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11. 发明申请

US20120142136A1 WAFER LEVEL PACKAGING PROCESS FOR MEMS DEVICES 审中-公开
标题翻译： MEMS器件的WAFER LEVEL PACKAGING PROCESS
公开(公告)号：US20120142136A1
公开(公告)日：2012-06-07
申请号：US12957928
申请日：2010-12-01
申请人： Robert D. Horning , Jeff A. Ridley
发明人： Robert D. Horning , Jeff A. Ridley
IPC分类号： H01L31/18
CPC分类号： B81C1/00301 , B81B2201/0242 , B81B2207/095 , B81C2203/0118 , B81C2203/031
摘要： A process for packaging micro-electro-mechanical systems (MEMS) devices comprises providing a lower cover wafer and an upper cover wafer, providing a semiconductor wafer including a plurality of MEMS devices on a substrate layer, bonding the semiconductor wafer to a first surface of the lower cover wafer, and bonding a second surface of the upper cover wafer to the semiconductor wafer. The first surface of the lower cover wafer and the second surface of the upper cover wafer define a plurality of hermetically sealed cavity sections when bonded to the semiconductor wafer such that each of the MEMS devices is located inside one of the sealed cavity sections. A plurality of holes are formed that extend from the first surface of the upper cover wafer to the second surface of the upper cover wafer after the upper cover wafer is bonded to the semiconductor wafer. A metal lead layer is then deposited in each of the holes to provide an electrical connection with the MEMS devices.
摘要翻译：一种用于封装微机电系统（MEMS）器件的方法包括提供下盖晶片和上盖晶片，在衬底层上提供包括多个MEMS器件的半导体晶片，将半导体晶片接合到第一表面下盖晶片，并将上盖晶片的第二表面接合到半导体晶片。当与半导体晶片接合时，下盖晶片的第一表面和上盖晶片的第二表面限定多个密封的空腔部分，使得每个MEMS器件位于一个密封空腔部分内。在上盖晶片接合到半导体晶片之后，形成从上盖晶片的第一表面延伸到上盖晶片的第二表面的多个孔。然后在每个孔中沉积金属引线层以提供与MEMS器件的电连接。

12. 发明申请

US20120126881A1 MEMS SENSOR USING MULTI-LAYER MOVABLE COMBS 有权
标题翻译： MEMS传感器使用多层可移动COMBS
公开(公告)号：US20120126881A1
公开(公告)日：2012-05-24
申请号：US13301145
申请日：2011-11-21
申请人： Robert D. Horning , Ryan Supino
发明人： Robert D. Horning , Ryan Supino
IPC分类号： G05F3/02 , H01L29/84
CPC分类号： B81B3/0086 , B81B2201/025 , B81B2203/0136
摘要： A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs, wherein the proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one fixed anchor having a second plurality of combs. The first plurality of combs is interleaved with the second plurality of combs. Each of the combs in the first plurality of combs and the second plurality of combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that fringing electric fields are screened to reduce motion of the first plurality of combs along a sense axis due to the fringing electric fields.
摘要翻译： MEMS传感器包括基板和至少一个具有第一多个梳子的检测质量块，其中所述检测质量块经由一个或多个悬架梁耦合到所述基板，使得所述检验质量块和所述第一多个梳子是可移动的。 MEMS传感器还包括具有第二多个梳子的至少一个固定锚固件。第一组多个梳子与第二组梳子交错。第一多个梳子中的每个梳子和第二个多个梳子包括通过一个或多个非导电层彼此电隔离的多个导电层。每个导电层单独地耦合到相应的电位，使得边缘电场被屏蔽以由于边缘电场而沿着感测轴减小第一组多个梳的运动。

