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    • 11. 发明授权
    • Semiconductor light-emitting element, method of manufacturing same, and light-emitting device
    • 半导体发光元件及其制造方法以及发光元件
    • US08395173B2
    • 2013-03-12
    • US13126525
    • 2009-10-28
    • Akihiko MuraiHiroshi Fukshima
    • Akihiko MuraiHiroshi Fukshima
    • H01L33/38H01L33/42H01L33/48
    • H01L33/22H01L33/0079H01L33/20H01L33/38H01L33/405H01L33/507
    • A semiconductor light-emitting element, a method of manufacturing same, and a light-emitting device enabling an increase in light emission efficiency is provided. The semiconductor light-emitting element 1 in accordance with the present invention includes: a light-emitting layer 2 having a laminated structure in which a p-type GaN film 24 and an n-type GaN film 22 are included; a conductive hexagonal pyramidal base 3 formed from ZnO and mounting with the light-emitting layer on a bottom surface 31; an anode 5 joined to the bottom surface 31 of the base 3 at a position apart from the light-emitting layer 2; and a cathode 4 mounted on the light-emitting layer 2. In the semiconductor light-emitting element 1, the p-type GaN film 24 is joined to the bottom surface 31 of the base 3, and the cathode 4 is joined to an N-polar plane of the n-type GaN film 22, said N-polar plane of the n-type GaN film 22 being an opposite side to the p-type GaN film 24. In the semiconductor light-emitting element 1, the N-polar plane of the n-type GaN film 22 has a fine peak-valley structure 22c outside a portion joined to the cathode 4.
    • 提供了半导体发光元件及其制造方法以及能够提高发光效率的发光元件。 根据本发明的半导体发光元件1包括:具有p型GaN膜24和n型GaN膜22的层叠结构的发光层2; 由ZnO形成的导电六角锥形基座3,并且在底面31上与发光层一起安装; 在离开发光层2的位置处接合到基座3的底面31的阳极5; 以及安装在发光层2上的阴极4.在半导体发光元件1中,p型GaN膜24与基体3的底面31接合,阴极4与N n型GaN膜22的极性面,n型GaN膜22的N极平面与p型GaN膜24相反。在半导体发光元件1中, n型GaN膜22的极性面在与阴极4接合的部分的外侧具有微细的峰谷结构22c。
    • 14. 发明授权
    • Semiconductor light emitting device including anode and cathode having the same metal structure
    • 包括具有相同金属结构的阳极和阴极的半导体发光器件
    • US08536585B2
    • 2013-09-17
    • US13125294
    • 2009-10-09
    • Akihiko Murai
    • Akihiko Murai
    • H01L27/15
    • H01L33/32H01L33/007H01L33/02H01L33/20
    • A semi-conductor light emitting device 10 in the present invention comprises an n-type ZnO substrate 3, an emission layer 2, anode 5, and cathode 4. The n-type ZnO substrate 3 has a mounting surface 31 on one of its surfaces. The emission layer 2 is composed of a p-type GaN film 24 and an n-type GaN film 22, and superimposed on the n-type ZnO substrate 3 with the p-type GaN film 24 directly disposed on the mounting surface 31 of the n-type ZnO substrate 3. The anode 5 is disposed directly on the mounting surface 31 of the n-type GaN substrate 3 in an ohmic contact therewith and in a spaced relation from the emission layer. The cathode 4 is disposed on the n-type GaN film 22 in an ohmic contact therewith. The cathode 4 and anode 5 are of the same structure solely composed of a metallic material. The semi-conductor light emitting device in the present invention assures good ohmic contact of both the cathode 4 and the anode 5, and minimizes consumption of metallic materials.
    • 本发明的半导体发光器件10包括n型ZnO衬底3,发射层2,阳极5和阴极4.N型ZnO衬底3在其一个表面上具有安装表面31 。 发射层2由p型GaN膜24和n型GaN膜22构成,并且叠层在n型ZnO基板3上,其中p型GaN膜24直接设置在 n型ZnO基板3.阳极5直接设置在n型GaN衬底3的安装表面31上,与其发射欧姆接触并且与发射层间隔开。 阴极4以与其形成欧姆接触的方式配置在n型GaN膜22上。 阴极4和阳极5具有与金属材料完全相同的结构。 本发明的半导体发光器件确保了阴极4和阳极5两者的良好的欧姆接触,并使金属材料的消耗最小化。
    • 15. 发明申请
    • LIGHT EMITTING DEVICE
    • 发光装置
    • US20110297989A1
    • 2011-12-08
    • US13201853
    • 2010-02-23
    • Akihiko MuraiMasaharu YasudaTomoya IwahashiKazuyuki Yamae
    • Akihiko MuraiMasaharu YasudaTomoya IwahashiKazuyuki Yamae
    • H01L33/60
    • H01L33/387H01L33/10H01L33/405H01L33/44H01L33/62H01L33/647H01L2924/0002H01L2924/00
    • The light emitting device comprises a mounting substrate and an LED chip which comprises an n-type nitride semiconductor layer, a nitride light emission layer on the n-type nitride semiconductor layer, p-type nitride semiconductor layer on the nitride light emission layer, an anode electrode opposite of the nitride light emission layer from the p-type nitride semiconductor layer, and a cathode electrode on the n-type nitride semiconductor layer. The mounting substrate has a patterned conductor which is connected to the cathode electrode through a bump and also connected to the anode electrode through a bump. The LED chip further comprises one or more dielectric layer between the p-type nitride semiconductor layer and the anode electrode to have an arrangement which resembles an island. The p-type nitride semiconductor layer has a first region which is overlapped with the bump. The dielectric layer is not formed within the first region.
