处理器接收来自传感器的脉冲信号，并使用延迟延迟或窗口时间来确定和存储与火器射击有关的信息。该信息可以是用于后续分析的温度，燃烧速率，燃烧间隔和时间数据的任何组合，以及可选地，识别装置所附着的武器的信息。该设备优选地具有将数据从设备传送到计算机或其他数据收集设备的接口。

12. 发明授权

US07100437B2 Device for collecting statistical data for maintenance of small-arms 失效
标题翻译：用于收集维持小型武器的统计数据的装置
公开(公告)号：US07100437B2
公开(公告)日：2006-09-05
申请号：US10720778
申请日：2003-11-24
申请人： Eric Arthur Johnson , Joseph Duane Kulesza
发明人： Eric Arthur Johnson , Joseph Duane Kulesza
IPC分类号： G01L5/14
CPC分类号： F41A19/01
摘要： A device for collecting data on small-arms usage that senses when a shot has been fired from a gun using its acceleration, acoustic noise or RF emissions; measures the interval between shots so that the firing rate may be determined; measures the time at which each shot has been fired; measures the temperature of the barrel when each shot is fired; stores any combination of temperature, firing rate, firing intervals and time data for subsequent analysis and has an electrical interface to transfer data from the device to a computer or other data collection device.
摘要翻译：用于收集关于小武器使用的数据的装置，其使用其加速度，声学噪声或RF发射来感测枪从何时射出; 测量射击之间的间隔，以便确定燃烧速率; 测量每次射击的时间; 每次射击时测量枪管的温度; 存储温度，点火速率，点火间隔和时间数据的任何组合用于后续分析，并具有将数据从设备传输到计算机或其他数据采集设备的电接口。

13. 发明授权

US06495771B2 Compliant multi-layered circuit board for PBGA applications 失效
标题翻译：符合PBGA应用的多层电路板
公开(公告)号：US06495771B2
公开(公告)日：2002-12-17
申请号：US09820563
申请日：2001-03-29
申请人： Michael Anthony Gaynes , Eric Arthur Johnson
发明人： Michael Anthony Gaynes , Eric Arthur Johnson
IPC分类号： H05K103
CPC分类号： H05K3/462 , H01L23/49833 , H01L2224/16225 , H01L2924/00014 , H01L2924/15311 , H05K1/0272 , H05K3/28 , H05K3/321 , H05K3/4623 , H05K3/4697 , H05K2201/09536 , Y10T29/49126 , H01L2224/0401
摘要： A electronic package is constituted of a compliant multi-layered circuit board or printed circuit board package, particularly for use in ball grid array (BGA) applications wherein two or possibly greater numbers of naturally spaced sub-composites are equipped with electronic circuitry which is interconnected through the intermediary of conductive adhesives. Pursuant to a method of producing, no other mechanical connection is provided intermediate these spaced sub-composites except, possibly, along the periphery of the structure thereof, where a molded plastic seal may be provided in order to form a protection against the ingress environmental or external influences. The unfilled void, space or interspatial volume which is present between the spaced sub-composite facilitates the deformation in shear of the conductive adhesive interconnections, such as epoxy resins or the like, with extremely little constraint of the various components.
摘要翻译：电子封装由兼容的多层电路板或印刷电路板封装构成，特别是用于球栅阵列（BGA）应用中，其中两个或可能更多数量的自然间隔的子复合材料配备有互连的电子电路通过导电胶的中介。根据生产方法，除了可能沿着其结构的周边之外，在这些间隔的子复合材料之间没有提供其它机械连接，其中可以提供模制塑料密封件，以形成防止侵入环境或外部影响存在于间隔的副复合物之间的未填充的空隙，空间或空间体积有助于导电粘合剂互连（例如环氧树脂等）的剪切变形，对各种组分的限制非常小。

14. 发明授权

US06490161B1 Peripheral land grid array package with improved thermal performance 失效
标题翻译：具有改善热性能的外围平台阵列封装
公开(公告)号：US06490161B1
公开(公告)日：2002-12-03
申请号：US10042500
申请日：2002-01-08
申请人： Eric Arthur Johnson
发明人： Eric Arthur Johnson
IPC分类号： H05K720
CPC分类号： H01L23/433 , H01L23/4006 , H01L2924/0002 , H05K1/0204 , H05K3/325 , H01L2924/00
摘要： A flip-chip module is interconnected to a PCB or circuit card through a peripheral LGA interposer connector. The flip-chip is mounted on the same surface of the module substrate as the peripheral array of LGA interconnection pads and projects into a central opening of the interposer. An opening in the upper stiffener of the PCB or circuit card permits the peripheral array of LGA interconnection pads to make contact with corresponding LGA PCB or circuit card pads. A first heat sink is arranged to thermally contact the entire surface of the substrate opposing the surface upon which the flip-chip is mounted. An opening in the PCB or circuit card and lower stiffener allows a second heat sink to make thermal contact with the surface of the flip-chip.
摘要翻译：倒装芯片模块通过外围LGA插入器连接器与PCB或电路卡互连。倒装芯片安装在模块基板的与LGA互连焊盘的外围阵列相同的表面上并投影到插入器的中心开口中。 PCB或电路卡的上加强件中的开口允许LGA互连焊盘的外围阵列与相应的LGA PCB或电路卡焊盘接触。布置第一散热器以使与基板相反的表面的整个表面热接触，所述表面上安装有倒装芯片。 PCB或电路卡和下加强件中的开口允许第二散热器与倒装芯片的表面进行热接触。