13. 发明申请

US20120059583A1 METHOD OF PERSONAL NAVIGATION USING STRIDE VECTORING 审中-公开
标题翻译：使用反向矢量的个人导航方法
公开(公告)号：US20120059583A1
公开(公告)日：2012-03-08
申请号：US13295218
申请日：2011-11-14
申请人： Ryan Supino , Robert D. Horning
发明人： Ryan Supino , Robert D. Horning
IPC分类号： G01C21/20 , G01C21/00
CPC分类号： G01C21/16 , G01S1/72 , G01S5/186 , G01S5/26
摘要： A method of error compensation for an inertial measurement unit is provided. The method comprises providing a first object including an inertial measurement unit, providing a second object proximal to the first object, and determining an initial position and orientation of the first object. A motion update is triggered for the inertial measurement unit when the second object is stationary with respect to a ground surface. At least one position vector is measured between the first object and the second object when the first object is in motion and the second object is stationary. A distance, direction, and orientation of the second object with respect to the first object are calculated using the at least one position vector. An error correction is then determined for the inertial measurement unit from the calculated distance, direction, and orientation of the second object with respect to the first object.
摘要翻译：提供了惯性测量单元的误差补偿方法。该方法包括提供包括惯性测量单元的第一对象，提供靠近第一对象的第二对象，以及确定第一对象的初始位置和取向。当第二物体相对于地面静止时，对于惯性测量单元触发运动更新。当第一物体运动并且第二物体静止时，在第一物体和第二物体之间测量至少一个位置矢量。使用至少一个位置矢量来计算第二对象相对于第一对象的距离，方向和方向。然后根据计算出的第二物体相对于第一物体的距离，方向和取向来确定惯性测量单元的纠错。

14. 发明申请

US20090326795A1 METHOD OF PERSONAL NAVIGATION USING STRIDE VECTORING 有权
标题翻译：使用反向矢量的个人导航方法
公开(公告)号：US20090326795A1
公开(公告)日：2009-12-31
申请号：US12019368
申请日：2008-01-24
申请人： Ryan Supino , Robert D. Horning
发明人： Ryan Supino , Robert D. Horning
IPC分类号： G01C21/00 , G06F19/00 , G01P21/00
CPC分类号： G01C21/16 , G01S1/72 , G01S5/186 , G01S5/26
摘要： A method of error compensation for an inertial measurement unit is provided. The method comprises providing a first object including an inertial measurement unit, providing a second object proximal to the first object, and determining an initial position and orientation of the first object. A motion update is triggered for the inertial measurement unit when the second object is stationary with respect to a ground surface. At least one position vector is measured between the first object and the second object when the first object is in motion and the second object is stationary. A distance, direction, and orientation of the second object with respect to the first object are calculated using the at least one position vector. An error correction is then determined for the inertial measurement unit from the calculated distance, direction, and orientation of the second object with respect to the first object.
摘要翻译：提供了惯性测量单元的误差补偿方法。该方法包括提供包括惯性测量单元的第一对象，提供靠近第一对象的第二对象，以及确定第一对象的初始位置和取向。当第二物体相对于地面静止时，对于惯性测量单元触发运动更新。当第一物体运动并且第二物体静止时，在第一物体和第二物体之间测量至少一个位置矢量。使用至少一个位置矢量来计算第二对象相对于第一对象的距离，方向和方向。然后根据计算出的第二物体相对于第一物体的距离，方向和取向来确定惯性测量单元的纠错。

15. 发明授权

US07396698B2 Methods and systems for providing MEMS devices with a top cap and upper sense plate 有权
标题翻译：用于向MEMS器件提供顶盖和上感测板的方法和系统
公开(公告)号：US07396698B2
公开(公告)日：2008-07-08
申请号：US11323233
申请日：2005-12-30
申请人： Robert D. Horning , Jeffrey A. Ridley
发明人： Robert D. Horning , Jeffrey A. Ridley
IPC分类号： H01L21/00
CPC分类号： B81B7/007 , B81B2201/0242 , B81C2203/0118
摘要： A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.
摘要翻译：描述了一种用于制造具有顶盖和上感测板的MEMS器件的方法。该方法包括制造包括蚀刻的衬底，蚀刻的MEMS器件部件和互连金属的器件晶片，互连金属的一部分是接合焊盘，并将金属环绕层添加到前侧的边缘和一部分的器件晶片。该方法还包括制造包括蚀刻衬底和互连金属的上晶片，结合器件晶片和上晶片，以及将结合的上晶片和器件晶片切割成单个MEMS器件。