    • 发光装置包括安装基板和LED芯片,其包括n型氮化物半导体层,n型氮化物半导体层上的氮化物发光层,氮化物发光层上的p型氮化物半导体层, 与p型氮化物半导体层的氮化物发光层相反的阳极电极以及n型氮化物半导体层上的阴极电极。 安装基板具有图案化的导体,其通过凸块连接到阴极电极,并且还通过凸块连接到阳极电极。 LED芯片还包括在p型氮化物半导体层和阳极之间的一个或多个介电层,以具有类似于岛的布置。 p型氮化物半导体层具有与凸块重叠的第一区域。 电介质层不形成在第一区域内。
    • 16. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING ELEMENT AND ILLUMINATING APPARATUS USING THE SAME
    • 使用相同的半导体发光元件和照明设备
    • US20110018024A1
    • 2011-01-27
    • US12933749
    • 2009-03-25
    • Hiroshi FukshimaKazuyuki YamaeMasaharu YasudaTomoya IwahashiAkihiko Murai
    • Hiroshi FukshimaKazuyuki YamaeMasaharu YasudaTomoya IwahashiAkihiko Murai
    • H01L33/60
    • H01L33/42H01L33/22H01L33/387H01L33/405H01L33/46
    • A semiconductor light emitting element, including: an n-type semiconductor layer having optical transparency with an emission wavelength of a light emitting layer, the light emitting layer and a p-type semiconductor layer, which are laminated; and a reflection film which is disposed on a side opposite to a surface from which light emitted from the light emitting layer is extracted, wherein the reflection film comprises: a transparent layer having optical transparency with the emission wavelength of the light emitting layer, and a metal layer, which is laminated on the transparent layer on a side opposite to the light emitting layer and is constituted by a metal material having a high reflectance, the transparent layer has a refractive index lower than a refractive index of a layer disposed on a side of the light emitting layer when viewed from the transparent layer, with the emission wavelength, and a thickness of the transparent layer is equal to or more than a value obtained by dividing a value of ¾ of the emission wavelength by the refractive index of the transparent layer.
    • 一种半导体发光元件,包括:层叠有具有发光层的发光波长的光学透明性的n型半导体层,发光层和p型半导体层; 以及反射膜,其设置在与从所述发光层发射的光的表面相反的一侧,所述反射膜包括:具有发光层的发光波长的光学透明性的透明层,以及 金属层,其层叠在与发光层相反的一侧的透明层上,由具有高反射率的金属材料构成,透明层的折射率低于设置在侧面的层的折射率 从透明层观察发光层的发光波长,并且透明层的厚度等于或大于通过将发射波长的¾的值除以透明层的折射率而获得的值 层。
    • 20. 发明授权
    • Semiconductor light emitting element and illuminating apparatus using the same
    • 半导体发光元件及其使用的照明装置
    • US08525204B2
    • 2013-09-03
    • US12933749
    • 2009-03-25
    • Hiroshi FukshimaKazuyuki YamaeMasaharu YasudaTomoya IwahashiAkihiko Murai
    • Hiroshi FukshimaKazuyuki YamaeMasaharu YasudaTomoya IwahashiAkihiko Murai
    • H01L33/00
    • H01L33/42H01L33/22H01L33/387H01L33/405H01L33/46
    • A semiconductor light emitting element, including: an n-type semiconductor layer having optical transparency with an emission wavelength of a light emitting layer, the light emitting layer and a p-type semiconductor layer, which are laminated; and a reflection film which is disposed on a side opposite to a surface from which light emitted from the light emitting layer is extracted, wherein the reflection film comprises: a transparent layer having optical transparency with the emission wavelength of the light emitting layer, and a metal layer, which is laminated on the transparent layer on a side opposite to the light emitting layer and is constituted by a metal material having a high reflectance, the transparent layer has a refractive index lower than a refractive index of a layer disposed on a side of the light emitting layer when viewed from the transparent layer, with the emission wavelength, and a thickness of the transparent layer is equal to or more than a value obtained by dividing a value of ¾ of the emission wavelength by the refractive index of the transparent layer.
    • 一种半导体发光元件,包括:层叠有具有发光层的发光波长的光学透明性的n型半导体层,发光层和p型半导体层; 以及反射膜,其设置在与从所述发光层发射的光的表面相反的一侧,所述反射膜包括:具有发光层的发光波长的光学透明性的透明层,以及 金属层,其层叠在与发光层相反的一侧的透明层上,由具有高反射率的金属材料构成,透明层的折射率低于设置在侧面的层的折射率 从透明层观察发光层的发光波长,并且透明层的厚度等于或大于通过将发射波长的¾的值除以透明层的折射率而获得的值 层。