15. 再颁专利

USRE39426E1 Thermally enhanced flip chip package and method of forming 有权
标题翻译：热增强倒装芯片封装及成型方法
公开(公告)号：USRE39426E1
公开(公告)日：2006-12-12
申请号：US09379985
申请日：1999-08-24
申请人： Eric Arthur Johnson
发明人： Eric Arthur Johnson
IPC分类号： H01L21/44
CPC分类号： H01L23/3128 , H01L23/4334 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/15311 , H01L2924/00
摘要： A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip-chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.
摘要翻译：导热平面构件与封装在介电材料内的倒装芯片导热连通，所述电介质材料围绕所述导热平面构件，所述倒装芯片以及衬底构件的预定部分。本发明提供一种具有拾取和放置能力的倒装芯片封装，而没有封装芯片封装的热阻缺点。

16. 发明授权

US06373703B1 Integral design features for heatsink attach for electronic packages 有权
公开(公告)号：US06373703B1
公开(公告)日：2002-04-16
申请号：US09753642
申请日：2001-01-03
申请人： Eric Arthur Johnson , Stephen John Kosteva , Stephen Wesley MacQuarrie
发明人： Eric Arthur Johnson , Stephen John Kosteva , Stephen Wesley MacQuarrie
IPC分类号： H05K720
摘要： An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.

17. 发明授权

US5969947A Integral design features for heatsink attach for electronic packages 失效
公开(公告)号：US5969947A
公开(公告)日：1999-10-19
申请号：US991903
申请日：1997-12-17
申请人： Eric Arthur Johnson , Stephen John Kosteva , Stephen Wesley MacQuarrie
发明人： Eric Arthur Johnson , Stephen John Kosteva , Stephen Wesley MacQuarrie
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161
摘要： An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.

18. 发明授权

US5883430A Thermally enhanced flip chip package 失效
标题翻译：热增强倒装芯片封装
公开(公告)号：US5883430A
公开(公告)日：1999-03-16
申请号：US842417
申请日：1997-04-24
申请人： Eric Arthur Johnson
发明人： Eric Arthur Johnson
IPC分类号： H01L23/12 , H01L21/60 , H01L23/31 , H01L23/433 , H01L23/10 , H01L23/34 , H01L23/48 , H01L23/52
CPC分类号： H01L24/81 , H01L23/3128 , H01L23/4334 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81801 , H01L2924/01004 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/181
摘要： A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.
摘要翻译：导热平面构件与封装在介电材料内的倒装芯片导热连通，所述电介质材料围绕导热平面构件，倒装芯片以及衬底构件的预定部分。本发明提供一种具有拾取和放置能力的倒装芯片封装，而没有封装芯片封装的热阻缺点。

19. 发明授权

US5760465A Electronic package with strain relief means 失效
标题翻译：带应变消除装置的电子封装
公开(公告)号：US5760465A
公开(公告)日：1998-06-02
申请号：US595108
申请日：1996-02-01
申请人： David James Alcoe , Steven Wayne Anderson , Yifan Guo , Eric Arthur Johnson
发明人： David James Alcoe , Steven Wayne Anderson , Yifan Guo , Eric Arthur Johnson
IPC分类号： H01L21/60 , H01L23/12 , H01L23/13 , H01L23/16 , H01L23/373 , H01L23/495 , H01L23/498
CPC分类号： H01L24/50 , H01L23/13 , H01L23/16 , H01L23/49572 , H01L23/49816 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01082 , H01L2924/15787 , H01L2924/351
摘要： An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.
摘要翻译：包括柔性基板，加强件和芯片的电子封装。芯片被粘合到衬底上，固定到加强件上。应变消除装置用于包装中的各个位置，以防止与包装件的各种元件之间的热膨胀系数相对较大差异相关的问题（例如带子“起皱”）。

20. 发明授权

US07038470B1 Parallel-plate capacitive element for monitoring environmental parameters in concrete 失效
标题翻译：平行电容元件，用于监测混凝土中的环境参数
公开(公告)号：US07038470B1
公开(公告)日：2006-05-02
申请号：US10878690
申请日：2004-06-28
申请人： Eric Arthur Johnson
发明人： Eric Arthur Johnson
IPC分类号： G01R27/26
CPC分类号： G01N33/383 , G01N27/226
摘要： The invention provides a sensor for monitoring an environmental parameter in concrete including an enclosure; a detecting device connected to the enclosure for a detecting at least one environmental parameter in concrete, wherein the detecting device includes at least one capacitive element; an active material connected to the enclosure, wherein the active material is liable to respond to the environmental parameter and is operably connected to the capacitive element; a RFID chip mounted within the enclosure and operably connected to the detecting device; and an antenna operably connected to the RFID chip and the detecting device, wherein the antenna is part of an L-R-C circuit whose resonance frequency shifts within an assigned frequency band. The invention also provides a MEMS-based capacitive element that responds to an environmental parameter in concrete. The invention further provides a method of forming a MEMS-based capacitive element.
摘要翻译：本发明提供了一种用于监测混凝土中的环境参数的传感器，包括外壳; 连接到所述外壳的用于检测混凝土中的至少一个环境参数的检测装置，其中所述检测装置包括至少一个电容元件; 连接到所述外壳的活性材料，其中所述活性材料易于响应于所述环境参数并且可操作地连接到所述电容元件; 安装在所述外壳内且可操作地连接到所述检测装置的RFID芯片; 以及天线，其可操作地连接到所述RFID芯片和所述检测装置，其中所述天线是共振频率在指定频带内移动的L-R-C电路的一部分。本发明还提供了一种基于MEMS的电容元件，其响应于混凝土中的环境参数。本发明还提供一种形成基于MEMS的电容元件的方法。

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