16. 发明授权

US07258010B2 MEMS device with thinned comb fingers 有权
标题翻译：具有减薄梳齿的MEMS器件
公开(公告)号：US07258010B2
公开(公告)日：2007-08-21
申请号：US11076193
申请日：2005-03-09
申请人： Robert D. Horning , Mark W. Weber , Burgess R. Johnson
发明人： Robert D. Horning , Mark W. Weber , Burgess R. Johnson
IPC分类号： G01P15/125 , G01P9/04
CPC分类号： H02N1/008
摘要： Methods of fabricating thinned comb MEMS devices are disclosed. A comb drive device in accordance with an illustrative embodiment of the present invention can include a number of interdigitated comb fingers some of which have a reduced thickness along at least a portion of their length relative to other comb fingers.
摘要翻译：公开了制造薄化梳状MEMS器件的方法。根据本发明的说明性实施例的梳子驱动装置可以包括多个叉指梳状梳，其中一些梳状指相对于其它梳指沿其长度的至少一部分具有减小的厚度。

17. 发明授权

US06411013B1 Microactuator array with integrally formed package 失效
标题翻译：具有整体封装的微致动器阵列
公开(公告)号：US06411013B1
公开(公告)日：2002-06-25
申请号：US09476667
申请日：1999-12-30
申请人： Robert D. Horning
发明人： Robert D. Horning
IPC分类号： H01L4108
CPC分类号： H02N1/006 , Y10S310/80
摘要： A microactuator array with an integrally formed package is disclosed. Because the package is made from the same material and at the same time as the actuator itself, no extra time or cost is associated with packaging. In addition, it is contemplated that the package may be configured to provide all the necessary interconnections and leads for addressing and distributing power to the various layers in the microactuator stack. Thus, no additional steps or cost are associated with electrical interconnection.
摘要翻译：公开了具有整体形成的封装的微致动器阵列。因为包装是由相同的材料制成的，并且与执行器本身同时，所以没有额外的时间或成本与包装相关联。此外，可以设想，封装可以被配置为提供用于寻址和分配功率到微致动器堆叠中的各个层的所有必要的互连和引线。因此，没有额外的步骤或成本与电互连相关联。

18. 发明授权

US5550373A Fabry-Perot micro filter-detector 失效
标题翻译：法布里 - 珀罗微滤器检测器
公开(公告)号：US5550373A
公开(公告)日：1996-08-27
申请号：US367491
申请日：1994-12-30
申请人： Barrett E. Cole , Bernard S. Fritz , Robert D. Horning
发明人： Barrett E. Cole , Bernard S. Fritz , Robert D. Horning
IPC分类号： B81B1/00 , G01J3/26 , G01J3/28 , G01J5/20 , G02B26/00 , G01B9/02 , G01J3/45
CPC分类号： G01J3/2823 , G01J3/02 , G01J3/0208 , G01J3/0256 , G01J3/26 , G01J5/20 , G02B26/001
摘要： A monolithically constructed infrared, tunable Fabry-Perot cavity filter-detector for spectroscopic detection of particular substances having an absorption line in the wavelength range from 2 to 12 microns. The filter-detector has a hermetically sealed Fabry-Perot cavity that has a mirror which has an adjustable distance relative to another mirror of the cavity. The former mirror is adjusted by piezoelectric film on the mirror support or with piezoelectric stacks or wall supporting the mirror. There may be electrodes situated near the mirrors for capacitive sensing of the distance between the mirrors. Light to be filtered and detected comes in through a window wafer which may have diffractive or refractive microlenses, plus an optional spatial filter. After passing through the window wafer, the light is filtered by the tunable mirrors of the Fabry-Perot cavity. The portion of the light that is passed by the cavity is detected by an infrared microbolometer or a CCD array. The cavity and detector are hermetically sealed in a vacuum.
摘要翻译：用于光谱检测具有2至12微米波长范围内的吸收线的特定物质的单片构造的红外可调谐法布里 - 珀罗腔滤波器检测器。过滤器检测器具有气密密封的法布里 - 珀罗腔，其具有相对于空腔的另一反射镜具有可调距离的反射镜。前镜由反射镜支架上的压电膜或支撑镜子的压电叠层或墙壁调节。可能存在位于反射镜附近的用于电容感测反射镜之间的距离的电极。要过滤和检测的光通过可能具有衍射或折射微透镜的窗玻璃加上可选的空间滤光片进入。通过窗玻璃后，光被法布里 - 珀罗腔的可调镜过滤。由空腔通过的光的部分由红外微辐射热计或CCD阵列检测。空腔和检测器在真空中气密密封。

19. 发明申请

US20120272731A1 TWO DEGREE OF FREEDOM DITHERING PLATFORM FOR MEMS SENSOR CALIBRATION 有权
标题翻译：用于MEMS传感器校准的自由度平台的两个程度
公开(公告)号：US20120272731A1
公开(公告)日：2012-11-01
申请号：US13345132
申请日：2012-01-06
申请人： Ryan Supino , Eugen Cabuz , Burgess R. Johnson , Robert D. Horning
发明人： Ryan Supino , Eugen Cabuz , Burgess R. Johnson , Robert D. Horning
IPC分类号： G01C19/56 , H05K13/00 , G01P15/13
CPC分类号： B81C1/00134 , B81B2201/03 , B81C2203/03 , G01D5/34 , G01P21/00 , Y10T29/49002
摘要： Systems and methods for two degree of freedom dithering for micro-electromechanical system (MEMS) sensor calibration are provided. In one embodiment, a method for a device comprises forming a MEMS sensor layer, the MEMS sensor layer comprising a MEMS sensor and an in-plane rotator to rotate the MEMS sensor in the plane of the MEMS sensor layer. Further, the method comprises forming a first and second rotor layer and bonding the first rotor layer to a top surface and the second rotor layer to the bottom surface of the MEMS sensor layer, such that a first and second rotor portion of the first and second rotor layers connect to the MEMS sensor. Also, the method comprises separating the first and second rotor portions from the first and second rotor layers, wherein the first and second rotor portions and the MEMS sensor rotate about an in-plane axis of the MEMS sensor layer.
摘要翻译：提供了用于微机电系统（MEMS）传感器校准的两自由度抖动的系统和方法。在一个实施例中，用于器件的方法包括形成MEMS传感器层，所述MEMS传感器层包括MEMS传感器和面内旋转器以在MEMS传感器层的平面内旋转MEMS传感器。此外，该方法包括形成第一转子层和第二转子层，并将第一转子层结合到顶表面，将第二转子层结合到MEMS传感器层的底表面，使得第一和第二转子部分的第一和第二转子部分转子层连接到MEMS传感器。此外，该方法包括从第一和第二转子层分离第一和第二转子部分，其中第一和第二转子部分和MEMS传感器围绕MEMS传感器层的面内轴线旋转。

20. 发明申请

US20120130671A1 VIBRATION ISOLATION INTERPOSER DIE 有权
标题翻译：振动隔离阀
公开(公告)号：US20120130671A1
公开(公告)日：2012-05-24
申请号：US13299485
申请日：2011-11-18
申请人： Robert D. Horning , Ryan Supino
发明人： Robert D. Horning , Ryan Supino
IPC分类号： G01P15/02 , F16F7/00 , G06F15/00
CPC分类号： B81B7/0016 , B81B2201/025 , B81B2207/07
摘要： In an example, an interposer chip is provided. The interposer chip includes a base portion and a chip mounting portion. The interposer chip also includes one or more flexures connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections extends from the base portion towards the chip mounting portion, and a second plurality of projections extends from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.
摘要翻译：在一个示例中，提供了插入器芯片。插入片包括基部和芯片安装部。插入器芯片还包括将基部连接到芯片安装部分的一个或多个挠曲件。此外，第一多个突起从基部朝向芯片安装部分延伸，并且第二多个突起从芯片安装部分朝向基部延伸并延伸到由第一多个突起形成的间隙中。

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